Head-of-Line Blocking Reduction in Power-Efficient Networks-on-Chip

Tesis por compendioNowadays, thanks to the continuous improvements in the integration scale, more and more cores are added on the same chip, leading to higher system performance. In order to interconnect all nodes, a network-on-chip (NoC) is used, which is in charge of delivering data between cores. However, increasing the number of cores leads to a significant power consumption increase, leading the NoC to be one of the most expensive components in terms of power. Because of this, during the last years, several mechanisms have been proposed to address the NoC power consumption by means of DVFS (Dynamic Voltage and Frequency Scaling) and power-gating strategies. Nevertheless, improvements achieved by these mechanisms are achieved, to a greater or lesser extent, at the cost of system performance, potentially increasing the risk of saturating the network by forming congested points which, in turn, compromise the rest of the system functionality. One side effect is the creation of the "Head-of-Line blocking" effect where congested packets at the head of queues prevent other non-blocked packets from advancing. To address this issue, in this thesis, on one hand, we propose novel congestion control techniques in order to improve system performance by removing the "Head-of-Line" blocking effect. On the other hand, we propose combined solutions adapted to DVFS in order to achieve improvements in terms of performance and power. In addition to this, we propose a path-aware power-gating-based mechanism, which is capable of detecting the flows sharing buffer resources along data paths and perform to switch them off when not needed. With all these combined solutions we can significantly reduce the power consumption of the NoC when compared with state-of-the-art proposals.Hoy en día, gracias a las mejoras en la escala de integración cada vez se integran más y más núcleos en un mismo chip, mejorando así sus prestaciones. Para interconectar todos los nodos dentro del chip se emplea una red en chip (NoC, Network-on-Chip), la cual es la encargada de intercambiar información entre núcleos. No obstante, aumentar el número de núcleos en el chip también conlleva a su vez un importante incremento en el consumo de la NoC, haciendo que ésta se convierta en una de las partes más caras del chip en términos de consumo. Por ello, en los últimos años se han propuesto diversas técnicas de ahorro de energía orientadas a reducir el consumo de la NoC mediante el uso de DVFS (Dynamic Voltage and Frequency Scaling) o estrategias basadas en "power-gating". Sin embargo, éstas mejoras de consumo normalmente se obtienen a costa de sacrificar, en mayor o menor medida, las prestaciones del sistema, aumentado potencialmente así el riesgo de saturar la red, generando puntos de congestión que, a su vez, comprometen el rendimiento del resto del sistema. Un efecto colateral es el "Head-of-Line blocking", mediante el que paquetes congestionados en la cabeza de la cola impiden que otros paquetes no congestionados avancen. Con el fin de solucionar este problema, en ésta tesis, en primer lugar, proponemos técnicas novedosas de control de congestión para incrementar el rendimiento del sistema mediante la eliminación del "Head-of-Line blocking", mientras que, por otra parte, proponemos soluciones combinadas adaptadas a DVFS con el fin de conseguir mejoras en términos de rendimiento y energía. Además, proponemos una técnica de "power-gating" orientada a rutas de datos, la cual es capaz de detectar flujos de datos compartiendo recursos a lo largo de rutas y apagar dichos recursos de forma dinámica cuando no son necesarios. Con todas éstas soluciones combinadas podemos reducir el consumo de energía de la NoC en comparación con otras técnicas presentes en el estado del arte.Hui en dia, gr\`acies a les millores en l'escala d'integraci\'o, cada vegada s'integren m\'es i m\'es nuclis en un mateix xip, la qual cosa millora les seues prestacions. Per tal d'interconectar tots els nodes dins el xip es fa \'us d'una Xarxa en Xip (NoC; Network-on-Chip), la qual \'es l'encarregada d'intercanviar informaci\'o entre els nuclis. No obstant aix\`o, incrementar el nombre de nuclis en el xip tamb\'e comporta un important augment en el consum de la NoC, la qual cosa fa que aquesta es convertisca en una de les parts m\'es costoses del xip en termes de consum. Per aix\`o, en els \'ultims anys s'han proposat diverses t\`ecniques d'estalvi d'energia orientades a reduir el consum de la NoC mitjançant l'\'us de DVFS (Dynamic Voltage and Frequency Scaling) o estrat\`egies basades en ``power-gating''. Malgrat aix\`o, aquestes millores en les prestacions normalment s'obtenen a costa de sacrificar, en major o menor mesura, les prestacions del sistema i augmenta aix\'i el risc de saturar la xarxa al generar-se punts de congesti\'o, que al mateix temps, comprometen el rendiment de la resta del sistema. Un efecte col-lateral \'es el ``Head-of- Line blocking'', mitjançant el qual, els paquets congestionats al cap de la cua, impedixen que altres paquets no congestionats avancen. A fi de solucionar eixe problema, en aquesta tesi, en primer lloc, proposem noves t\`ecniques de control de congesti\'o amb l'objectiu d'incrementar el rendiment del sistema per mitj\`a de l'eliminaci\'o del ``Head-of- Line blocking'', i d'altra banda, proposem solucions combinades adaptades a DVFS amb la finalitat d'aconseguir millores en termes de rendiment i energia. A m\'es, proposem una t\`ecnica de ``power-gating'' orientada a rutes de dades, la qual \'es capa\c c de detectar fluxos de dades al compartir recursos al llarg de les rutes i apagar eixos recursos de forma din\`amica quan no s\'on necessaris. Amb totes aquestes solucions combinades podem reduir el consum d'energia de la NoC en comparaci\'o amb altres t\`ecniques presents en l'estat de l'art.Escamilla López, JV. (2017). Head-of-Line Blocking Reduction in Power-Efficient Networks-on-Chip [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/90419TESISCompendi

