30 research outputs found

    Circuits and Systems Advances in Near Threshold Computing

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    Modern society is witnessing a sea change in ubiquitous computing, in which people have embraced computing systems as an indispensable part of day-to-day existence. Computation, storage, and communication abilities of smartphones, for example, have undergone monumental changes over the past decade. However, global emphasis on creating and sustaining green environments is leading to a rapid and ongoing proliferation of edge computing systems and applications. As a broad spectrum of healthcare, home, and transport applications shift to the edge of the network, near-threshold computing (NTC) is emerging as one of the promising low-power computing platforms. An NTC device sets its supply voltage close to its threshold voltage, dramatically reducing the energy consumption. Despite showing substantial promise in terms of energy efficiency, NTC is yet to see widescale commercial adoption. This is because circuits and systems operating with NTC suffer from several problems, including increased sensitivity to process variation, reliability problems, performance degradation, and security vulnerabilities, to name a few. To realize its potential, we need designs, techniques, and solutions to overcome these challenges associated with NTC circuits and systems. The readers of this book will be able to familiarize themselves with recent advances in electronics systems, focusing on near-threshold computing

    Understanding Quantum Technologies 2022

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    Understanding Quantum Technologies 2022 is a creative-commons ebook that provides a unique 360 degrees overview of quantum technologies from science and technology to geopolitical and societal issues. It covers quantum physics history, quantum physics 101, gate-based quantum computing, quantum computing engineering (including quantum error corrections and quantum computing energetics), quantum computing hardware (all qubit types, including quantum annealing and quantum simulation paradigms, history, science, research, implementation and vendors), quantum enabling technologies (cryogenics, control electronics, photonics, components fabs, raw materials), quantum computing algorithms, software development tools and use cases, unconventional computing (potential alternatives to quantum and classical computing), quantum telecommunications and cryptography, quantum sensing, quantum technologies around the world, quantum technologies societal impact and even quantum fake sciences. The main audience are computer science engineers, developers and IT specialists as well as quantum scientists and students who want to acquire a global view of how quantum technologies work, and particularly quantum computing. This version is an extensive update to the 2021 edition published in October 2021.Comment: 1132 pages, 920 figures, Letter forma

    Miniaturized Transistors, Volume II

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    In this book, we aim to address the ever-advancing progress in microelectronic device scaling. Complementary Metal-Oxide-Semiconductor (CMOS) devices continue to endure miniaturization, irrespective of the seeming physical limitations, helped by advancing fabrication techniques. We observe that miniaturization does not always refer to the latest technology node for digital transistors. Rather, by applying novel materials and device geometries, a significant reduction in the size of microelectronic devices for a broad set of applications can be achieved. The achievements made in the scaling of devices for applications beyond digital logic (e.g., high power, optoelectronics, and sensors) are taking the forefront in microelectronic miniaturization. Furthermore, all these achievements are assisted by improvements in the simulation and modeling of the involved materials and device structures. In particular, process and device technology computer-aided design (TCAD) has become indispensable in the design cycle of novel devices and technologies. It is our sincere hope that the results provided in this Special Issue prove useful to scientists and engineers who find themselves at the forefront of this rapidly evolving and broadening field. Now, more than ever, it is essential to look for solutions to find the next disrupting technologies which will allow for transistor miniaturization well beyond silicon’s physical limits and the current state-of-the-art. This requires a broad attack, including studies of novel and innovative designs as well as emerging materials which are becoming more application-specific than ever before

    Microscopy and Analysis

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    Microscopes represent tools of the utmost importance for a wide range of disciplines. Without them, it would have been impossible to stand where we stand today in terms of understanding the structure and functions of organelles and cells, tissue composition and metabolism, or the causes behind various pathologies and their progression. Our knowledge on basic and advanced materials is also intimately intertwined to the realm of microscopy, and progress in key fields of micro- and nanotechnologies critically depends on high-resolution imaging systems. This volume includes a series of chapters that address highly significant scientific subjects from diverse areas of microscopy and analysis. Authoritative voices in their fields present in this volume their work or review recent trends, concepts, and applications, in a manner that is accessible to a broad readership audience from both within and outside their specialist area

    Advances in Solid State Circuit Technologies

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    This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields

    Intelligent Circuits and Systems

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    ICICS-2020 is the third conference initiated by the School of Electronics and Electrical Engineering at Lovely Professional University that explored recent innovations of researchers working for the development of smart and green technologies in the fields of Energy, Electronics, Communications, Computers, and Control. ICICS provides innovators to identify new opportunities for the social and economic benefits of society.  This conference bridges the gap between academics and R&D institutions, social visionaries, and experts from all strata of society to present their ongoing research activities and foster research relations between them. It provides opportunities for the exchange of new ideas, applications, and experiences in the field of smart technologies and finding global partners for future collaboration. The ICICS-2020 was conducted in two broad categories, Intelligent Circuits & Intelligent Systems and Emerging Technologies in Electrical Engineering

    Integrated Circuits/Microchips

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    With the world marching inexorably towards the fourth industrial revolution (IR 4.0), one is now embracing lives with artificial intelligence (AI), the Internet of Things (IoTs), virtual reality (VR) and 5G technology. Wherever we are, whatever we are doing, there are electronic devices that we rely indispensably on. While some of these technologies, such as those fueled with smart, autonomous systems, are seemingly precocious; others have existed for quite a while. These devices range from simple home appliances, entertainment media to complex aeronautical instruments. Clearly, the daily lives of mankind today are interwoven seamlessly with electronics. Surprising as it may seem, the cornerstone that empowers these electronic devices is nothing more than a mere diminutive semiconductor cube block. More colloquially referred to as the Very-Large-Scale-Integration (VLSI) chip or an integrated circuit (IC) chip or simply a microchip, this semiconductor cube block, approximately the size of a grain of rice, is composed of millions to billions of transistors. The transistors are interconnected in such a way that allows electrical circuitries for certain applications to be realized. Some of these chips serve specific permanent applications and are known as Application Specific Integrated Circuits (ASICS); while, others are computing processors which could be programmed for diverse applications. The computer processor, together with its supporting hardware and user interfaces, is known as an embedded system.In this book, a variety of topics related to microchips are extensively illustrated. The topics encompass the physics of the microchip device, as well as its design methods and applications

    Computational and Numerical Simulations

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    Computational and Numerical Simulations is an edited book including 20 chapters. Book handles the recent research devoted to numerical simulations of physical and engineering systems. It presents both new theories and their applications, showing bridge between theoretical investigations and possibility to apply them by engineers of different branches of science. Numerical simulations play a key role in both theoretical and application oriented research

