91,883 research outputs found

    From FPGA to ASIC: A RISC-V processor experience

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    This work document a correct design flow using these tools in the Lagarto RISC- V Processor and the RTL design considerations that must be taken into account, to move from a design for FPGA to design for ASIC

    Design and standalone characterisation of a capacitively coupled HV-CMOS sensor chip for the CLIC vertex detector

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    The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active High-Voltage CMOS sensor, designed to be capacitively coupled to the CLICpix2 readout chip. The chip is implemented in a commercial 180180 nm HV-CMOS process and contains a matrix of 128×128128\times128 square pixels with 2525 μ\mum pitch. First prototypes have been produced with a standard resistivity of 20\sim20 Ω\Omegacm for the substrate and tested in standalone mode. The results show a rise time of 20\sim20 ns, charge gain of 190190 mV/ke^{-} and 40\sim40 e^{-} RMS noise for a power consumption of 4.84.8 μ\muW/pixel. The main design aspects, as well as standalone measurement results, are presented.Comment: 13 pages, 13 figures, 2 tables. Work carried out in the framework of the CLICdp collaboratio

    A mixed-signal integrated circuit for FM-DCSK modulation

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    This paper presents a mixed-signal application-specific integrated circuit (ASIC) for a frequency-modulated differential chaos shift keying (FM-DCSK) communication system. The chip is conceived to serve as an experimental platform for the evaluation of the FM-DCSK modulation scheme, and includes several programming features toward this goal. The operation of the ASIC is herein illustrated for a data rate of 500 kb/s and a transmission bandwidth in the range of 17 MHz. Using signals acquired from the test platform, bit error rate (BER) estimations of the overall FM-DCSK communication link have been obtained assuming wireless transmission at the 2.4-GHz ISM band. Under all tested propagation conditions, including multipath effects, the system obtains a BER = 10-3 for Eb/No lower than 28 dB.Ministerio de Ciencia y Tecnología TIC2003-0235

    A Breakdown Voltage Multiplier for High Voltage Swing Drivers

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    A novel breakdown voltage (BV) multiplier is introduced that makes it possible to generate high output voltage swings using transistors with low breakdown voltages. The timing analysis of the stage is used to optimize its dynamic response. A 10 Gb/s optical modulator driver with a differential output voltage swing of 8 V on a 50 Ω load was implemented in a SiGe BiCMOS process. It uses the BV-Doubler topology to achieve output swings twice the collector–emitter breakdown voltage without stressing any single transistor

    On-board B-ISDN fast packet switching architectures. Phase 2: Development. Proof-of-concept architecture definition report

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    For the next-generation packet switched communications satellite system with onboard processing and spot-beam operation, a reliable onboard fast packet switch is essential to route packets from different uplink beams to different downlink beams. The rapid emergence of point-to-point services such as video distribution, and the large demand for video conference, distributed data processing, and network management makes the multicast function essential to a fast packet switch (FPS). The satellite's inherent broadcast features gives the satellite network an advantage over the terrestrial network in providing multicast services. This report evaluates alternate multicast FPS architectures for onboard baseband switching applications and selects a candidate for subsequent breadboard development. Architecture evaluation and selection will be based on the study performed in phase 1, 'Onboard B-ISDN Fast Packet Switching Architectures', and other switch architectures which have become commercially available as large scale integration (LSI) devices

    A high speed Tri-Vision system for automotive applications

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    Purpose: Cameras are excellent ways of non-invasively monitoring the interior and exterior of vehicles. In particular, high speed stereovision and multivision systems are important for transport applications such as driver eye tracking or collision avoidance. This paper addresses the synchronisation problem which arises when multivision camera systems are used to capture the high speed motion common in such applications. Methods: An experimental, high-speed tri-vision camera system intended for real-time driver eye-blink and saccade measurement was designed, developed, implemented and tested using prototype, ultra-high dynamic range, automotive-grade image sensors specifically developed by E2V (formerly Atmel) Grenoble SA as part of the European FP6 project – sensation (advanced sensor development for attention stress, vigilance and sleep/wakefulness monitoring). Results : The developed system can sustain frame rates of 59.8 Hz at the full stereovision resolution of 1280 × 480 but this can reach 750 Hz when a 10 k pixel Region of Interest (ROI) is used, with a maximum global shutter speed of 1/48000 s and a shutter efficiency of 99.7%. The data can be reliably transmitted uncompressed over standard copper Camera-Link® cables over 5 metres. The synchronisation error between the left and right stereo images is less than 100 ps and this has been verified both electrically and optically. Synchronisation is automatically established at boot-up and maintained during resolution changes. A third camera in the set can be configured independently. The dynamic range of the 10bit sensors exceeds 123 dB with a spectral sensitivity extending well into the infra-red range. Conclusion: The system was subjected to a comprehensive testing protocol, which confirms that the salient requirements for the driver monitoring application are adequately met and in some respects, exceeded. The synchronisation technique presented may also benefit several other automotive stereovision applications including near and far-field obstacle detection and collision avoidance, road condition monitoring and others.Partially funded by the EU FP6 through the IST-507231 SENSATION project.peer-reviewe

