Fabrication and Pseudo-Analog Characteristics of Ta2O5 -Based ReRAM Cell

Memristori on yksi elektroniikan peruskomponenteista vastuksen, kondensaattorin ja kelan lisäksi. Se on passiivinen komponentti, jonka teorian kehitti Leon Chua vuonna 1971. Kesti kuitenkin yli kolmekymmentä vuotta ennen kuin teoria pystyttiin yhdistämään kokeellisiin tuloksiin. Vuonna 2008 Hewlett Packard julkaisi artikkelin, jossa he väittivät valmistaneensa ensimmäisen toimivan memristorin. Memristori eli muistivastus on resistiivinen komponentti, jonka vastusarvoa pystytään muuttamaan. Nimens mukaisesti memristori kykenee myös säilyttämään vastusarvonsa ilman jatkuvaa virtaa ja jännitettä. Tyypillisesti memristorilla on vähintään kaksi vastusarvoa, joista kumpikin pystytään valitsemaan syöttämällä komponentille jännitettä tai virtaa. Tämän vuoksi memristoreita kutsutaankin usein resistiivisiksi kytkimiksi. Resistiivisiä kytkimiä tutkitaan nykyään paljon erityisesti niiden mahdollistaman muistiteknologian takia. Resistiivisistä kytkimistä rakennettua muistia kutsutaan ReRAM-muistiksi (lyhenne sanoista resistive random access memory). ReRAM-muisti on Flash-muistin tapaan haihtumaton muisti, jota voidaan sähköisesti ohjelmoida tai tyhjentää. Flash-muistia käytetään tällä hetkellä esimerkiksi muistitikuissa. ReRAM-muisti mahdollistaa kuitenkin nopeamman ja vähävirtaiseman toiminnan Flashiin verrattuna, joten se on tulevaisuudessa varteenotettava kilpailija markkinoilla. ReRAM-muisti mahdollistaa myös useammin bitin tallentamisen yhteen muistisoluun binäärisen (”0” tai ”1”) toiminnan sijaan. Tyypillisesti ReRAM-muistisolulla on kaksi rajoittavaa vastusarvoa, mutta näiden kahden tilan välille pystytään mahdollisesti ohjelmoimaan useampia tiloja. Muistisoluja voidaan kutsua analogisiksi, jos tilojen määrää ei ole rajoitettu. Analogisilla muistisoluilla olisi mahdollista rakentaa tehokkaasti esimerkiksi neuroverkkoja. Neuroverkoilla pyritään mallintamaan aivojen toimintaa ja suorittamaan tehtäviä, jotka ovat tyypillisesti vaikeita perinteisille tietokoneohjelmille. Neuroverkkoja käytetään esimerkiksi puheentunnistuksessa tai tekoälytoteutuksissa. Tässä diplomityössä tarkastellaan Ta2O5 -perustuvan ReRAM-muistisolun analogista toimintaa pitäen mielessä soveltuvuus neuroverkkoihin. ReRAM-muistisolun valmistus ja mittaustulokset käydään läpi. Muistisolun toiminta on harvoin täysin analogista, koska kahden rajoittavan vastusarvon välillä on usein rajattu määrä tiloja. Tämän vuoksi toimintaa kutsutaan pseudoanalogiseksi. Mittaustulokset osoittavat, että yksittäinen ReRAM-muistisolu kykenee binääriseen toimintaan hyvin. Joiltain osin yksittäinen solu kykenee tallentamaan useampia tiloja, mutta vastusarvoissa on peräkkäisten ohjelmointisyklien välillä suurta vaihtelevuutta, joka hankaloittaa tulkintaa. Valmistettu ReRAM-muistisolu ei sellaisenaan kykene toimimaan pseudoanalogisena muistina, vaan se vaati rinnalleen virtaa rajoittavan komponentin. Myös valmistusprosessin kehittäminen vähentäisi yksittäisen solun toiminnassa esiintyvää varianssia, jolloin sen toiminta muistuttaisi enemmän pseudoanalogista muistia.The memristor is one of the fundamental circuit elements in addition to a resistor, capacitor and an inductor. It is a passive component whose theory was postulated by Leon Chua in 1971. It took over 30 years before any known physical examples were discovered. In 2008 Hewlett Packard published an article where they manufactured a device which they claimed to be the first memristor found. The memristor, which is a concatenation of memory resistor, is a resistive component that has an ability to change its resistance. It can also remember its resistance value without continuous current or voltage. Typically, a memristor has at least two resistance states that can be altered. This is the reason why memristors are also called resistive switches. Resistive switches can be used in memory technologies. A memory array that has been built using resistive switches is called ReRAM (resistive random access memory). ReRAM, like Flash memory, is a non-volatile memory that can be programmed or erased electrically. Flash memories are currently used e.g. in memory sticks. However, compared to Flash, ReRAM has faster operating speed and lower power consumption, for instance. It could potentially replace current memory standards in future. A ReRAM memory cell can also store multiple bits instead of binary operation (”0” or ”1”). Typically there exists multiple intermediate resistance states between ReRAM’s limiting resistances that could be utilized. Such memory could be called analog, if the amount of intermediate states is not limited to discrete levels. Analog memories make it possible to build artificial neural networks (ANN) efficiently, for instance. ANNs try to model the behaviour of brain and to perform tasks that are difficult for traditional computer programs such as speech recognition or artificial intelligence. This thesis studies the analog behaviour of Ta 2 O 5 -based ReRAM cell. Manufacturing process and measurement results are presented. The operation of ReRAM cell is rarely fully analog as there exists limited amount of intermediate resistance states. This is the reason why operation is called pseudo-analog. Measurement results show that a single ReRAM cell is suitable for binary operation. In some cases, a single cell can store multiple resistance values but there exists significant variance in resistance states between subsequent programming cycles. The proposed ReRAM cell cannot operate as pseudo-analog ReRAM cell in itself as it needs an external current limiting component. Improving the manufacturing process should reduce the variability such that the operation would be more like a pseudo-analog memory.Siirretty Doriast