Zuverlässige und Energieeffiziente gemischt-kritische Echtzeit On-Chip Systeme

Multi- and many-core embedded systems are increasingly becoming the target for many applications that require high performance under varying conditions. A resulting challenge is the control, and reliable operation of such complex multiprocessing architectures under changes, e.g., high temperature and degradation. In mixed-criticality systems where many applications with varying criticalities are consolidated on the same execution platform, fundamental isolation requirements to guarantee non-interference of critical functions are crucially important. While Networks-on-Chip (NoCs) are the prevalent solution to provide scalable and efficient interconnects for the multiprocessing architectures, their associated energy consumption has immensely increased. Specifically, hard real-time NoCs must manifest limited energy consumption as thermal runaway in such a core shared resource jeopardizes the whole system guarantees. Thus, dynamic energy management of NoCs, as opposed to the related work static solutions, is highly necessary to save energy and decrease temperature, while preserving essential temporal requirements. In this thesis, we introduce a centralized management to provide energy-aware NoCs for hard real-time systems. The design relies on an energy control network, developed on top of an existing switch arbitration network to allow isolation between energy optimization and data transmission. The energy control layer includes local units called Power-Aware NoC controllers that dynamically optimize NoC energy depending on the global state and applications’ temporal requirements. Furthermore, to adapt to abnormal situations that might occur in the system due to degradation, we extend the concept of NoC energy control to include the entire system scope. That is, online resource management employing hierarchical control layers to treat system degradation (imminent core failures) is supported. The mechanism applies system reconfiguration that involves workload migration. For mixed-criticality systems, it allows flexible boundaries between safety-critical and non-critical subsystems to safely apply the reconfiguration, preserving fundamental safety requirements and temporal predictability. Simulation and formal analysis-based experiments on various realistic usecases and benchmarks are conducted showing significant improvements in NoC energy-savings and in treatment of system degradation for mixed-criticality systems improving dependability over the status quo.Eingebettete Many- und Multi-core-Systeme werden zunehmend das Ziel für Anwendungen, die hohe Anfordungen unter unterschiedlichen Bedinungen haben. Für solche hochkomplexed Multi-Prozessor-Systeme ist es eine grosse Herausforderung zuverlässigen Betrieb sicherzustellen, insbesondere wenn sich die Umgebungseinflüsse verändern. In Systeme mit gemischter Kritikalität, in denen viele Anwendungen mit unterschiedlicher Kritikalität auf derselben Ausführungsplattform bedient werden müssen, sind grundlegende Isolationsanforderungen zur Gewährleistung der Nichteinmischung kritischer Funktionen von entscheidender Bedeutung. Während On-Chip Netzwerke (NoCs) häufig als skalierbare Verbindung für die Multiprozessor-Architekturen eingesetzt werden, ist der damit verbundene Energieverbrauch immens gestiegen. Daher sind dynamische Plattformverwaltungen, im Gegensatz zu den statischen, zwingend notwendig, um ein System an die oben genannten Veränderungen anzupassen und gleichzeitig Timing zu gewährleisten. In dieser Arbeit entwickeln wir energieeffiziente NoCs für harte Echtzeitsysteme. Das Design basiert auf einem Energiekontrollnetzwerk, das auf einem bestehenden Switch-Arbitration-Netzwerk entwickelt wurde, um eine Isolierung zwischen Energieoptimierung und Datenübertragung zu ermöglichen. Die