    System and component design and test of a 10 hp, 18,000 rpm AC dynamometer utilizing a high frequency AC voltage link, part 1

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    Hard and soft switching test results conducted with one of the samples of first generation MOS-controlled thyristor (MCTs) and similar test results with several different samples of second generation MCT's are reported. A simple chopper circuit is used to investigate the basic switching characteristics of MCT under hard switching and various types of resonant circuits are used to determine soft switching characteristics of MCT under both zero voltage and zero current switching. Next, operation principles of a pulse density modulated converter (PDMC) for three phase (3F) to 3F two-step power conversion via parallel resonant high frequency (HF) AC link are reviewed. The details for the selection of power switches and other power components required for the construction of the power circuit for the second generation 3F to 3F converter system are discussed. The problems encountered in the first generation system are considered. Design and performance of the first generation 3F to 3F power converter system and field oriented induction moter drive based upon a 3 kVA, 20 kHz parallel resonant HF AC link are described. Low harmonic current at the input and output, unity power factor operation of input, and bidirectional flow capability of the system are shown via both computer and experimental results. The work completed on the construction and testing of the second generation converter and field oriented induction motor drive based upon specifications for a 10 hp squirrel cage dynamometer and a 20 kHz parallel resonant HF AC link is discussed. The induction machine is designed to deliver 10 hp or 7.46 kW when operated as an AC-dynamo with power fed back to the source through the converter. Results presented reveal that the proposed power level requires additional energy storage elements to overcome difficulties with a peak link voltage variation problem that limits reaching to the desired power level. The power level test of the second generation converter after the addition of extra energy storage elements to the HF link are described. The importance of the source voltage level to achieve a better current regulation for the source side PDMC is also briefly discussed. The power levels achieved in the motoring mode of operation show that the proposed power levels achieved in the generating mode of operation can also be easily achieved provided that no mechanical speed limitation were present to drive the induction machine at the proposed power level

    Characterization of High Temperature Optocoupler for Power Electronic Systems

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    High-temperature devices have been rapidly increas due to the implementation of new technologies like silicon carbide, high-temperature ceramic, and others. Functionality under elevated temperatures can reduce signal integrity reducing the reliability of power electronic systems. This study presents an ongoing research effort to develop a high-temperature package for optocouplers to operate at higher temperature compared with commercial devices. Low temperature co-fired ceramic (LTCC) was used as the substrate. Bare die commercial LED and photodetectors were attached to the substrate and tested for functionality. Preliminary results show enhanced performance at elevated temperatures compared to a commercial optocoupler device

    Exploring More-Coherent Quantum Annealing

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    In the quest to reboot computing, quantum annealing (QA) is an interesting candidate for a new capability. While it has not demonstrated an advantage over classical computing on a real-world application, many important regions of the QA design space have yet to be explored. In IARPA's Quantum Enhanced Optimization (QEO) program, we have opened some new lines of inquiry to get to the heart of QA, and are designing testbed superconducting circuits and conducting key experiments. In this paper, we discuss recent experimental progress related to one of the key design dimensions: qubit coherence. Using MIT Lincoln Laboratory's qubit fabrication process and extending recent progress in flux qubits, we are implementing and measuring QA-capable flux qubits. Achieving high coherence in a QA context presents significant new engineering challenges. We report on techniques and preliminary measurement results addressing two of the challenges: crosstalk calibration and qubit readout. This groundwork enables exploration of other promising features and provides a path to understanding the physics and the viability of quantum annealing as a computing resource.Comment: 7 pages, 3 figures. Accepted by the 2018 IEEE International Conference on Rebooting Computing (ICRC
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