1,996 research outputs found

    Operation of an optoelectronic crossbar switch containing a terabit-per-second free-space optical interconnect

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    The experimental operation of a terabit-per-second scale optoelectronic connection to a silicon very-large-scale-integrated circuit is described. A demonstrator system, in the form of an optoelectronic crossbar switch, has been constructed as a technology test bed. The assembly and testing of the components making up the system, including a flip-chipped InGaAs-GaAs optical interface chip, are reported. Using optical inputs to the electronic switching chip, single-channel routing of data through the system at the design rate of 250 Mb/s (without internal fan-out) was achieved. With 4000 optical inputs, this corresponds to a potential aggregate data input of a terabit per second into the single 14.6 /spl times/ 15.6 mm CMOS chip. In addition 50-Mb/s data rates were switched utilizing the full internal optical fan-out included in the system to complete the required connectivity. This simultaneous input of data across the chip corresponds to an aggregate data input of 0.2 Tb/s. The experimental system also utilized optical distribution of clock signals across the CMOS chip

    Progress in the Smart Pixel Technologies

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    The purpose of this paper is to review the recent progress in the developing smart pixel technologies. The paper begins by reviewing some of the rapidly evolving smart pixel terminologies. It then describes several of the smart pixel technologies that have recently emerged. Finally, it outlines the performance of these technologies in both device complexity and aggregate capacity. The reviewed SPA technologies include both the modulator-based FET-SEED, hybrid CMOS-SEED, and LCOS smart pixels and the source-based hybrid VCSEL/MSM, ELO, flip-chip-bonded VCSEL/MSM, and monolithic MSM/MESFET/VCSEL smart pixels

    Characterisation of a reconfigurable free space optical interconnect system for parallel computing applications and experimental validation using rapid prototyping technology

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    Free-space optical interconnects (FSOIs) are widely seen as a potential solution to present and future bandwidth bottlenecks for parallel processing applications. This thesis will be focused on the study of a particular FSOI system called Optical Highway (OH). The OH is a polarised beam routing system which uses Polarising Beam Splitters and Liquid Crystals (PBS/LC) assemblies to perform reconfigurable interconnection networks. The properties of the OH make it suitable for implementing different passive static networks. A technology known as Rapid Prototyping (RP) will be employed for the first time in order to create optomechanical structures at low cost and low production times. Off-theshelf optical components will also be characterised in order to implement the OH. Additionally, properties such as reconfigurability, scalability, tolerance to misalignment and polarisation losses will be analysed. The OH will be modelled at three levels: node, optical stage and architecture. Different designs will be proposed and a particular architecture, Optimised Cut-Through Ring (OCTR), will be experimentally implemented. Finally, based on this architecture, a new set of properties will be defined in order to optimise the efficiency of the optical channels

    Integrated Optics Some Aspects

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    Status of some key individual integrated optics components, their application in the field of telecommunications, integrated optoelectronic circuits, fibre optics sensors, optical interconnects and logic devices are highlighted in this paper. Possibilities of opto-opto processors in the computers field are also outlined

    Silicon optical modulators

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    Optical technology is poised to revolutionise short reach interconnects. The leading candidate technology is silicon photonics, and the workhorse of such interconnect is the optical modulator. Modulators have been improved dramatically in recent years. Most notably the bandwidth has increased from the MHz to the multi GHz regime in little more than half a decade. However, the demands of optical interconnect are significant, and many questions remain unanswered as to whether silicon can meet the required performance metrics. Minimising metrics such as the energy per bit, and device footprint, whilst maximising bandwidth and modulation depth are non trivial demands. All of this must be achieved with acceptable thermal tolerance and optical spectral width, using CMOS compatible fabrication processes. Here we discuss the techniques that have, and will, be used to implement silicon optical modulators, as well as the outlook for these devices, and the candidate solutions of the future

    The rising role of photonics in today's data centres

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    In recent years there has been a rapid growth in demand for ultra high speed data transmission with end users expecting fast, high bandwidth network access. This growth has put data centres under increasing pressure to provide greater data throughput and ever increasing data rates while at the same time improving the quality of data handling in terms of reduced latency, increased scalability and improved channel speed for users. However, data networks are becoming increasingly difficult to scale to meet this growing demand using current well established CMOS technology and architectures. As a result electronic bottlenecks are becoming apparent despite improvements in data management. The inter-related issues of electronic scalability, power consumption, copper interconnect bandwidth and the limited speed of CMOS electronics will be discussed; and the tremendous potential of optical fibre based networks to provide the necessary bandwidth will be illustrated. In addition, some applications of photonics to alleviate speed, throughput and latency issues in data networks will be discussed. Finally, progress in the form of a novel and highly scalable optical interconnect will be reviewed

    Holographic optical interconnects in dichromated gelatin

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