Choose-Your-Own Adventure: A Lightweight, High-Performance Approach To Defect And Variation Mitigation In Reconfigurable Logic

For field-programmable gate arrays (FPGAs), fine-grained pre-computed alternative configurations, combined with simple test-based selection, produce limited per-chip specialization to counter yield loss, increased delay, and increased energy costs that come from fabrication defects and variation. This lightweight approach achieves much of the benefit of knowledge-based full specialization while reducing to practical, palatable levels the computational, testing, and load-time costs that obstruct the application of the knowledge-based approach. In practice this may more than double the power-limited computational capabilities of dies fabricated with 22nm technologies. Contributions of this work: • Choose-Your-own-Adventure (CYA), a novel, lightweight, scalable methodology to achieve defect and variation mitigation • Implementation of CYA, including preparatory components (generation of diverse alternative paths) and FPGA load-time components • Detailed performance characterization of CYA – Comparison to conventional loading and dynamic frequency and voltage scaling (DFVS) – Limit studies to characterize the quality of the CYA implementation and identify potential areas for further optimizatio

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Improving timing verification and delay testing methodologies for IC designs

textThe task of ensuring the correct temporal behavior of IC designs, both before and after fabrication, is extremely important. It is becoming even more imperative as the demand for performance increases and process technology advances into the deep sub-micron region. This dissertation tackles the key issues in the timing verification and delay testing methodologies. An efficient methodology is presented to identify false timing paths in the timing verification methodology which utilizes ATPG technique and timing information from an ordered list of timing paths according to the delay information. This dissertation also presents a speed binning methodology which utilizes structural delay tests successfully instead of functional tests. In addition, it establishes a methodology which quantifies the correlation between the timing verification prediction and actual silicon measurement of timing paths. This quantification methodology lays the foundation for further research to study the impact of deep submicron effects on design performanceElectrical and Computer Engineerin

Techniques for Improving Security and Trustworthiness of Integrated Circuits

The integrated circuit (IC) development process is becoming increasingly vulnerable to malicious activities because untrusted parties could be involved in this IC development flow. There are four typical problems that impact the security and trustworthiness of ICs used in military, financial, transportation, or other critical systems: (i) Malicious inclusions and alterations, known as hardware Trojans, can be inserted into a design by modifying the design during GDSII development and fabrication. Hardware Trojans in ICs may cause malfunctions, lower the reliability of ICs, leak confidential information to adversaries or even destroy the system under specifically designed conditions. (ii) The number of circuit-related counterfeiting incidents reported by component manufacturers has increased significantly over the past few years with recycled ICs contributing the largest percentage of the total reported counterfeiting incidents. Since these recycled ICs have been used in the field before, the performance and reliability of such ICs has been degraded by aging effects and harsh recycling process. (iii) Reverse engineering (RE) is process of extracting a circuit’s gate-level netlist, and/or inferring its functionality. The RE causes threats to the design because attackers can steal and pirate a design (IP piracy), identify the device technology, or facilitate other hardware attacks. (iv) Traditional tools for uniquely identifying devices are vulnerable to non-invasive or invasive physical attacks. Securing the ID/key is of utmost importance since leakage of even a single device ID/key could be exploited by an adversary to hack other devices or produce pirated devices. In this work, we have developed a series of design and test methodologies to deal with these four challenging issues and thus enhance the security, trustworthiness and reliability of ICs. The techniques proposed in this thesis include: a path delay fingerprinting technique for detection of hardware Trojans, recycled ICs, and other types counterfeit ICs including remarked, overproduced, and cloned ICs with their unique identifiers; a Built-In Self-Authentication (BISA) technique to prevent hardware Trojan insertions by untrusted fabrication facilities; an efficient and secure split manufacturing via Obfuscated Built-In Self-Authentication (OBISA) technique to prevent reverse engineering by untrusted fabrication facilities; and a novel bit selection approach for obtaining the most reliable bits for SRAM-based physical unclonable function (PUF) across environmental conditions and silicon aging effects

Testing microelectronic biofluidic systems

According to the 2005 International Technology Roadmap for Semiconductors, the integration of emerging nondigital CMOS technologies will require radically different test methods, posing a major challenge for designers and test engineers. One such technology is microelectronic fluidic (MEF) arrays, which have rapidly gained importance in many biological, pharmaceutical, and industrial applications. The advantages of these systems, such as operation speed, use of very small amounts of liquid, on-board droplet detection, signal conditioning, and vast digital signal processing, make them very promising. However, testable design of these devices in a mass-production environment is still in its infancy, hampering their low-cost introduction to the market. This article describes analog and digital MEF design and testing method

Addressing Manufacturing Challenges in NoC-based ULSI Designs

Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669

Fault modeling, delay evaluation and path selection for delay test under process variation in nano-scale VLSI circuits