Resistive switching in ALD metal-oxides with engineered interfaces

L'abstract è presente nell'allegato / the abstract is in the attachmen

Fabrication, Characterization and Integration of Resistive Random Access Memories

The functionalities and performances of today's computing systems are increasingly dependent on the memory block. This phenomenon, also referred as the Von Neumann bottleneck, is the main motivation for the research on memory technologies. Despite CMOS technology has been improved in the last 50 years by continually increasing the device density, today's mainstream memories, such as SRAM, DRAM and Flash, are facing fundamental limitations to continue this trend. These memory technologies, based on charge storage mechanisms, are suffering from the easy loss of the stored state for devices scaled below 10 nm. This results in a degradation of the performance, reliability and noise margin. The main motivation for the development of emerging non volatile memories is the study of a different mechanism to store the digital state in order to overcome this challenge. Among these emerging technologies, one of the strongest candidate is Resistive Random Access Memory (ReRAM), which relies on the formation or rupture of a conductive filament inside a dielectric layer. This thesis focuses on the fabrication, characterization and integration of ReRAM devices. The main subject is the qualitative and quantitative description of the main factors that influence the resistive memory electrical behavior. Such factors can be related either to the memory fabrication or to the test environment. The first category includes variations in the fabrication process steps, in the device geometry or composition. We discuss the effect of each variation, and we use the obtained database to gather insights on the ReRAM working mechanism and the adopted methodology by using statistical methods. The second category describes how differences in the electrical stimuli sent to the device change the memory performances. We show how these factors can influence the memory resistance states, and we propose an empirical model to describe such changes. We also discuss how it is possible to control the resistance states by modulating the number of input pulses applied to the device. In the second part of this work, we present the integration of the fabricated devices in a CMOS technology environment. We discuss a Verilog-A model used to simulate the device characteristics, and we show two solutions to limit the sneak-path currents for ReRAM crossbars: a dedicated read circuit and the development of selector devices. We describe the selector fabrication, as well as the electrical characterization and the combination with our ReRAMs in a 1S1R configuration. Finally, we show two methods to integrate ReRAM devices in the BEoL of CMOS chips

