Materials for high-density electronic packaging and interconnection

Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production

A low cost direct writing process for flexible circuit and interconnect fabrication

This thesis investigates the development of a low cost fabrication process for flexible electronics and interconnects. By using a ‘direct writing’ process, the use of vacuum-­‐based metal evaporation and photoresist steps is not necessary and so less complex equipment is needed. The process forms silver embedded on top of a polyimide substrate and was first tested using a UV laser to perform writing before switching to a blue laser due to excessive substrate degradation observed from UV exposures. The blue light was combined with a biologically friendly photo reducing agent, which was found to be much more efficient at the creation of silver. The methods of silver formation by various means are the main focus of investigation in this thesis but process expansion and improvement were the main goals. To this end, a chemical, rather than light-­‐based, process for silver creation was found to produce more consistent silver coatings, however the patterning by this method was found to be more challenging. The process was also extended to a different substrate in polyetherimide

Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics

The fundamental motivation for this dissertation is to address the widening interconnect gap between integrated circuit (IC) demands and package substrates specifically for high frequency digital-RF systems applications. Moore's law for CMOS ICs predicts that transistor density on ICs will double approximately every 18 months. The current state-of-the-art in IC package substrates is at 20µm lines/spaces and 50-60µm microvia diameter using epoxy dielectrics with loss tangent above 0.01. The research targets are to overcome the barriers of current technologies and demonstrate a set of advanced materials and process technologies capable of 5-10µm lines and spaces, and 10-30µm diameter microvias in a multilayer 3-D wiring substrate using 10-25µm thin film dielectrics with loss tangent in the <0.005. The research elements are organized as follows with a clear focus on understanding and characterization of fundamental materials structure-processing-property relationships and interfaces to achieve the next generation targets. (a) Low CTE Core Substrate, (b) Low Loss Dielectrics with 25µm and smaller microvias, (c) Sub-10µm Width Cu Conductors, and (d) Integration of the various dielectric and conductor processes.Ph.D.Committee Chair: Tummala, Rao; Committee Member: Iyer, Mahadevan; Committee Member: Saxena, Ashok; Committee Member: Swaminathan, Madhavan; Committee Member: Wong, Chingpin

NASA technology utilization survey on composite materials

NASA and NASA-funded contractor contributions to the field of composite materials are surveyed. Existing and potential non-aerospace applications of the newer composite materials are emphasized. Economic factors for selection of a composite for a particular application are weight savings, performance (high strength, high elastic modulus, low coefficient of expansion, heat resistance, corrosion resistance,), longer service life, and reduced maintenance. Applications for composites in agriculture, chemical and petrochemical industries, construction, consumer goods, machinery, power generation and distribution, transportation, biomedicine, and safety are presented. With the continuing trend toward further cost reductions, composites warrant consideration in a wide range of non-aerospace applications. Composite materials discussed include filamentary reinforced materials, laminates, multiphase alloys, solid multiphase lubricants, and multiphase ceramics. New processes developed to aid in fabrication of composites are given

Attachment methods for advanced spacecraft thermal control materials - An annotated bibliography, phase 1 Summary report supplement

Annotated bibliography on attachment methods for advanced spacecraft thermal control material

JTEC Panel report on electronic manufacturing and packaging in Japan

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies

Integrated sensors for process monitoring and health monitoring in microsystems

This thesis presents the development of integrated sensors for health monitoring in Microsystems, which is an emerging method for early diagnostics of status or “health” of electronic systems and devices under operation based on embedded tests. Thin film meander temperature sensors have been designed with a minimum footprint of 240 m × 250 m. A microsensor array has been used successfully for accurate temperature monitoring of laser assisted polymer bonding for MEMS packaging. Using a frame-shaped beam, the temperature at centre of bottom substrate was obtained to be ~50 ºC lower than that obtained using a top-hat beam. This is highly beneficial for packaging of temperature sensitive MEMS devices. Polymer based surface acoustic wave humidity sensors were designed and successfully fabricated on 128° cut lithium niobate substrates. Based on reflection signals, a sensitivity of 0.26 dB/RH% was achieved between 8.6 %RH and 90.6 %RH. Fabricated piezoresistive pressure sensors have also been hybrid integrated and electrically contacted using a wire bonding method. Integrated sensors based on both LiNbO3 and ZnO/Si substrates are proposed. Integrated sensors were successfully fabricated on a LiNbO3 substrate with a footprint of 13 mm × 12 mm, having multi monitoring functions for simultaneous temperature, measurement of humidity and pressure in the health monitoring applications

Recent advances in upscalable wet methods and ink formulations for printed electronics

This review deals with the use of solution processing approaches for organic electronics with a focus on material ink formulations as well as on their applicability. The solution processing techniques include methods like gravure printing, screen printing and ink-jet printing. Basic principles of each approach are understood and fundamental correlations between material (metals, semiconductors, and dielectrics) ink properties and final device performances can be drawn. Nevertheless, solution processing methods have the potential to evolve as the most promising tools in organic device fabrication techniques and have already been applied successfully in the fields of organic thin film transistors, solar cells and biosensing devices