A Low-Cost FPGA-Based Test and Diagnosis Architecture for SRAMs

The continues improvement of manufacturing technologies allows the realization of integrated circuits containing an ever increasing number of transistors. A major part of these devices is devoted to realize SRAM blocks. Test and diagnosis of SRAM circuits are therefore an important challenge for improving quality of next generation integrated circuits. This paper proposes a flexible platform for testing and diagnosis of SRAM circuits. The architecture is based on the use of a low cost FPGA based board allowing high diagnosability while keeping costs at a very low leve

Oscillation-Based Test Structure and Method for OTA-C Filters

“This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder." “Copyright IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.”This paper describes a design for testability technique for operational transconductance amplifier and capacitor filters using an oscillation-based test topology. The oscillation-based test structure is a vectorless output test strategy easily extendable to built-in self-test. The proposed methodology converts filter under test into a quadrature oscillator using very simple techniques and measures the output frequency. The oscillation frequency may be considered as a digital signal and it can be evaluated using digital circuitry therefore the test time is very small. These characteristics imply that the proposed method is very suitable for catastrophic and parametric faults testing and also effective in detecting single and multiple faults. The validity of the proposed method has been verified using comparison between faulty and fault-free simulation results of two integrator loop and Tow-Thomas filters. Simulation results in 0.25 mum CMOS technology show that the proposed oscillation-based test strategy for OTA-C filters has 87% fault coverage and with a minimum number of extra components, requires a negligible area overhead

Leakage Current Analysis for Diagnosis of Bridge Defects in Power-Gating Designs

Manufacturing defects that do not affect the functional operation of low power Integrated Circuits (ICs) can nevertheless impact their power saving capability. We show that stuck-ON faults on the power switches and resistive bridges between the power networks can impair the power saving capability of power-gating designs. For quantifying the impact of such faults on the power savings of power-gating designs, we propose a diagnosis technique that targets bridges between the power networks. The proposed technique is based on the static power analysis of a power-gating design in stand-by mode and it utilizes a novel on-chip signature generation unit, which is sensitive to the voltage level between power rails, the measurements of which are processed off-line for the diagnosis of bridges that can adversely affect power savings. We explore, through SPICE simulation of the largest IWLS’05 benchmarks synthesised using a 32 nm CMOS technology, the trade-offs achieved by the proposed technique between diagnosis accuracy and area cost and we evaluate its robustness against process variation. The proposed technique achieves a diagnosis resolution that is higher than 98.6% and 97.9% for bridges of R ≳ 10MΩ(weak bridges) and bridges of R ≲ 10MΩ (strong bridges), respectively, and a diagnosis accuracy higher than 94.5% for all the examined defects. The area overhead is small and scalable: it is found to be 1.8% and 0.3% for designs with 27K and 157K gate equivalents, respectively

Automating defects simulation and fault modeling for SRAMs

The continues improvement in manufacturing process density for very deep sub micron technologies constantly leads to new classes of defects in memory devices. Exploring the effect of fabrication defects in future technologies, and identifying new classes of realistic functional fault models with their corresponding test sequences, is a time consuming task up to now mainly performed by hand. This paper proposes a new approach to automate this procedure. The proposed method exploits the capabilities of evolutionary algorithms to automatically identify faulty behaviors into defective memories and to define the corresponding fault models and relevant test sequences. Target defects are modeled at the electrical level in order to optimize the results to the specific technology and memory architecture

High quality testing of grid style power gating

This paper shows that existing delay-based testing techniques for power gating exhibit fault coverage loss due to unconsidered delays introduced by the structure of the virtual voltage power-distribution-network (VPDN). To restore this loss, which could reach up to 70.3% on stuck-open faults, we propose a design-for-testability (DFT) logic that considers the impact of VPDN on fault coverage in order to constitute the proper interface between the VPDN and the DFT. The proposed logic can be easily implemented on-top of existing DFT solutions and its overhead is optimized by an algorithm that offers trade-off flexibility between test-application-time and hardware overhead. Through physical layout SPICE simulations, we show complete fault coverage recovery on stuck-open faults and 43.2% test-application-time improvement compared to a previously proposed DFT technique. To the best of our knowledge, this paper presents the first analysis of the VPDN impact on test qualit

Quiescent current testing of CMOS data converters

Power supply quiescent current (IDDQ) testing has been very effective in VLSI circuits designed in CMOS processes detecting physical defects such as open and shorts and bridging defects. However, in sub-micron VLSI circuits, IDDQ is masked by the increased subthreshold (leakage) current of MOSFETs affecting the efficiency of I¬DDQ testing. In this work, an attempt has been made to perform robust IDDQ testing in presence of increased leakage current by suitably modifying some of the test methods normally used in industry. Digital CMOS integrated circuits have been tested successfully using IDDQ and IDDQ methods for physical defects. However, testing of analog circuits is still a problem due to variation in design from one specific application to other. The increased leakage current further complicates not only the design but also testing. Mixed-signal integrated circuits such as the data converters are even more difficult to test because both analog and digital functions are built on the same substrate. We have re-examined both IDDQ and IDDQ methods of testing digital CMOS VLSI circuits and added features to minimize the influence of leakage current. We have designed built-in current sensors (BICS) for on-chip testing of analog and mixed-signal integrated circuits. We have also combined quiescent current testing with oscillation and transient current test techniques to map large number of manufacturing defects on a chip. In testing, we have used a simple method of injecting faults simulating manufacturing defects invented in our VLSI research group. We present design and testing of analog and mixed-signal integrated circuits with on-chip BICS such as an operational amplifier, 12-bit charge scaling architecture based digital-to-analog converter (DAC), 12-bit recycling architecture based analog-to-digital converter (ADC) and operational amplifier with floating gate inputs. The designed circuits are fabricated in 0.5 μm and 1.5 μm n-well CMOS processes and tested. Experimentally observed results of the fabricated devices are compared with simulations from SPICE using MOS level 3 and BSIM3.1 model parameters for 1.5 μm and 0.5 μm n-well CMOS technologies, respectively. We have also explored the possibility of using noise in VLSI circuits for testing defects and present the method we have developed

An efficient logic fault diagnosis framework based on effect-cause approach

Fault diagnosis plays an important role in improving the circuit design process and the manufacturing yield. With the increasing number of gates in modern circuits, determining the source of failure in a defective circuit is becoming more and more challenging. In this research, we present an efficient effect-cause diagnosis framework for combinational VLSI circuits. The framework consists of three stages to obtain an accurate and reasonably precise diagnosis. First, an improved critical path tracing algorithm is proposed to identify an initial suspect list by backtracing from faulty primary outputs toward primary inputs. Compared to the traditional critical path tracing approach, our algorithm is faster and exact. Second, a novel probabilistic ranking model is applied to rank the suspects so that the most suspicious one will be ranked at or near the top. Several fast filtering methods are used to prune unrelated suspects. Finally, to refine the diagnosis, fault simulation is performed on the top suspect nets using several common fault models. The difference between the observed faulty behavior and the simulated behavior is used to rank each suspect. Experimental results on ISCAS85 benchmark circuits show that this diagnosis approach is efficient both in terms of memory space and CPU time and the diagnosis results are accurate and reasonably precise

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process