    Design for Reliability and Low Power in Emerging Technologies

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    Die fortlaufende Verkleinerung von Transistor-Strukturgrößen ist einer der wichtigsten Antreiber für das Wachstum in der Halbleitertechnologiebranche. Seit Jahrzehnten erhöhen sich sowohl Integrationsdichte als auch Komplexität von Schaltkreisen und zeigen damit einen fortlaufenden Trend, der sich über alle modernen Fertigungsgrößen erstreckt. Bislang ging das Verkleinern von Transistoren mit einer Verringerung der Versorgungsspannung einher, was zu einer Reduktion der Leistungsaufnahme führte und damit eine gleichbleibenden Leistungsdichte sicherstellte. Doch mit dem Beginn von Strukturgrößen im Nanometerbreich verlangsamte sich die fortlaufende Skalierung. Viele Schwierigkeiten, sowie das Erreichen von physikalischen Grenzen in der Fertigung und Nicht-Idealitäten beim Skalieren der Versorgungsspannung, führten zu einer Zunahme der Leistungsdichte und, damit einhergehend, zu erschwerten Problemen bei der Sicherstellung der Zuverlässigkeit. Dazu zählen, unter anderem, Alterungseffekte in Transistoren sowie übermäßige Hitzeentwicklung, nicht zuletzt durch stärkeres Auftreten von Selbsterhitzungseffekten innerhalb der Transistoren. Damit solche Probleme die Zuverlässigkeit eines Schaltkreises nicht gefährden, werden die internen Signallaufzeiten üblicherweise sehr pessimistisch kalkuliert. Durch den so entstandenen zeitlichen Sicherheitsabstand wird die korrekte Funktionalität des Schaltkreises sichergestellt, allerdings auf Kosten der Performance. Alternativ kann die Zuverlässigkeit des Schaltkreises auch durch andere Techniken erhöht werden, wie zum Beispiel durch Null-Temperatur-Koeffizienten oder Approximate Computing. Wenngleich diese Techniken einen Großteil des üblichen zeitlichen Sicherheitsabstandes einsparen können, bergen sie dennoch weitere Konsequenzen und Kompromisse. Bleibende Herausforderungen bei der Skalierung von CMOS Technologien führen außerdem zu einem verstärkten Fokus auf vielversprechende Zukunftstechnologien. Ein Beispiel dafür ist der Negative Capacitance Field-Effect Transistor (NCFET), der eine beachtenswerte Leistungssteigerung gegenüber herkömmlichen FinFET Transistoren aufweist und diese in Zukunft ersetzen könnte. Des Weiteren setzen Entwickler von Schaltkreisen vermehrt auf komplexe, parallele Strukturen statt auf höhere Taktfrequenzen. Diese komplexen Modelle benötigen moderne Power-Management Techniken in allen Aspekten des Designs. Mit dem Auftreten von neuartigen Transistortechnologien (wie zum Beispiel NCFET) müssen diese Power-Management Techniken neu bewertet werden, da sich Abhängigkeiten und Verhältnismäßigkeiten ändern. Diese Arbeit präsentiert neue Herangehensweisen, sowohl zur Analyse als auch zur Modellierung der Zuverlässigkeit von Schaltkreisen, um zuvor genannte Herausforderungen auf mehreren Designebenen anzugehen. Diese Herangehensweisen unterteilen sich in konventionelle Techniken ((a), (b), (c) und (d)) und unkonventionelle Techniken ((e) und (f)), wie folgt: (a)\textbf{(a)} Analyse von Leistungszunahmen in Zusammenhang mit der Maximierung von Leistungseffizienz beim Betrieb nahe der Transistor Schwellspannung, insbesondere am optimalen Leistungspunkt. Das genaue Ermitteln eines solchen optimalen Leistungspunkts ist eine besondere Herausforderung bei Multicore Designs, da dieser sich mit den jeweiligen Optimierungszielsetzungen und der Arbeitsbelastung verschiebt. (b)\textbf{(b)} Aufzeigen versteckter Interdependenzen zwischen Alterungseffekten bei Transistoren und Schwankungen in der Versorgungsspannung durch „IR-drops“. Eine neuartige Technik wird vorgestellt, die sowohl Über- als auch Unterschätzungen bei der Ermittlung des zeitlichen Sicherheitsabstands vermeidet und folglich den kleinsten, dennoch ausreichenden Sicherheitsabstand ermittelt. (c)\textbf{(c)} Eindämmung von Alterungseffekten bei Transistoren durch „Graceful Approximation“, eine Technik zur Erhöhung der Taktfrequenz bei Bedarf. Der durch Alterungseffekte bedingte zeitlich Sicherheitsabstand wird durch Approximate Computing Techniken ersetzt. Des Weiteren wird Quantisierung verwendet um ausreichend Genauigkeit bei den Berechnungen zu gewährleisten. (d)\textbf{(d)} Eindämmung von temperaturabhängigen Verschlechterungen der Signallaufzeit durch den Betrieb nahe des Null-Temperatur Koeffizienten (N-ZTC). Der Betrieb bei N-ZTC minimiert temperaturbedingte Abweichungen der Performance und der Leistungsaufnahme. Qualitative und quantitative Vergleiche gegenüber dem traditionellen zeitlichen Sicherheitsabstand werden präsentiert. (e)\textbf{(e)} Modellierung von Power-Management Techniken für NCFET-basierte Prozessoren. Die NCFET Technologie hat einzigartige Eigenschaften, durch die herkömmliche Verfahren zur Spannungs- und Frequenzskalierungen zur Laufzeit (DVS/DVFS) suboptimale Ergebnisse erzielen. Dies erfordert NCFET-spezifische Power-Management Techniken, die in dieser Arbeit vorgestellt werden. (f)\textbf{(f)} Vorstellung eines neuartigen heterogenen Multicore Designs in NCFET Technologie. Das Design beinhaltet identische Kerne; Heterogenität entsteht durch die Anwendung der individuellen, optimalen Konfiguration der Kerne. Amdahls Gesetz wird erweitert, um neue system- und anwendungsspezifische Parameter abzudecken und die Vorzüge des neuen Designs aufzuzeigen. Die Auswertungen der vorgestellten Techniken werden mithilfe von Implementierungen und Simulationen auf Schaltkreisebene (gate-level) durchgeführt. Des Weiteren werden Simulatoren auf Systemebene (system-level) verwendet, um Multicore Designs zu implementieren und zu simulieren. Zur Validierung und Bewertung der Effektivität gegenüber dem Stand der Technik werden analytische, gate-level und system-level Simulationen herangezogen, die sowohl synthetische als auch reale Anwendungen betrachten