Resistive Switching Mechanisms on TaOx and SrRuO3 Thin-Film Surfaces Probed by Scanning Tunneling Microscopy

The local electronic properties of tantalum oxide (TaO[subscript x], 2 ≤ x ≤ 2.5) and strontium ruthenate (SrRuO[subscript 3]) thin-film surfaces were studied under the influence of electric fields induced by a scanning tunneling microscope (STM) tip. The switching between different redox states in both oxides is achieved without the need for physical electrical contact by controlling the magnitude and polarity of the applied voltage between the STM tip and the sample surface. We demonstrate for TaO[subscript x] films that two switching mechanisms operate. Reduced tantalum oxide shows resistive switching due to the formation of metallic Ta, but partial oxidation of the samples changes the switching mechanism to one mediated mainly by oxygen vacancies. For SrRuO[subscript 3], we found that the switching mechanism depends on the polarity of the applied voltage and involves formation, annihilation, and migration of oxygen vacancies. Although TaO[subscript x] and SrRuO[subscript 3] differ significantly in their electronic and structural properties, the resistive switching mechanisms could be elaborated based on STM measurements, proving the general capability of this method for studying resistive switching phenomena in different classes of transition metal oxides.National Science Foundation (U.S.). Materials Research Science and Engineering Centers (Program) (Grant DMR-1419807

Evolution of Resistive Switching Characteristics in WO3-x-based MIM Devices by Tailoring Oxygen Deficiency

We report on resistive switching (RS) characteristics of W/WO3-x/Pt-based thin film memristors modulated by precisely controlled oxygen non-stoichiometry. RS properties of the devices with varied oxygen vacancy (VO) concentration have been studied by measuring their DC current voltage properties. Switchability of the resistance states in the memristors have been found to depend strongly on the VOs concentration in the WO3-x layer. Depending on x, the memristors exhibited forming-free bipolar, forming-required bipolar and non-formable characteristics. Devices with high VOs concentration (~1*1021 cm-3) exhibited lower initial resistance and memory window of only 15, which has been increased to ~6500 with reducing VOs concentration to ~5.8*1020 cm-3. Forming-free, stable RS with memory window of ~2000 have been realized for a memristor possessing VOs concentration of ~6.2*1020 cm-3. Investigation of the conduction mechanism suggests that tailoring VOs concentration modifies the formation and dimension of the conducting filaments as well as the Schottky barrier height at WO3-x/Pt interface which deterministically modulates RS characteristics of the WO3-x based memristors

Laser-Fabricated Reduced Graphene Oxide Memristors

Finding an inexpensive and scalable method for the mass production of memristors will be one of the key aspects for their implementation in end-user computing applications. Herein, we report pioneering research on the fabrication of laser-lithographed graphene oxide memristors. The devices have been surface-fabricated through a graphene oxide coating on a polyethylene terephthalate substrate followed by a localized laser-assisted photo-thermal partial reduction. When the laser fluence is appropriately tuned during the fabrication process, the devices present a characteristic pinched closed-loop in the current-voltage relation revealing the unique fingerprint of the memristive hysteresis. Combined structural and electrical experiments have been conducted to characterize the raw material and the devices that aim to establish a path for optimization. Electrical measurements have demonstrated a clear distinction between the resistive states, as well as stable memory performance, indicating the potential of laser-fabricated graphene oxide memristors in resistive switching applications.This work has been supported by the Spanish Ministry of Science, Innovation and Universities/FEDER-EU through the project TEC2017-89955-P, Iberdrola Foundation under its 2018 Research Grant Program, the pre-doctoral grants FPU16/01451, FPU16/04043, and the JSPS KAKENHI through grant number JP18k04275

