High Efficiency Silicon Photonic Interconnects

Silicon photonic has provided an opportunity to enhance future processor speed by replacing copper interconnects with an on chip optical network. Although photonics are supposed to be efficient in terms of power consumption, speed, and bandwidth, the existing silicon photonic technologies involve problems limiting their efficiency. Examples of limitations to efficiency are transmission loss, coupling loss, modulation speed limited by electro-optical effect, large amount of energy required for thermal control of devices, and the bandwidth limit of existing optical routers. The objective of this dissertation is to investigate novel materials and methods to enhance the efficiency of silicon photonic devices. The first part of this dissertation covers the background, theory and design of on chip optical interconnects, specifically silicon photonic interconnects. The second part describes the work done to build a 300mm silicon photonic library, including its process flow, comprised of basic elements like electro-optical modulators, germanium detectors, Wavelength Division Multiplexing (WDM) interconnects, and a high efficiency grating coupler. The third part shows the works done to increase the efficiency of silicon photonic modulators, unitizing the χ(3) nonlinear effect of silicon nanocrystals to make DC Kerr effect electro-optical modulator, combining silicon with lithium niobate to make χ(2) electro-optical modulators on silicon, and increasing the efficiency of thermal control by incorporating micro-oven structures in electro-optical modulators. The fourth part introduces work done on dynamic optical interconnects including a broadband optical router, single photon level adiabatic wavelength conversion, and optical signal delay. The final part summarizes the work and talks about future development

Integration of high performance silicon optical modulators

We present our recent work on high speed silicon optical modulators developed within the UK silicon photonics and HELIOS projects. Examples of their integration with other photonic and electronic elements are also presented

Broadband energy-efficient optical modulation by hybrid integration of silicon nanophotonics and organic electro-optic polymer

Silicon-organic hybrid integrated devices have emerging applications ranging from high-speed optical interconnects to photonic electromagnetic-field sensors. Silicon slot photonic crystal waveguides (PCWs) filled with electro-optic (EO) polymers combine the slow-light effect in PCWs with the high polarizability of EO polymers, which promises the realization of high-performance optical modulators. In this paper, a broadband, power-efficient, low-dispersion, and compact optical modulator based on an EO polymer filled silicon slot PCW is presented. A small voltage-length product of V{\pi}*L=0.282Vmm is achieved, corresponding to an unprecedented record-high effective in-device EO coefficient (r33) of 1230pm/V. Assisted by a backside gate voltage, the modulation response up to 50GHz is observed, with a 3-dB bandwidth of 15GHz, and the estimated energy consumption is 94.4fJ/bit at 10Gbit/s. Furthermore, lattice-shifted PCWs are utilized to enhance the optical bandwidth by a factor of ~10X over other modulators based on non-band-engineered PCWs and ring-resonators.Comment: 12 pages, 4 figures, SPIE Photonics West Conference 201

Nanophotonic modulators and photodetectors using silicon photonic and plasmonic device concepts

Nanophotonic modulators and photodetectors are key building blocks for high-speed optical interconnects in datacom and telecom networks. Besides power efficiency and high electro-optic bandwidth, ultra-compact footprint and scalable co-integration with electronic circuitry are indispensable for highly scalable communication systems. In this paper, we give an overview on our recent progress in exploring nanophotonic modulators and photodetectors that combine the specific strengths of silicon photonic and plasmonic device concepts with hybrid integration approaches. Our work comprises electro-optic modulators that exploit silicon-organic hybrid (SOH) and plasmonic-organic hybrid (POH) integration to enable unprecedented energy efficiency and transmission speed, as well as waveguide-based plasmonic internal photo-emission detectors (PIPED) with record-high sensitivities and bandwidths