Delay test in nano-scale VLSI circuits becomes more difficult with shrinking technology feature sizes and rising clock frequencies. In this dissertation, we study three challenging issues in delay test: fault modeling, variational delay evaluation and path selection under process variation. Previous research of fault modeling on resistive spot defects, such as resistive opens and bridges in the interconnect, and resistive shorts in devices, lacked an accurate fault model. As a result it was difficult to perform fault simulation and select the best vectors. Conventional methods to compute variational delay under process variation are either slow or inaccurate. On the problem of path selection under process variation, previous approaches either choose too many paths, or missed the path that is necessary to be tested. We present new solutions in this dissertation. A new fault model that clearly and comprehensively expresses the relationship between electrical behaviors and resistive spots is proposed. Then the effect of process variations on path delays is modeled with a linear function and a fast method to compute coefficients of the linear function is also derived. Finally, we present the new path pruning algorithms that efficiently prune unimportant paths for test, and as a result we select as few as possible paths for test while the fault coverage is satisfied. The experimental results show that the new solutions are efficient and accurate

Power efficient resilient microarchitectures for PVT variability mitigation

Nowadays, the high power density and the process, voltage, and temperature variations became the most critical issues that limit the performance of the digital integrated circuits because of the continuous scaling of the fabrication technology. Dynamic voltage and frequency scaling technique is used to reduce the power consumption while different time relaxation techniques and error recovery microarchitectures are used to tolerate the process, voltage, and temperature variations. These techniques reduce the throughput by scaling down the frequency or flushing and restarting the errant pipeline. This thesis presents a novel resilient microarchitecture which is called ERSUT-based resilient microarchitecture to tolerate the induced delays generated by the voltage scaling or the process, voltage, and temperature variations. The resilient microarchitecture detects and recovers the induced errors without flushing the pipeline and without scaling down the operating frequency. An ERSUT-based resilient 16 × 16 bit MAC unit, implemented using Global Foundries 65 nm technology and ARM standard cells library, is introduced as a case study with 18.26% area overhead and up to 1.5x speedup. At the typical conditions, the maximum frequency of the conventional MAC unit is about 375 MHz while the resilient MAC unit operates correctly at a frequency up to 565 MHz. In case of variations, the resilient MAC unit tolerates induced delays up to 50% of the clock period while keeping its throughput equal to the conventional MAC unit’s maximum throughput. At 375 MHz, the resilient MAC unit is able to scale down the supply voltage from 1.2 V to 1.0 V saving about 29% of the power consumed by the conventional MAC unit. A double-edge-triggered microarchitecture is also introduced to reduce the power consumption extremely by reducing the frequency of the clock tree to the half while preserving the same maximum throughput. This microarchitecture is applied to different ISCAS’89 benchmark circuits in addition to the 16x16 bit MAC unit and the average power reduction of all these circuits is 63.58% while the average area overhead is 31.02%. All these circuits are designed using Global Foundries 65nm technology and ARM standard cells library. Towards the full automation of the ERSUT-based resilient microarchitecture, an ERSUT-based algorithm is introduced in C++ to accelerate the design process of the ERSUT-based microarchitecture. The developed algorithm reduces the design-time efforts dramatically and allows the ERSUT-based microarchitecture to be adopted by larger industrial designs. Depending on the ERSUT-based algorithm, a validation study about applying the ERSUT-based microarchitecture on the MAC unit and different ISCAS’89 benchmark circuits with different complexity weights is introduced. This study shows that 72% of these circuits tolerates more than 14% of their clock periods and 54.5% of these circuits tolerates more than 20% while 27% of these circuits tolerates more than 30%. Consequently, the validation study proves that the ERSUT-based resilient microarchitecture is a valid applicable solution for different circuits with different complexity weights

Adaptive, High-Resolution Ultrasound Phased Array Imaging for use in the Inspection of Laser Brazed Joints in the Automotive Sector

The inspection of welded and brazed joints has been performed in several industries using ultrasonic phased array. In the automotive sector, many of the current standards for brazed joint inspection do not apply due to the high variations in surface geometry and limited accessibility to the inspection region. As the automotive industry looks to integrate laser brazing into the production process, the need to determine the size and geometry of the joint, as well as the presence of any defects, is desirable to ensure product quality and reduce costs. Currently, the use of destructive techniques, such as cross-sectioning, is employed in the inspection process, with the ultimate desire being the shift to non-destructive methods. With this in mind, ultrasonic techniques have been investigated as a possible testing method. Ultrasound techniques have evolved over the decades, starting from a single element and eventually moving to phased array techniques. Recently, the investigation of the full matrix capture method has become popular in the field of ultrasound imaging. This technique, which separates the data acquisition process from the image formation process poses a viable solution to the inspection of laser brazed joints due to the ability to compensate for varying surfaces in post-processing.In this work, we make use of this technique, deriving the image formation process as an inverse problem for an arbitrary set of ultrasonic emitters and receivers. From this, the image formation process becomes equivalent to solving the inhomogeneous Helmholtz equation. By approximating the solutions to such an equation using the ray series expansion, an estimation of the solutions can be found in a time-efficient manner. When these solutions are found, the inverse process can be rewritten as a weighted, time-delayed summation of the acquired ultrasonic data. In current work, further approximations to this image formation process are often made; however, in the inspection of the laser braze process, these approximations are found to degrade image quality in a number of cases. In this work, we propose our second order corrections as a viable solution to increase the limit under which ultrasound imaging can currently occur. This is accomplished through the design of an ultrasonic array transducer and the manufacturing of a series of simulated defects, with the final assessment being performed on real joints.These techniques were found to improve imaging in a select set of samples when the radius of curvature dropped below 2 mm. In these cases, the use of the amplitude weighting was found to drastically improve system resolution, allowing for the determination of joint size, geometry and the presence of defects