Tuning resistive switching in complex oxide memristors

The continuous demand of lightweight portable, cheap and low-power devices has pushed the electronic industry to the limits of the current technology. Flash memory technology which represents the mainstream non-volatile memories has experienced an impressive development over the last decade. This led their fabrication down to a 16 nm node and implementation of high-density 3D memory architectures. Due to the scaling limit of Flash technology, the need of new memories that combine the characteristics of a Flash but overcome the scaling limits is increasing. In this surge, oxide-based resistive memories – also called memristors – have emerged as a new family of storage-class memory. The extremely simple physical structure fast response, low cost and power consumption render resistive memories as a valid alternative of the Flash technology and an optimal choice for the next generation memory technology. The nanoscale resistive memories have demonstrated a variety of memory characteristics which depends on the electrochemical properties of the oxide system and several physical parameters including device structure and electrical biasing conditions. This indicates a complex nature of the underlying microscopic switching mechanisms which require a thorough understanding in order to fully benefit from the virtue of this technology. The work presented in this Doctoral Dissertation focuses on the realization and fine tuning the memory characteristics of SrTiO3 based resistive switching memories. A novel synthesis route is adopted to realize highly complementary metal oxide semiconductor (CMOS) compatible nanoscale memristive devices and engineer the composition of the functional SrTiO3 perovskite oxide. By following the novel synthesis approach, SrTiO3 memristive devices with different stoichiometry such as different concentration of oxygen vacancies, metallic dopant species and physical structures are fabricated to achieve multifunctional characteristics of these devices. Rigorous electrical and material characterizations are carried out to analyze the resistive switching performance and understand the underlying microscopic mechanisms. Stable multi-state resistive switching is demonstrated in donor (Nb) doped oxygen-deficient amorphous SrTiO3 (Nb:a-STOx) memories. The dynamics of multi-state switching behavior and the effect of Nb-doping on tuning the resistive switching are investigated by utilizing a combination of interfacial compositional evaluation and activation energy measurements. Furthermore, multiple switching behaviors in a single acceptor (Cr) doped amorphous SrTiO3 (Cr:a-STOx) memory cell are demonstrated. A physical model is also suggested to explain the novel switching characteristics of these versatile memristive devices. A highly transparent and multifunctional SrTiO3 based memory system is fabricated which offers a reliable data storage and photosensitive platform for further transparent electronics. Also a unique photoluminescence mapping is presented as an identification technique for localized conduction mechanism in oxide resistive memories. Finally, SrTiO3 resistive memories are engineered to mimic biological synapses. A hybrid CMOS-memristor approached is presented to demonstrate first implementation of higher order time and rate dependent synaptic learning rules. Furthermore, these artificial synapses are tuned for energy-efficient performance to highlight their potential for the future neuromorphic networks

Parameter extraction techniques for the analysis and modeling of resistive memories

A revision of the different numerical techniques employed to extract resistive switching (RS) and modeling parameters is presented. The set and reset voltages, commonly used for variability estimation, are calculated for different resistive memory technologies. The methodologies to extract the series resistance and the parameters linked to the charge-flux memristive modeling approach are also described. It is found that the obtained cycle-to-cycle (C2C) variability depends on the numerical technique used. This result is important, and it implies that when analyzing C2C variability, the extraction technique should be described to perform fair comparisons between different resistive memory technologies. In addition to the use of extensive experimental data for different types of resistive memories, we have also included kinetic Monte Carlo (kMC) simulations to study the formation and rupture events of the percolation paths that constitute the conductive filaments (CF) that allow resistive switching operation in filamentary unipolar and bipolar devices.Consejería de Conocimiento, Investigaci ́on y Universidad, Junta de Andalucía (Spain) and the FEDER program for the projects A.TIC.117.UGR18, B-TIC-624-UGR20 and IE2017-5414Ramón y Cajal grant No. RYC2020-030150-IFunding for open access charge: Universidad de Granada/CBU