26 research outputs found

    3D Integration: Another Dimension Toward Hardware Security

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    We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it also requires thoughtful use of the options provided by the umbrella term of 3D integration. Toward enforcing security at runtime, we envision secure 2.5D system-level integration of untrusted chips and "all around" shielding for 3D ICs.Comment: IEEE IOLTS 201

    Hardware Obfuscation for Finite Field Algorithms

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    With the rise of computing devices, the security robustness of the devices has become of utmost importance. Companies invest huge sums of money, time and effort in security analysis and vulnerability testing of their software products. Bug bounty programs are held which incentivize security researchers for finding security holes in software. Once holes are found, software firms release security patches for their products. The semiconductor industry has flourished with accelerated innovation. Fabless manufacturing has reduced the time-to-market and lowered the cost of production of devices. Fabless paradigm has introduced trust issues among the hardware designers and manufacturers. Increasing dependence on computing devices in personal applications as well as in critical infrastructure has given a rise to hardware attacks on the devices in the last decade. Reverse engineering and IP theft are major challenges that have emerged for the electronics industry. Integrated circuit design companies experience a loss of billions of dollars because of malicious acts by untrustworthy parties involved in the design and fabrication process, and because of attacks by adversaries on the electronic devices in which the chips are embedded. To counter these attacks, researchers have been working extensively towards finding strong countermeasures. Hardware obfuscation techniques make the reverse engineering of device design and functionality difficult for the adversary. The goal is to conceal or lock the underlying intellectual property of the integrated circuit. Obfuscation in hardware circuits can be implemented to hide the gate-level design, layout and the IP cores. Our work presents a novel hardware obfuscation design through reconfigurable finite field arithmetic units, which can be employed in various error correction and cryptographic algorithms. The effectiveness and efficiency of the proposed methods are verified by an obfuscated Reformulated Inversion-less Berlekamp-Massey (RiBM) architecture based Reed-Solomon decoder. Our experimental results show the hardware implementation of RiBM based Reed-Solomon decoder built using reconfigurable field multiplier designs. The proposed design provides only very low overhead with improved security by obfuscating the functionality and the outputs. The design proposed in our work can also be implemented in hardware designs of other algorithms that are based on finite field arithmetic. However, our main motivation was to target encryption and decryption circuits which store and process sensitive data and are used in critical applications

    Provably Trustworthy and Secure Hardware Design with Low Overhead

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    Due to the globalization of IC design in the semiconductor industry and outsourcing of chip manufacturing, 3PIPs become vulnerable to IP piracy, reverse engineering, counterfeit IC, and hardware Trojans. To thwart such attacks, ICs can be protected using logic encryption techniques. However, strong resilient techniques incur significant overheads. SCAs further complicate matters by introducing potential attacks post-fabrication. One of the most severe SCAs is PA attacks, in which an attacker can observe the power variations of the device and analyze them to extract the secret key. PA attacks can be mitigated via adding large extra hardware; however, the overheads of such solutions can render them impractical, especially when there are power and area constraints. In our first approach, we present two techniques to prevent normal attacks. The first one is based on inserting MUX equal to half/full of the output bit number. In the second technique, we first design PLGs using SiNW FETs and then replace some logic gates in the original design with their SiNW FETs-based PLGs counterparts. In our second approach, we use SiNW FETs to produce obfuscated ICs that are resistant to advanced reverse engineering attacks. Our method is based on designing a small block, whose output is untraceable, namely URSAT. Since URSAT may not offer very strong resilience against the combined AppSAT-removal attack, S-URSAT is achieved using only CMOS-logic gates, and this increases the security level of the design to robustly thwart all existing attacks. In our third topic, we present the usage of ASLD to produce secure and resilient circuits that withstand IC attacks (during the fabrication) and PA attacks (after fabrication). First, we show that ASLD has unique features that can be used to prevent PA and IC attacks. In our three topics, we evaluate each design based on performance overheads and security guarantees

    Quantum Rangefinding

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    Uniquely Identifiable Tamper-Evident Device Using Coupling between Subwavelength Gratings

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    Reliability and sensitive information protection are critical aspects of integrated circuits. A novel technique using near-field evanescent wave coupling from two subwavelength gratings (SWGs), with the input laser source delivered through an optical fiber is presented for tamper evidence of electronic components. The first grating of the pair of coupled subwavelength gratings (CSWGs) was milled directly on the output facet of the silica fiber using focused ion beam (FIB) etching. The second grating was patterned using e-beam lithography and etched into a glass substrate using reactive ion etching (RIE). The slightest intrusion attempt would separate the CSWGs and eliminate near-field coupling between the gratings. Tampering, therefore, would become evident. Computer simulations guided the design for optimal operation of the security solution. The physical dimensions of the SWGs, i.e. period and thickness, were optimized, for a 650 nm illuminating wavelength. The optimal dimensions resulted in a 560 nm grating period for the first grating etched in the silica optical fiber and 420 nm for the second grating etched in borosilicate glass. The incident light beam had a half-width at half-maximum (HWHM) of at least 7 µm to allow discernible higher transmission orders, and a HWHM of 28 µm for minimum noise. The minimum number of individual grating lines present on the optical fiber facet was identified as 15 lines. Grating rotation due to the cylindrical geometry of the fiber resulted in a rotation of the far-field pattern, corresponding to the rotation angle of moiré fringes. With the goal of later adding authentication to tamper evidence, the concept of CSWGs signature was also modeled by introducing random and planned variations in the glass grating. The fiber was placed on a stage supported by a nanomanipulator, which permitted three-dimensional displacement while maintaining the fiber tip normal to the surface of the glass substrate. A 650 nm diode laser was fixed to a translation mount that transmitted the light source through the optical fiber, and the output intensity was measured using a silicon photodiode. The evanescent wave coupling output results for the CSWGs were measured and compared to the simulation results
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