Energiesteuerungsschicht umfasst lokale Einheiten, die als Power-Aware NoC-Controllers bezeichnet werden und die die NoC-Energie in Abhängigkeit vom globalen Zustand und den zeitlichen Anforderungen der Anwendungen optimieren. Darüber hinaus wird das Konzept der NoC-Energiekontrolle zur Anpassung an Anomalien, die aufgrund von Abnutzung auftreten können, auf den gesamten Systemumfang ausgedehnt. Online- Ressourcenverwaltungen, die hierarchische Kontrollschichten zur Behandlung Abnutzung (drohender Kernausfälle) einsetzen, werden bereitgestellt. Bei Systemen mit gemischter Kritikalität erlaubt es flexible Grenzen zwischen sicherheitskritischen und unkritischen Subsystemen, um die Rekonfiguration sicher anzuwenden, wobei grundlegende Sicherheitsanforderungen erhalten bleiben und Timing Vorhersehbarkeit. Experimente werden auf der Basis von Simulationen und formalen Analysen zu verschiedenen realistischen Anwendungsfallen und Benchmarks durchgeführt, die signifikanten Verbesserungen bei On-Chip Netzwerke-Energieeinsparungen und bei der Behandlung von Abnutzung für Systeme mit gemischter Kritikalität zur Verbesserung die Systemstabilität gegenüber dem bisherigen Status quo zeigen

Energy-Efficient and Reliable Computing in Dark Silicon Era

Dark silicon denotes the phenomenon that, due to thermal and power constraints, the fraction of transistors that can operate at full frequency is decreasing in each technology generation. Moore’s law and Dennard scaling had been backed and coupled appropriately for five decades to bring commensurate exponential performance via single core and later muti-core design. However, recalculating Dennard scaling for recent small technology sizes shows that current ongoing multi-core growth is demanding exponential thermal design power to achieve linear performance increase. This process hits a power wall where raises the amount of dark or dim silicon on future multi/many-core chips more and more. Furthermore, from another perspective, by increasing the number of transistors on the area of a single chip and susceptibility to internal defects alongside aging phenomena, which also is exacerbated by high chip thermal density, monitoring and managing the chip reliability before and after its activation is becoming a necessity. The proposed approaches and experimental investigations in this thesis focus on two main tracks: 1) power awareness and 2) reliability awareness in dark silicon era, where later these two tracks will combine together. In the first track, the main goal is to increase the level of returns in terms of main important features in chip design, such as performance and throughput, while maximum power limit is honored. In fact, we show that by managing the power while having dark silicon, all the traditional benefits that could be achieved by proceeding in Moore’s law can be also achieved in the dark silicon era, however, with a lower amount. Via the track of reliability awareness in dark silicon era, we show that dark silicon can be considered as an opportunity to be exploited for different instances of benefits, namely life-time increase and online testing. We discuss how dark silicon can be exploited to guarantee the system lifetime to be above a certain target value and, furthermore, how dark silicon can be exploited to apply low cost non-intrusive online testing on the cores. After the demonstration of power and reliability awareness while having dark silicon, two approaches will be discussed as the case study where the power and reliability awareness are combined together. The first approach demonstrates how chip reliability can be used as a supplementary metric for power-reliability management. While the second approach provides a trade-off between workload performance and system reliability by simultaneously honoring the given power budget and target reliability