    로직 및 피지컬 합성에서의 타이밍 분석과 최적화

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    학위논문 (박사) -- 서울대학교 대학원 : 공과대학 전기·정보공학부, 2020. 8. 김태환.Timing analysis is one of the necessary steps in the development of a semiconductor circuit. In addition, it is increasingly important in the advanced process technologies due to various factors, including the increase of process–voltage–temperature variation. This dissertation addresses three problems related to timing analysis and optimization in logic and physical synthesis. Firstly, most static timing analysis today are based on conventional fixed flip-flop timing models, in which every flip-flop is assumed to have a fixed clock-to-Q delay. However, setup and hold skews affect the clock-to-Q delay in reality. In this dissertation, I propose a mathematical formulation to solve the problem and apply it to the clock skew scheduling problems as well as to the analysis of a given circuit, with a scalable speedup technique. Secondly, near-threshold computing is one of the promising concepts for energy-efficient operation of VLSI systems, but wide performance variation and nonlinearity to process variations block the proliferation. To cope with this, I propose a holistic hardware performance monitoring methodology for accurate timing prediction in a near-threshold voltage regime and advanced process technology. Lastly, an asynchronous circuit is one of the alternatives to the conventional synchronous style, and asynchronous pipeline circuit especially attractive because of its small design effort. This dissertation addresses the synthesis problem of lightening two-phase bundled-data asynchronous pipeline controllers, in which delay buffers are essential for guaranteeing the correct handshaking operation but incurs considerable area increase.타이밍 분석은 반도체 회로 개발 필수 과정 중 하나로, 최신 공정일수록 공정-전압-온도 변이 증가를 포함한 다양한 요인으로 하여금 그 중요성이 커지고 있다. 본 논문에서는 로직 및 피지컬 합성과 관련하여 세 가지 타이밍 분석 및 최적화 문제에 대해 다룬다. 첫째로, 오늘날 대부분의 정적 타이밍 분석은 모든 플립-플롭의 클럭-출력 딜레이가 고정된 값이라는 가정을 바탕으로 이루어졌다. 하지만 실제 클럭-출력 딜레이는 해당 플립-플롭의 셋업 및 홀드 스큐에 영향을 받는다. 본 논문에서는 이러한 특성을 수학적으로 정리하였으며, 이를 확장 가능한 속도 향상 기법과 더불어 주어진 회로의 타이밍 분석 및 클럭 스큐 스케쥴링 문제에 적용하였다. 둘째로, 유사 문턱 연산은 초고집적 회로 동작의 에너지 효율을 끌어 올릴 수 있다는 점에서 각광받지만, 큰 폭의 성능 변이 및 비선형성 때문에 널리 활용되고 있지 않다. 이를 해결하기 위해 유사 문턱 전압 영역 및 최신 공정 노드에서 보다 정확한 타이밍 예측을 위한 하드웨어 성능 모니터링 방법론 전반을 제안하였다. 마지막으로, 비동기 회로는 기존 동기 회로의 대안 중 하나로, 그 중에서도 비동기 파이프라인 회로는 비교적 적은 설계 노력만으로도 구현 가능하다는 장점이 있다. 