Conformable transistors for bioelectronics

The diversity of network disruptions that occur in patients with neuropsychiatric disorders creates a strong demand for personalized medicine. Such approaches often take the form of implantable bioelectronic devices that are capable of monitoring pathophysiological activity for identifying biomarkers to allow for local and responsive delivery of intervention. They are also required to transmit this data outside of the body for evaluation of the treatment’s efficacy. However, the ability to perform these demanding electronic functions in the complex physiological environment with minimum disruption to the biological tissue remains a big challenge. An optimal fully implantable bioelectronic device would require each component from the front-end to the data transmission to be conformable and biocompatible. For this reason, organic material-based conformable electronics are ideal candidates for components of bioelectronic circuits due to their inherent flexibility, and soft nature. In this work, first an organic mixed-conducting particulate composite material (MCP) able to form functional electronic components and non-invasively acquire high–spatiotemporal resolution electrophysiological signals by directly interfacing human skin is presented. Secondly, we introduce organic electrochemical internal ion-gated transistors (IGTs) as a high-density, high-amplification sensing component as well as a low leakage, high-speed processing unit. Finally, a novel wireless, battery-free strategy for electrophysiological signal acquisition, processing, and transmission that employs IGTs and an ionic communication circuit (IC) is introduced. We show that the wirelessly-powered IGTs are able to acquire and modulate neurophysiological data in-vivo and transmit them transdermally, eliminating the need for any hard Si-based electronics in the implant

Effects of biocompatible encapsulations on the acoustic characteristics of CMUTs

Advances in modern medicine enable the use of medical implants for the treatment of an increasing number of diseases. If different implanted systems need to communicate with each other, data transmission using ultrasound is a promising solution. In this dissertation, an encapsulation strategy, which allows the use of capacitive micromachined ultrasonic transducers (CMUTs) within conventional implant housings, was developed and evaluated for the first time. The novel encapsulation approach consists of a silicone layer for coupling the CMUT to a layer of polyether ether ketone (PEEK) or titanium. Both materials are widely used for medical implant housings. Finite element simulations, complemented by measurements in air and in immersion as well as ex vivo experiments, have shown that effective data transmission with data rates of minimum 0.8 Mbps is possible over at least 6 cm with this encapsulation strategy.Die Fortschritte in der modernen Medizin ermöglichen immer häufiger den Einsatz von medizinischen Implantaten zur Therapie. In Anwendungsfällen, die eine Kommunikation mehrerer implantierter Systeme untereinander erfordern, stellt die Datenübertragung mit Hilfe akustischer Wellen eine vielversprechende Lösung dar. Hierfür ist eine biokompatible Kapselung nötig, die eine effiziente Datenübertragung nicht verhindert. In dieser Arbeit wird erstmals eine Kapselungsstrategie entwickelt und evaluiert, die den Einsatz von kapazitiven mikromechanischen Ultraschallwandlern (CMUTs) innerhalb konventioneller Implantatgehäuse ermöglicht. Die untersuchte neuartige Kapselung besteht aus einer Silikonschicht zur Ankopplung an eine Schicht aus Polyetheretherketon (PEEK) oder Titan, zwei weitverbreitete Materialien für die Kapselung medizinischer Implantate. Finite Elemente Simulationen, Messungen in Luft und Flüssigkeit sowie ex vivo Experimente haben gezeigt, dass mit dieser Kapselungsstrategie eine effektive Datenübertragung über mindestens 6 cm möglich ist. Die in ex vivo Experimenten ermittelten Frequenzbandbreiten der gekapselten CMUTs ermöglichen Datenraten von mindestens 0.8 Mbps. Ein zusätzlicher experimenteller Vergleich mit herkömmlichen Kapselungen für CMUTs bestätigt das große Potenzial der neuartigen Kapselung aus Silikon und PEEK. Abschließend wurden zukünftige Ansatzpunkte zur Steigerung von Signalamplitude und Datenrate identifiziert und diskutiert

Flexible and Stretchable Electronics

Flexible and stretchable electronics are receiving tremendous attention as future electronics due to their flexibility and light weight, especially as applications in wearable electronics. Flexible electronics are usually fabricated on heat sensitive flexible substrates such as plastic, fabric or even paper, while stretchable electronics are usually fabricated from an elastomeric substrate to survive large deformation in their practical application. Therefore, successful fabrication of flexible electronics needs low temperature processable novel materials and a particular processing development because traditional materials and processes are not compatible with flexible/stretchable electronics. Huge technical challenges and opportunities surround these dramatic changes from the perspective of new material design and processing, new fabrication techniques, large deformation mechanics, new application development and so on. Here, we invited talented researchers to join us in this new vital field that holds the potential to reshape our future life, by contributing their words of wisdom from their particular perspective

XXIV congreso anual de la sociedad española de ingeniería biomédica (CASEIB2016)

En la presente edición, más de 150 trabajos de alto nivel científico van a ser presentados en 18 sesiones paralelas y 3 sesiones de póster, que se centrarán en áreas relevantes de la Ingeniería Biomédica. Entre las sesiones paralelas se pueden destacar la sesión plenaria Premio José María Ferrero Corral y la sesión de Competición de alumnos de Grado en Ingeniería Biomédica, con la participación de 16 alumnos de los Grados en Ingeniería Biomédica a nivel nacional. El programa científico se complementa con dos ponencias invitadas de científicos reconocidos internacionalmente, dos mesas redondas con una importante participación de sociedades científicas médicas y de profesionales de la industria de tecnología médica, y dos actos sociales que permitirán a los participantes acercarse a la historia y cultura valenciana. Por primera vez, en colaboración con FENIN, seJane Campos, R. (2017). XXIV congreso anual de la sociedad española de ingeniería biomédica (CASEIB2016). Editorial Universitat Politècnica de València. http://hdl.handle.net/10251/79277EDITORIA