High-Performance Shuffle Motor Fabricated by Vertical Trench Isolation Technology

Shuffle motors are electrostatic stepper micromotors that employ a built-in mechanical leverage to produce large output forces as well as high resolution displacements. These motors can generally move only over predefined paths that served as driving electrodes. Here, we present the design, modeling and experimental characterization of a novel shuffle motor that moves over an unpatterned, electrically grounded surface. By combining the novel design with an innovative micromachining method based on vertical trench isolation, we have greatly simplified the fabrication of the shuffle motors and significantly improved their overall performance characteristics and reliability. Depending on the propulsion voltage, our motor with external dimensions of 290 μm × 410 mm displays two distinct operational modes with adjustable step sizes varying respectively from 0.6 to 7 nm and from 49 to 62 nm. The prototype was driven up to a cycling frequency of 80 kHz, showing nearly linear dependence of its velocity with frequency and a maximum velocity of 3.6 mm/s. For driving voltages of 55 V, the device had a maximum travel range of ±70 μm and exhibited an output force of 1.7 mN, resulting in the highest force and power densities reported so far for an electrostatic micromotor. After five days of operation, it had traveled a cumulative distance of more than 1.5 km in 34 billion steps without noticeable deterioration in performance.\u

Pneumatic contactless microfeeder design refinement through CFD simulation

A new contactless pneumatic microfeeder based on distributed manipulation is proposed. By cooperation of dynamically programmable microactuators, the part to be conveyed floats over an air cushion and is moved to the desired location with the desired orientation. CFD simulations are used to test the validity of the proposed concept and refine the design of the microactuator

Cantilever beam microactuators with electrothermal and electrostatic drive

Microfabrication provides a powerful tool for batch processing and miniaturization of mechanical systems into dimensional domain not accessible easily by conventional machining. CMOS IC process compatible design is definitely a big plus because of tremendous know-how in IC technologies, commercially available standard IC processes for a reasonable price, and future integration of microma-chined mechanical systems and integrated circuits. Magnetically, electrostatically and thermally driven microactuators have been reported previously. These actuators have applications in many fields from optics to robotics and biomedical engineering. At NJIT cleanroom, mono or multimorph microactuators have been fabricated using CMOS compatible process. In design and fabrication of these microactuators, internal stress due to thermal expansion coefficient mismatch and residual stress have been considered, and the microactuators are driven with electro-thermal power combined with electrostatical excitation. They can provide large force, and in- or out-of-plane actuation. In this work, an analytical model is proposed to describe the thermal actuation of in-plane (inchworm) actuators. Stress gradient throughout the thickness of monomorph layers is modeled as linearly temperature dependent Δσ. The nonlinear behaviour of out-of-plane actuators under electrothermal and electrostatic excitations is investigated. The analytical results are compared with the numerical results based on Finite Element Analysis. ANSYS, a general purpose FEM package, and IntelliCAD, a FEA CAD tool specifically designed for MEMS have been used extensively. The experimental results accompany each analytical and numerical work. Micromechanical world is three dimensional and 2D world of IC processes sets a limit to it. A new micromachining technology, reshaping, has been introduced to realize 3D structures and actuators. This new 3D fabrication technology makes use of the advantages of IC fabrication technologies and combines them with the third dimension of the mechanical world. Polycrystalline silicon microactuators have been reshaped by Joule heating. The first systematic investigation of reshaping has been presented. A micromirror utilizing two reshaped actuators have been designed, fabricated and characterized

Towards smart self-clearing glaucoma drainage device.

For patients who are unresponsive to pharmacological treatments of glaucoma, an implantable glaucoma drainage devices (GDD) are often used to manage the intraocular pressure. However, the microscale channel that removes excess aqueous humor from the anterior chamber often gets obstructed due to biofouling, which necessitates additional surgical intervention. Here we demonstrate the proof-of-concept for smart self-clearing GDD by integrating magnetic microactuators inside the drainage tube of GDD. The magnetic microactuators can be controlled using externally applied magnetic fields to mechanically clear biofouling-based obstruction, thereby eliminating the need for surgical intervention. In this work, our prototype magnetic microactuators were fabricated using low-cost maskless photolithography to expedite design iteration. The fabricated devices were evaluated for their static and dynamic mechanical responses. Using transient numerical analysis, the fluid–structure interaction of our microactuator inside a microtube was characterized to better understand the amount of shear force generated by the device motion. Finally, the anti-biofouling performance of our device was evaluated using fluorescein isothiocyanate labeled bovine serum albumin. The microactuators were effective in removing proteinaceous film deposited on device surface as well as on the inner surface of the microchannel, which supports our hypothesis that a smart self-clearing GDD may be possible by integrating microfabricated magnetic actuators in chronically implanted microtubes

Development of the technological process for the production of the electrostatic curved beam actuator for pneumatic microvalves

This work focuses on the development of an effective technological process for the production of the electrostatic curved beam actuator capable to be used as a driving element in different devices such as microswitches or microvalves. Main attention was drawn to the investigation of electroplating technique as a critical process in the microactuator fabrication as well as to the design of the actuator. In addition, usability of ceramic substrates for the microactuator and microvalve production was examined. The idea behind it was that ceramic substrates can be preprocessed and delivered already with necessary electrical connections on it. This would make the entire production process simpler and cheaper. Several types of polished alumina (Al2O3) substrates were used for this purpose. Electrostatic actuation principle was chosen for its good scaling properties to small dimensions, low power consumption, smaller size and higher switching speed. Curved shape of the actuator allows to reduce its pull-in voltage and thus to increase the amplitude of motion as compared to the parallel-plate structures. The material of the actuator is nickel. It was chosen for its good mechanical properties and relative simplicity of processing. Double layer nickel electroplating was used to produce the microactuator. The layers have different stress gradients controlled by current density during the electroplating process, making it possible to achieve the desired bending of the structure. Compared to bimetallic bending cantilever actuators, the curvature of the single-metal beam is less dependable on temperature and aging. Thus, more stable performance under changing working conditions was ensured. In order to avoid sticking of the microactuator to the isolation layer in the closed state, an array of stand-off bumps was added on the back-side of the beam. These bumps reduce the contact area and increase the distance between the actuator and the isolation layer. Fifteen design variants of the actuator differing in length and width were fabricated in order find the most effective solution for given system requirements. Based on the actuators technological process developed in this work, a simple electrostatic microvalve was designed and produced. Final variants of microvalve were fabricated on a standard 380 µm thick silicon wafer. Gas inlet channel as well as the electrodes and the actuator itself are all placed on the same substrate in order to reduce the size and cost of the system. During characterization, mechanical stability of the actuators and microvalves were studied by means of drop, temperature and shear tests in order to prove the reliability of the system. System performance tests proved stable pull-in voltages from 8,6 V to 11,6 V. Maximal gas flow through the valve was 110±5 ml/min at applied differential pressure of 2 bar

An integrated MEMS system for turbulent boundary layer control

The goal of this project is a first attempt to achieve active drag reduction using a large-scale integrated MEMS system. Previously, we have reported the successful development of a shear-stress imager which allows us to "see" surface vortices (1996). Here we present the promising results of the interaction between micro flap actuators and vortices. It is found that microactuators can actually reduce drag to values even lower than the drag associated with pure laminar flow, and that the microactuators can reduce shear stress values in turbulent flow as well. Based on these results, we have attempted the first totally integrated system that consists of 18 shear stress sensors, 3 magnetic flap-type actuators and control electronics for use in turbulent boundary layer control studies

Dynamic modeling and characterization of magnetic hybrid films of polyvinyl butyral/iron oxide nanoparticles (PVB/Fe₂O₃) devoted to microactuators.

This thesis was accomplished in a dual-degree modality between the consolidated group of Synthesis and Characterization of Materials ꟷFacultad de Ingeniería Mecánica y Eléctrica (FIME), Universidad Autónoma de Nuevo León (UANL), México, and the research group of Methodologies for Automatic Control and for Design of Mechatronic Systems (MACS), department of Automatic Control and Micro-Mechatronic Systems ꟷ FEMTO-ST institute, Université Bourgogne Franche-Comté (UBFC), France

Sealing of micromachined cavities using chemical vapor deposition methods: characterization and optimization

This paper presents results of a systematic investigation to characterize the sealing of micromachined cavities using chemical vapor deposition (CVD) methods. We have designed and fabricated a large number and variety of surface-micromachined test structures with different etch-channel dimensions. Each cavity is then subjected to a number of sequential CVD deposition steps with incremental thickness until the cavity is successfully sealed. At etch deposition interval, the sealing status of every test structure is experimentally obtained and the percentage of structures that are sealed is recorded. Four CVD sealing materials have been incorporated in our studies: LPCVD silicon nitride, LPCVD polycrystalline silicon (polysilicon), LPCVD phosphosilicate glass (PSG), and PECVD silicon nitride. The minimum CVD deposition thickness that is required to successfully seal a microstructure is obtained for the first time. For a typical Type-1 test structure that has eight etch channels-each 10 μm long, 4 μm wide, and 0.42 μm tall-the minimum required thickness (normalized with respect to the height of etch channels) is 0.67 for LPCVD silicon nitride, 0.62 for LPCVD polysilicon, 4.5 for LPCVD PSG, and 5.2 for PECVD nitride. LPCVD silicon nitride and polysilicon are the most efficient sealing materials. Sealing results with respect to etch-channel dimensions (length and width) are evaluated (within the range of current design). When LPCVD silicon nitride is used as the sealing material, test structures with the longest (38 μm) and widest (16 μm) etch channels exhibit the highest probability of sealing. Cavities with a reduced number of etch channels seal more easily. For LPCVD PSG sealing, on the other hand, the sealing performance improves with decreasing width but is not affected by length of etch channels