A global wire planning scheme for Network-on-Chip.

As technology scales down, the interconnect for on-chip global communication becomes the delay bottleneck. In order to provide well-controlled global wire delay and efficient global communication, a packet switched Network-on-Chip (NoC) architecture was proposed by different authors. In this paper, the NoC system parameters constrained by the interconnections are studied. Predictions on scaled system parameters such as clock frequency, resource size, global communication bandwidth and inter-resource delay are made for future technologies. Based on these parameters, a global wire planning scheme is proposed

SLIP: 10 years ago and 10 years from now

Founded in 1999, the ACM SLIP Workshop is now in its 12th year. The 2010 SLIP Panel session will highlight perspectives from three individuals who have had great influence on the course of SLIP, and provide an opportunity for lively discussion by workshop attendees of prospects for the next 10 years of SLIP. This panel summary records preliminary thoughts of the panelists on two starting questions

Chippe : a system for constraint driven behavioral synthesis

This report describes the Chippe system, gives some background previous work and describes several sample design runs of the system. Also presented are the sources of the design tradeoffs used by Chippe, and overview of the internal design model, and experiences using the system

On-Chip Transparent Wire Pipelining (invited paper)

Wire pipelining has been proposed as a viable mean to break the discrepancy between decreasing gate delays and increasing wire delays in deep-submicron technologies. Far from being a straightforwardly applicable technique, this methodology requires a number of design modifications in order to insert it seamlessly in the current design flow. In this paper we briefly survey the methods presented by other researchers in the field and then we thoroughly analyze the solutions we recently proposed, ranging from system-level wire pipelining to physical design aspects

Throughput-driven floorplanning with wire pipelining

The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires

DFT and BIST of a multichip module for high-energy physics experiments

Engineers at Politecnico di Torino designed a multichip module for high-energy physics experiments conducted on the Large Hadron Collider. An array of these MCMs handles multichannel data acquisition and signal processing. Testing the MCM from board to die level required a combination of DFT strategie

Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.

Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them

APEnet+: a 3D toroidal network enabling Petaflops scale Lattice QCD simulations on commodity clusters

Many scientific computations need multi-node parallelism for matching up both space (memory) and time (speed) ever-increasing requirements. The use of GPUs as accelerators introduces yet another level of complexity for the programmer and may potentially result in large overheads due to the complex memory hierarchy. Additionally, top-notch problems may easily employ more than a Petaflops of sustained computing power, requiring thousands of GPUs orchestrated with some parallel programming model. Here we describe APEnet+, the new generation of our interconnect, which scales up to tens of thousands of nodes with linear cost, thus improving the price/performance ratio on large clusters. The project target is the development of the Apelink+ host adapter featuring a low latency, high bandwidth direct network, state-of-the-art wire speeds on the links and a PCIe X8 gen2 host interface. It features hardware support for the RDMA programming model and experimental acceleration of GPU networking. A Linux kernel driver, a set of low-level RDMA APIs and an OpenMPI library driver are available, allowing for painless porting of standard applications. Finally, we give an insight of future work and intended developments