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast

An Artificial Neural Networks based Temperature Prediction Framework for Network-on-Chip based Multicore Platform

Continuous improvement in silicon process technologies has made possible the integration of hundreds of cores on a single chip. However, power and heat have become dominant constraints in designing these massive multicore chips causing issues with reliability, timing variations and reduced lifetime of the chips. Dynamic Thermal Management (DTM) is a solution to avoid high temperatures on the die. Typical DTM schemes only address core level thermal issues. However, the Network-on-chip (NoC) paradigm, which has emerged as an enabling methodology for integrating hundreds to thousands of cores on the same die can contribute significantly to the thermal issues. Moreover, the typical DTM is triggered reactively based on temperature measurements from on-chip thermal sensor requiring long reaction times whereas predictive DTM method estimates future temperature in advance, eliminating the chance of temperature overshoot. Artificial Neural Networks (ANNs) have been used in various domains for modeling and prediction with high accuracy due to its ability to learn and adapt. This thesis concentrates on designing an ANN prediction engine to predict the thermal profile of the cores and Network-on-Chip elements of the chip. This thermal profile of the chip is then used by the predictive DTM that combines both core level and network level DTM techniques. On-chip wireless interconnect which is recently envisioned to enable energy-efficient data exchange between cores in a multicore environment, will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM schemes

Low-Power Embedded Design Solutions and Low-Latency On-Chip Interconnect Architecture for System-On-Chip Design

This dissertation presents three design solutions to support several key system-on-chip (SoC) issues to achieve low-power and high performance. These are: 1) joint source and channel decoding (JSCD) schemes for low-power SoCs used in portable multimedia systems, 2) efficient on-chip interconnect architecture for massive multimedia data streaming on multiprocessor SoCs (MPSoCs), and 3) data processing architecture for low-power SoCs in distributed sensor network (DSS) systems and its implementation. The first part includes a low-power embedded low density parity check code (LDPC) - H.264 joint decoding architecture to lower the baseband energy consumption of a channel decoder using joint source decoding and dynamic voltage and frequency scaling (DVFS). A low-power multiple-input multiple-output (MIMO) and H.264 video joint detector/decoder design that minimizes energy for portable, wireless embedded systems is also designed. In the second part, a link-level quality of service (QoS) scheme using unequal error protection (UEP) for low-power network-on-chip (NoC) and low latency on-chip network designs for MPSoCs is proposed. This part contains WaveSync, a low-latency focused network-on-chip architecture for globally-asynchronous locally-synchronous (GALS) designs and a simultaneous dual-path routing (SDPR) scheme utilizing path diversity present in typical mesh topology network-on-chips. SDPR is akin to having a higher link width but without the significant hardware overhead associated with simple bus width scaling. The last part shows data processing unit designs for embedded SoCs. We propose a data processing and control logic design for a new radiation detection sensor system generating data at or above Peta-bits-per-second level. Implementation results show that the intended clock rate is achieved within the power target of less than 200mW. We also present a digital signal processing (DSP) accelerator supporting configurable MAC, FFT, FIR, and 3-D cross product operations for embedded SoCs. It consumes 12.35mW along with 0.167mm2 area at 333MHz

Combined Dynamic Thermal Management Exploiting Broadcast-Capable Wireless Network-on-Chip Architecture

