Task modules Partitioning, Scheduling and Floorplanning for Partially Dynamically Reconfigurable Systems Based on Modern Heterogeneous FPGAs

Modern field programmable gate array(FPGA) can be partially dynamically reconfigurable with heterogeneous resources distributed on the chip. And FPGA-based partially dynamically reconfigurable system(FPGA-PDRS) can be used to accelerate computing and improve computing flexibility. However, the traditional design of FPGA-PDRS is based on manual design. Implementing the automation of FPGA-PDRS needs to solve the problems of task modules partitioning, scheduling, and floorplanning on heterogeneous resources. Existing works only partly solve problems for the automation process of FPGA-PDRS or model homogeneous resource for FPGA-PDRS. To better solve the problems in the automation process of FPGA-PDRS and narrow the gap between algorithm and application, in this paper, we propose a complete workflow including three parts, pre-processing to generate the list of task modules candidate shapes according to the resources requirements, exploration process to search the solution of task modules partitioning, scheduling, and floorplanning, and post-optimization to improve the success rate of floorplan. Experimental results show that, compared with state-of-the-art work, the proposed complete workflow can improve performance by 18.7\%, reduce communication cost by 8.6\%, on average, with improving the resources reuse rate of the heterogeneous resources on the chip. And based on the solution generated by the exploration process, the post-optimization can improve the success rate of the floorplan by 14\%

Heurísticas bioinspiradas para el problema de Floorplanning 3D térmico de dispositivos MPSoCs

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadores y Automática, leída el 20-06-2013Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Throughput-driven floorplanning with wire pipelining

The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires

Understanding the impact of 3D stacked layouts on ILP

Journal Article3D die-stacked chips can alleviate the penalties imposed by long wires within micro-processor circuits. Many recent studies have attempted to partition each microprocessor structure across three dimensions to reduce their access times. In this paper, we implement each microprocessor structure on a single 2D die and leverage 3D to reduce the lengths of wires that communicate data between microprocessor structures within a single core. We begin with a criticality analysis of inter-structure wire delays and show that for most tra- ditional simple superscalar cores, 2D floorplans are already very efficient at minimizing critical wire delays. For an aggressive wire-constrained clustered superscalar architecture, an exploration of the design space reveals that 3D can yield higher benefit. However, this benefit may be negated by the higher power density and temperature entailed by 3D integration. Overall, we report a negative result and argue against leveraging 3D for higher ILP

Real-Time neural signal decoding on heterogeneous MPSocs based on VLIW ASIPs

An important research problem, at the basis of the development of embedded systems for neuroprosthetic applications, is the development of algorithms and platforms able to extract the patient's motion intention by decoding the information encoded in neural signals. At the state of the art, no portable and reliable integrated solutions implementing such a decoding task have been identified. To this aim, in this paper, we investigate the possibility of using the MPSoC paradigm in this application domain. We perform a design space exploration that compares different custom MPSoC embedded architectures, implementing two versions of a on-line neural signal decoding algorithm, respectively targeting decoding of single and multiple acquisition channels. Each considered design points features a different application configuration, with a specific partitioning and mapping of parallel software tasks, executed on customized VLIW ASIP processing cores. Experimental results, obtained by means of FPGA-based prototyping and post-floorplanning power evaluation on a 40nm technology library, assess the performance and hardware-related costs of the considered configurations. The reported power figures demonstrate the usability of the MPSoC paradigm within the processing of bio-electrical signals and show the benefits achievable by the exploitation of the instruction-level parallelism within tasks

FPGA dynamic and partial reconfiguration : a survey of architectures, methods, and applications

Dynamic and partial reconfiguration are key differentiating capabilities of field programmable gate arrays (FPGAs). While they have been studied extensively in academic literature, they find limited use in deployed systems. We review FPGA reconfiguration, looking at architectures built for the purpose, and the properties of modern commercial architectures. We then investigate design flows, and identify the key challenges in making reconfigurable FPGA systems easier to design. Finally, we look at applications where reconfiguration has found use, as well as proposing new areas where this capability places FPGAs in a unique position for adoption

Radiation safety based on the sky shine effect in reactor

In the reactor operation, neutrons and gamma rays are the most dominant radiation. As protection, lead and concrete shields are built around the reactor. However, the radiation can penetrate the water shielding inside the reactor pool. This incident leads to the occurrence of sky shine where a physical phenomenon of nuclear radiation sources was transmitted panoramic that extends to the environment. The effect of this phenomenon is caused by the fallout radiation into the surrounding area which causes the radiation dose to increase. High doses of exposure cause a person to have stochastic effects or deterministic effects. Therefore, this study was conducted to measure the radiation dose from sky shine effect that scattered around the reactor at different distances and different height above the reactor platform. In this paper, the analysis of the radiation dose of sky shine effect was measured using the experimental metho

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits

Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount