In-situ and In-field temperature and transistor BTI sensing techniques with microprocessor level implementation

In modern deep-scaled CMOS technologies, various silicon-related pitfalls present challenges to the long-term performance of microprocessors. Such challenges include (1) local hot spots, which breach the thermal limitations of a microprocessor, and (2) transistor aging, especially NBTI, which degrades transistor threshold voltage, ultimately threatening the reliability of the entire memory block. In previous systems, the dummy circuit was placed next to the subject, where the dummy was frequently analyzed, and the readout was used to infer the condition of the target. Due to rapidly changing ambient conditions (e.g., temperature and voltage) and the potential scale of the target dimensions, such metrics may not accurately represent the condition of the target. Moreover, such temperature sensors and canary circuits occupy a significant area. Therefore, it would be highly preferable to monitor the target circuit in-situ, i.e., to sense the precise transistor at operation. It is also important to achieve an accurate sensing metric. When the temperature is analyzed, the readout should account for voltage and process variations. While sensing the aging degradation, the readout should account for voltage and temperature fluctuations. This would allow testing during in-field operation, while the circuits achieve area-efficiency. This research had two stages. One result of the first stage was a silicon test chip that was a compact temperature sensor. It involved a family of PTAT+CTAT sensor front-ends that unitized only 6 to 8 conventional CMOS logic devices, yielding a smaller sized chip. The sensor demonstrates accuracy within the target and achieves a 14.3x smaller foot print than preceding published designs. The second product of the first stage was a PMOS aging sensor used in 6T SRAM circuits. The test chip has a real SRAM array, integrated with the proposed PMOS NBTI sensor. It can sense real PMOS NBTI effects in any bit cell (in-situ) and provide robust readings of temperature and voltage (in-field). Intensive aging tests validated the proposed sensing technique. The second stage was focused on implementing the in-situ and in-field sensing techniques in a real processor. The MIPS microprocessor had a modified instruction cache (I$) and instruction set architecture. With the addition of new instruction aging sensing and minor modification of the circuits, the processor can execute aging sensing opportunistically to evaluate the aging level of its instruction cache. A software framework was developed and verified to estimate the retention voltage of the instruction cache over the lifetime of the chip. An area-efficient SoC was developed that could transform the instruction cache into an ambient temperature sensor. It had a physically unclonable function (PUF), and it was built with an area-saving technique similar to the earlier work. This thesis has four chapters. They are presented in chronological and they are aligned with the research described above

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Dynamic reconfiguration frameworks for high-performance reliable real-time reconfigurable computing

The sheer hardware-based computational performance and programming flexibility offered by reconfigurable hardware like Field-Programmable Gate Arrays (FPGAs) make them attractive for computing in applications that require high performance, availability, reliability, real-time processing, and high efficiency. Fueled by fabrication process scaling, modern reconfigurable devices come with ever greater quantities of on-chip resources, allowing a more complex variety of applications to be developed. Thus, the trend is that technology giants like Microsoft, Amazon, and Baidu now embrace reconfigurable computing devices likes FPGAs to meet their critical computing needs. In addition, the capability to autonomously reprogramme these devices in the field is being exploited for reliability in application domains like aerospace, defence, military, and nuclear power stations. In such applications, real-time computing is important and is often a necessity for reliability. As such, applications and algorithms resident on these devices must be implemented with sufficient considerations for real-time processing and reliability. Often, to manage a reconfigurable hardware device as a computing platform for a multiplicity of homogenous and heterogeneous tasks, reconfigurable operating systems (ROSes) have been proposed to give a software look to hardware-based computation. The key requirements of a ROS include partitioning, task scheduling and allocation, task configuration or loading, and inter-task communication and synchronization. Existing ROSes have met these requirements to varied extents. However, they are limited in reliability, especially regarding the flexibility of placing the hardware circuits of tasks on device’s chip area, the problem arising more from the partitioning approaches used. Indeed, this problem is deeply rooted in the static nature of the on-chip inter-communication among tasks, hampering the flexibility of runtime task relocation for reliability. This thesis proposes the enabling frameworks for reliable, available, real-time, efficient, secure, and high-performance reconfigurable computing by providing techniques and mechanisms for reliable runtime reconfiguration, and dynamic inter-circuit communication and synchronization for circuits on reconfigurable hardware. This work provides task configuration infrastructures for reliable reconfigurable computing. Key features, especially reliability-enabling functionalities, which have been given little or no attention in state-of-the-art are implemented. These features include internal register read and write for device diagnosis; configuration operation abort mechanism, and tightly integrated selective-area scanning, which aims to optimize access to the device’s reconfiguration port for both task loading and error mitigation. In addition, this thesis proposes a novel reliability-aware inter-task communication framework that exploits the availability of dedicated clocking infrastructures in a typical FPGA to provide inter-task communication and synchronization. The clock buffers and networks of an FPGA use dedicated routing resources, which are distinct from the general routing resources. As such, deploying these dedicated resources for communication sidesteps the restriction of static routes and allows a better relocation of circuits for reliability purposes. For evaluation, a case study that uses a NASA/JPL spectrometer data processing application is employed to demonstrate the improved reliability brought about by the implemented configuration controller and the reliability-aware dynamic communication infrastructure. It is observed that up to 74% time saving can be achieved for selective-area error mitigation when compared to state-of-the-art vendor implementations. Moreover, an improvement in overall system reliability is observed when the proposed dynamic communication scheme is deployed in the data processing application. Finally, one area of reconfigurable computing that has received insufficient attention is security. Meanwhile, considering the nature of applications which now turn to reconfigurable computing for accelerating compute-intensive processes, a high premium is now placed on security, not only of the device but also of the applications, from loading to runtime execution. To address security concerns, a novel secure and efficient task configuration technique for task relocation is also investigated, providing configuration time savings of up to 32% or 83%, depending on the device; and resource usage savings in excess of 90% compared to state-of-the-art

Microarchitectural Low-Power Design Techniques for Embedded Microprocessors

With the omnipresence of embedded processing in all forms of electronics today, there is a strong trend towards wireless, battery-powered, portable embedded systems which have to operate under stringent energy constraints. Consequently, low power consumption and high energy efficiency have emerged as the two key criteria for embedded microprocessor design. In this thesis we present a range of microarchitectural low-power design techniques which enable the increase of performance for embedded microprocessors and/or the reduction of energy consumption, e.g., through voltage scaling. In the context of cryptographic applications, we explore the effectiveness of instruction set extensions (ISEs) for a range of different cryptographic hash functions (SHA-3 candidates) on a 16-bit microcontroller architecture (PIC24). Specifically, we demonstrate the effectiveness of light-weight ISEs based on lookup table integration and microcoded instructions using finite state machines for operand and address generation. On-node processing in autonomous wireless sensor node devices requires deeply embedded cores with extremely low power consumption. To address this need, we present TamaRISC, a custom-designed ISA with a corresponding ultra-low-power microarchitecture implementation. The TamaRISC architecture is employed in conjunction with an ISE and standard cell memories to design a sub-threshold capable processor system targeted at compressed sensing applications. We furthermore employ TamaRISC in a hybrid SIMD/MIMD multi-core architecture targeted at moderate to high processing requirements (> 1 MOPS). A range of different microarchitectural techniques for efficient memory organization are presented. Specifically, we introduce a configurable data memory mapping technique for private and shared access, as well as instruction broadcast together with synchronized code execution based on checkpointing. We then study an inherent suboptimality due to the worst-case design principle in synchronous circuits, and introduce the concept of dynamic timing margins. We show that dynamic timing margins exist in microprocessor circuits, and that these margins are to a large extent state-dependent and that they are correlated to the sequences of instruction types which are executed within the processor pipeline. To perform this analysis we propose a circuit/processor characterization flow and tool called dynamic timing analysis. Moreover, this flow is employed in order to devise a high-level instruction set simulation environment for impact-evaluation of timing errors on application performance. The presented approach improves the state of the art significantly in terms of simulation accuracy through the use of statistical fault injection. The dynamic timing margins in microprocessors are then systematically exploited for throughput improvements or energy reductions via our proposed instruction-based dynamic clock adjustment (DCA) technique. To this end, we introduce a 6-stage 32-bit microprocessor with cycle-by-cycle DCA. Besides a comprehensive design flow and simulation environment for evaluation of the DCA approach, we additionally present a silicon prototype of a DCA-enabled OpenRISC microarchitecture fabricated in 28 nm FD-SOI CMOS. The test chip includes a suitable clock generation unit which allows for cycle-by-cycle DCA over a wide range with fine granularity at frequencies exceeding 1 GHz. Measurement results of speedups and power reductions are provided

Technology 2001: The Second National Technology Transfer Conference and Exposition, volume 2

Proceedings of the workshop are presented. The mission of the conference was to transfer advanced technologies developed by the Federal government, its contractors, and other high-tech organizations to U.S. industries for their use in developing new or improved products and processes. Volume two presents papers on the following topics: materials science, robotics, test and measurement, advanced manufacturing, artificial intelligence, biotechnology, electronics, and software engineering

The ATLAS experiment at the CERN large hadron collider

Çetin, Serkant Ali (Dogus Author)The ATLAS detector as installed in its experimental cavern at point 1 at CERN is described in this paper. A brief overview of the expected performance of the detector when the Large Hadron Collider begins operation is also presented

High-Luminosity Large Hadron Collider (HL-LHC): Technical Design Report

The Large Hadron Collider (LHC) is one of the largest scientific instruments ever built. Since opening up a new energy frontier for exploration in 2010, it has gathered a global user community of about 9000 scientists working in fundamental particle physics and the physics of hadronic matter at extreme temperature and density. To sustain and extend its discovery potential, the LHC will need a major upgrade in the 2020s. This will increase its instantaneous luminosity (rate of collisions) by a factor of five beyond the original design value and the integrated luminosity (total number of collisions) by a factor ten. The LHC is already a highly complex and exquisitely optimised machine so this upgrade must be carefully conceived and will require new infrastructures (underground and on surface) and over a decade to implement. The new configuration, known as High Luminosity LHC (HL-LHC), relies on a number of key innovations that push accelerator technology beyond its present limits. Among these are cutting-edge 11–12 Tesla superconducting magnets, compact superconducting cavities for beam rotation with ultra-precise phase control, new technology and physical processes for beam collimation and 100 metre-long high-power superconducting links with negligible energy dissipation, all of which required several years of dedicated R&D effort on a global international level. The present document describes the technologies and components that will be used to realise the project and is intended to serve as the basis for the detailed engineering design of the HL-LHC

Understanding Quantum Technologies 2022

Understanding Quantum Technologies 2022 is a creative-commons ebook that provides a unique 360 degrees overview of quantum technologies from science and technology to geopolitical and societal issues. It covers quantum physics history, quantum physics 101, gate-based quantum computing, quantum computing engineering (including quantum error corrections and quantum computing energetics), quantum computing hardware (all qubit types, including quantum annealing and quantum simulation paradigms, history, science, research, implementation and vendors), quantum enabling technologies (cryogenics, control electronics, photonics, components fabs, raw materials), quantum computing algorithms, software development tools and use cases, unconventional computing (potential alternatives to quantum and classical computing), quantum telecommunications and cryptography, quantum sensing, quantum technologies around the world, quantum technologies societal impact and even quantum fake sciences. The main audience are computer science engineers, developers and IT specialists as well as quantum scientists and students who want to acquire a global view of how quantum technologies work, and particularly quantum computing. This version is an extensive update to the 2021 edition published in October 2021.Comment: 1132 pages, 920 figures, Letter forma