Heterogeneous Integrated Photonic Transceiver on Silicon

The demand for high-speed and low-cost short-distance data links, eventually for chip-level optical communication, has led to large efforts to develop high density photonics integrated circuits (PICs) to decrease the power consumption and unit price. Particularly, silicon based photonic integration promise future high-speed and cost-effective optical interconnects to enable exascale performance computers and datacenters. High-level integration of all photonics components on chip, including high speed modulators and photodetectors, and especially lasers, is required for scalable and energy efficient system topology designs. This is enabled by silicon-based heterogeneous integration approach, which transfers different material systems to the silicon substrate with a complementary metal–oxide–semiconductor (CMOS) compatible process. In this thesis, our work focuses on the development of silicon photonic integrated circuit in the applications of high speed chip level optical interconnects. A full library of functional devices is demonstrated on silicon, including low threshold distributed feedback (DFB) lasers as a low power laser source; high extinction ratio and high speed electroabsorption modulators (EAM) and ultra-linear Mach-Zehnder interferometer (MZI) modulators for signal modulation in the data transmitter; high speed photodetectors for the data receiver; and low loss silicon components, such as arrayed waveguide grating (AWG) routers and broadband MZI based switches. The design and characterization of those devices are discussed in this thesis. A highly integrated photonic circuit can be achieved with co-design and co-process of all types of functional photonic devices. Selective die bonding method is performed to integrate multiple III-V dies with different band-gap onto a single photonic die. A reconfigurable network-on-chip circuit was proposed and demonstrated, with state-of-the-art high-speed silicon transceiver chip. With over 400 active and passive components heterogeneously integrated on silicon, photonic circuit with multiple- wavelength-division multiplexing (WDM) transceiver nodes achieved a total capacity up to 8×8×40 Gbps. This high capacity and dense integrated heterogenous circuit shows its potential as a solution for future ultra-high speed inter- and intra-chip interconnects

GHz configurable photon pair generation from a silicon nonlinear interferometer

Low loss and high speed processing of photons is central to architectures for photonic quantum information. High speed switching enables non-deterministic photon sources and logic gates to be made deterministic, while the speed with which quantum light sources can be turned on and off impacts the clock rate of photonic computers and the data rate of quantum communication. Here we use lossy carrier depletion modulators in a silicon waveguide nonlinear interferometer to modulate photon pair generation at 1~GHz without exposing the generated photons to the phase dependent parasitic loss of the modulators. The super sensitivity of nonlinear interferometers reduces power consumption compared to modulating the driving laser. This can be a building block component for high speed programmabile, generalised nonlinear waveguide networks

Plasmonic-Organic and Silicon-Organic Hybrid Modulators for High-Speed Signal Processing

High-speed electro-optic (EO) modulators are key devices for optical communications, microwave photonics, and for broadband signal processing. Among the different material platforms for high-density photonic integrated circuits (PIC), silicon photonics sticks out because of CMOS foundries specialized in PIC fabrication. However, the absence of the Pockels effect in silicon renders EO modulators with high-efficiency and large modulation bandwidth difficult. In this dissertation, plasmonic and photonic slot waveguide modulators are investigated. The devices are built on the silicon platform and are combined with highly-efficient organic EO materials. Using such a hybrid platform, we realize compact and fast plasmonic-organic hybrid (POH) and silicon-organic hybrid (SOH) modulators. As an application example, we demonstrate for the first time an advanced terahertz communication link by directly converting data on a 360 GHz carrier to a data stream on an optical carrier. For optical transmitter applications, we overcome the bandwidth limitation of conventional SOH modulators by introducing a high-k dielectric microwave slotline for guiding the modulating radio-frequency signal which is capacitively-coupled to the EO modulating region. We confirm the viability of such capacitively-coupled SOH modulators by generating four-state pulse amplitude modulated signals with data rates up to 200 Gbit/s

Silicon optical modulators

Optical technology is poised to revolutionise short reach interconnects. The leading candidate technology is silicon photonics, and the workhorse of such interconnect is the optical modulator. Modulators have been improved dramatically in recent years. Most notably the bandwidth has increased from the MHz to the multi GHz regime in little more than half a decade. However, the demands of optical interconnect are significant, and many questions remain unanswered as to whether silicon can meet the required performance metrics. Minimising metrics such as the energy per bit, and device footprint, whilst maximising bandwidth and modulation depth are non trivial demands. All of this must be achieved with acceptable thermal tolerance and optical spectral width, using CMOS compatible fabrication processes. Here we discuss the techniques that have, and will, be used to implement silicon optical modulators, as well as the outlook for these devices, and the candidate solutions of the future