본 논문에서는 2위상 묶음 데이터 프로토콜 기반 비동기 파이프라인 컨트롤러 상에서, 정확한 핸드셰이킹 통신을 위해 삽입된 딜레이 버퍼에 의한 면적 증가를 완화할 수 있는 합성 기법을 제시하였다.1 INTRODUCTION 1 1.1 Flexible Flip-Flop Timing Model 1 1.2 Hardware Performance Monitoring Methodology 4 1.3 Asynchronous Pipeline Controller 10 1.4 Contributions of this Dissertation 15 2 ANALYSIS AND OPTIMIZATION CONSIDERING FLEXIBLE FLIP-FLOP TIMING MODEL 17 2.1 Preliminaries 17 2.1.1 Terminologies 17 2.1.2 Timing Analysis 20 2.1.3 Clock-to-Q Delay Surface Modeling 21 2.2 Clock-to-Q Delay Interval Analysis 22 2.2.1 Derivation 23 2.2.2 Additional Constraints 26 2.2.3 Analysis: Finding Minimum Clock Period 28 2.2.4 Optimization: Clock Skew Scheduling 30 2.2.5 Scalable Speedup Technique 33 2.3 Experimental Results 37 2.3.1 Application to Minimum Clock Period Finding 37 2.3.2 Application to Clock Skew Scheduling 39 2.3.3 Efficacy of Scalable Speedup Technique 43 2.4 Summary 44 3 HARDWARE PERFORMANCE MONITORING METHODOLOGY AT NTC AND ADVANCED TECHNOLOGY NODE 45 3.1 Overall Flow of Proposed HPM Methodology 45 3.2 Prerequisites to HPM Methodology 47 3.2.1 BEOL Process Variation Modeling 47 3.2.2 Surrogate Model Preparation 49 3.3 HPM Methodology: Design Phase 52 3.3.1 HPM2PV Model Construction 52 3.3.2 Optimization of Monitoring Circuits Configuration 54 3.3.3 PV2CPT Model Construction 58 3.4 HPM Methodology: Post-Silicon Phase 60 3.4.1 Transfer Learning in Silicon Characterization Step 60 3.4.2 Procedures in Volume Production Phase 61 3.5 Experimental Results 62 3.5.1 Experimental Setup 62 3.5.2 Exploration of Monitoring Circuits Configuration 64 3.5.3 Effectiveness of Monitoring Circuits Optimization 66 3.5.4 Considering BEOL PVs and Uncertainty Learning 68 3.5.5 Comparison among Different Prediction Flows 69 3.5.6 Effectiveness of Prediction Model Calibration 71 3.6 Summary 73 4 LIGHTENING ASYNCHRONOUS PIPELINE CONTROLLER 75 4.1 Preliminaries and State-of-the-Art Work 75 4.1.1 Bundled-data vs. Dual-rail Asynchronous Circuits 75 4.1.2 Two-phase vs. Four-phase Bundled-data Protocol 76 4.1.3 Conventional State-of-the-Art Pipeline Controller Template 77 4.2 Delay Path Sharing for Lightening Pipeline Controller Template 78 4.2.1 Synthesizing Sharable Delay Paths 78 4.2.2 Validating Logical Correctness for Sharable Delay Paths 80 4.2.3 Reformulating Timing Constraints of Controller Template 81 4.2.4 Minimally Allocating Delay Buffers 87 4.3 In-depth Pipeline Controller Template Synthesis with Delay Path Reusing 88 4.3.1 Synthesizing Delay Path Units 88 4.3.2 Validating Logical Correctness of Delay Path Units 89 4.3.3 Updating Timing Constraints for Delay Path Units 91 4.3.4 In-depth Synthesis Flow Utilizing Delay Path Units 95 4.4 Experimental Results 99 4.4.1 Environment Setup 99 4.4.2 Piecewise Linear Modeling of Delay Path Unit Area 99 4.4.3 Comparison of Power, Performance, and Area 102 4.5 Summary 107 5 CONCLUSION 109 5.1 Chapter 2 109 5.2 Chapter 3 110 5.3 Chapter 4 110 Abstract (In Korean) 127Docto
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