With the continuous scaling of device dimensions, the number of cores on a single die is constantly increasing. This integration of hundreds of cores on a single die leads to high power dissipation and thermal issues in modern Integrated Circuits (ICs). This causes problems related to reliability, timing violations and lifetime of electronic devices. Dynamic Thermal Management (DTM) techniques have emerged as potential solutions that mitigate the increasing temperatures on a die. However, considering the scaling of system sizes and the adoption of the Network-on-Chip (NoC) paradigm to serve as the interconnection fabric exacerbates the problem as both cores and NoC elements contribute to the increased heat dissipation on the chip. Typically, DTM techniques can either be proactive or reactive. Proactive DTM techniques, where the system has the ability to predict the thermal profile of the chip ahead of time are more desirable than reactive DTM techniques where the system utilizes thermal sensors to determine the current temperature of the chip. Moreover, DTM techniques either address core or NoC level thermal issues separately. Hence, this thesis proposes a combined proactive DTM technique that integrates both core level and NoC level DTM techniques. The combined DTM mechanism includes a dynamic temperature-aware routing approach for the NoC level elements, and includes task reallocation heuristics for the core level elements. On-chip wireless interconnects recently envisioned to enable energy-efficient data exchange between cores in a multicore chip will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM. Combining the proactive DTM technique with on-chip wireless interconnects, the on-chip temperature is restricted within target temperatures without significantly affecting the performance of the NoC based interconnection fabric of the multicore chip

Towards Optimal Application Mapping for Energy-Efficient Many-Core Platforms

Siirretty Doriast

Embedded dynamic programming networks for networks-on-chip

PhD ThesisRelentless technology downscaling and recent technological advancements in three dimensional integrated circuit (3D-IC) provide a promising prospect to realize heterogeneous system-on-chip (SoC) and homogeneous chip multiprocessor (CMP) based on the networks-onchip (NoCs) paradigm with augmented scalability, modularity and performance. In many cases in such systems, scheduling and managing communication resources are the major design and implementation challenges instead of the computing resources. Past research efforts were mainly focused on complex design-time or simple heuristic run-time approaches to deal with the on-chip network resource management with only local or partial information about the network. This could yield poor communication resource utilizations and amortize the benefits of the emerging technologies and design methods. Thus, the provision for efficient run-time resource management in large-scale on-chip systems becomes critical. This thesis proposes a design methodology for a novel run-time resource management infrastructure that can be realized efficiently using a distributed architecture, which closely couples with the distributed NoC infrastructure. The proposed infrastructure exploits the global information and status of the network to optimize and manage the on-chip communication resources at run-time. There are four major contributions in this thesis. First, it presents a novel deadlock detection method that utilizes run-time transitive closure (TC) computation to discover the existence of deadlock-equivalence sets, which imply loops of requests in NoCs. This detection scheme, TC-network, guarantees the discovery of all true-deadlocks without false alarms in contrast to state-of-the-art approximation and heuristic approaches. Second, it investigates the advantages of implementing future on-chip systems using three dimensional (3D) integration and presents the design, fabrication and testing results of a TC-network implemented in a fully stacked three-layer 3D architecture using a through-silicon via (TSV) complementary metal-oxide semiconductor (CMOS) technology. Testing results demonstrate the effectiveness of such a TC-network for deadlock detection with minimal computational delay in a large-scale network. Third, it introduces an adaptive strategy to effectively diffuse heat throughout the three dimensional network-on-chip (3D-NoC) geometry. This strategy employs a dynamic programming technique to select and optimize the direction of data manoeuvre in NoC. It leads to a tool, which is based on the accurate HotSpot thermal model and SystemC cycle accurate model, to simulate the thermal system and evaluate the proposed approach. Fourth, it presents a new dynamic programming-based run-time thermal management (DPRTM) system, including reactive and proactive schemes, to effectively diffuse heat throughout NoC-based CMPs by routing packets through the coolest paths, when the temperature does not exceed chip’s thermal limit. When the thermal limit is exceeded, throttling is employed to mitigate heat in the chip and DPRTM changes its course to avoid throttled paths and to minimize the impact of throttling on chip performance. This thesis enables a new avenue to explore a novel run-time resource management infrastructure for NoCs, in which new methodologies and concepts are proposed to enhance the on-chip networks for future large-scale 3D integration.Iraqi Ministry of Higher Education and Scientific Research (MOHESR)

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures