Low-Power, High-Speed Transceivers for Network-on-Chip Communication

Networks on chips (NoCs) are becoming popular as they provide a solution for the interconnection problems on large integrated circuits (ICs). But even in a NoC, link-power can become unacceptably high and data rates are limited when conventional data transceivers are used. In this paper, we present a low-power, high-speed source-synchronous link transceiver which enables a factor 3.3 reduction in link power together with an 80% increase in data-rate. A low-swing capacitive pre-emphasis transmitter in combination with a double-tail sense-amplifier enable speeds in excess of 9 Gb/s over a 2 mm twisted differential interconnect, while consuming only 130 fJ/transition without the need for an additional supply. Multiple transceivers can be connected back-to-back to create a source-synchronous transceiver-chain with a wave-pipelined clock, operating with 6sigma offset reliability at 5 Gb/s

CMOS Transmitter using Pulse-Width Modulation Pre-Emphasis achieving 33dB Loss Compensation at 5-Gb/s

A digital transmitter pre-emphasis technique is presented that is based on pulse-width modulation, instead of finite impulse response (FIR) filtering. The technique fits well to future high-speed low-voltage CMOS processes. A 0.13 /spl mu/m CMOS transmitter achieves more than 5 Gb/s (2-PAM) over 25 m of standard RG-58U low-end coaxial copper cable. The test chip compensates for up to 33 dB of channel loss at the fundamental signaling frequency (2.5 GHz), which is the highest figure compared to literature

An Energy-Efficient Reconfigurable Mobile Memory Interface for Computing Systems

The critical need for higher power efficiency and bandwidth transceiver design has significantly increased as mobile devices, such as smart phones, laptops, tablets, and ultra-portable personal digital assistants continue to be constructed using heterogeneous intellectual properties such as central processing units (CPUs), graphics processing units (GPUs), digital signal processors, dynamic random-access memories (DRAMs), sensors, and graphics/image processing units and to have enhanced graphic computing and video processing capabilities. However, the current mobile interface technologies which support CPU to memory communication (e.g. baseband-only signaling) have critical limitations, particularly super-linear energy consumption, limited bandwidth, and non-reconfigurable data access. As a consequence, there is a critical need to improve both energy efficiency and bandwidth for future mobile devices.;The primary goal of this study is to design an energy-efficient reconfigurable mobile memory interface for mobile computing systems in order to dramatically enhance the circuit and system bandwidth and power efficiency. The proposed energy efficient mobile memory interface which utilizes an advanced base-band (BB) signaling and a RF-band signaling is capable of simultaneous bi-directional communication and reconfigurable data access. It also increases power efficiency and bandwidth between mobile CPUs and memory subsystems on a single-ended shared transmission line. Moreover, due to multiple data communication on a single-ended shared transmission line, the number of transmission lines between mobile CPU and memories is considerably reduced, resulting in significant technological innovations, (e.g. more compact devices and low cost packaging to mobile communication interface) and establishing the principles and feasibility of technologies for future mobile system applications. The operation and performance of the proposed transceiver are analyzed and its circuit implementation is discussed in details. A chip prototype of the transceiver was implemented in a 65nm CMOS process technology. In the measurement, the transceiver exhibits higher aggregate data throughput and better energy efficiency compared to prior works

Exploration and Design of High Performance Variation Tolerant On-Chip Interconnects

Siirretty Doriast

Segmented optical transmitter comprising a CMOS driver array and an InP IQ-MZM for advanced modulation formats

Segmented Mach-Zehnder modulators are promising solutions to generate complex modulation schemes in the migration towards optical links with a higher-spectral efficiency. We present an optical transmitter comprising a segmented-electrode InP IQ-MZM, capable of multilevel optical signal generation (5-bit per I/Q arm) by employing direct digital drive from integrated, low-power (1W) CMOS binary drivers. We discuss the advantages and design tradeoffs of the segmented driver structure and the implementation in a 40 nm CMOS technology. Multilevel operation with combined phase and amplitude modulation is demonstrated experimentally on a single MZM of the device for 2-ASK-2PSK and 4-ASK-2-PSK, showing potential for respectively 16-QAM and 64-QAM modulation in future assemblies

SWIFT: A Low-Power Network-On-Chip Implementing the Token Flow Control Router Architecture With Swing-Reduced Interconnects

A 64-bit, 8 × 8 mesh network-on-chip (NoC) is presented that uses both new architectural and circuit design techniques to improve on-chip network energy-efficiency, latency, and throughput. First, we propose token flow control, which enables bypassing of flit buffering in routers, thereby reducing buffer size and their power consumption. We also incorporate reduced-swing signaling in on-chip links and crossbars to minimize datapath interconnect energy. The 64-node NoC is experimentally validated with a 2 × 2 test chip in 90 nm, 1.2 V CMOS that incorporates traffic generators to emulate the traffic of the full network. Compared with a fully synthesized baseline 8 × 8 NoC architecture designed to meet the same peak throughput, the fabricated prototype reduces network latency by 20% under uniform random traffic, when both networks are run at their maximum operating frequencies. When operated at the same frequencies, the SWIFT NoC reduces network power by 38% and 25% at saturation and low loads, respectively

Silicon-Organic Hybrid (SOH) Mach-Zehnder Modulators for 100 Gbit/s On-Off Keying

Electro-optic modulators for high-speed on-off keying (OOK) are key components of short- and mediumreach interconnects in data-center networks. Besides small footprint and cost-efficient large-scale production, small drive voltages and ultra-low power consumption are of paramount importance for such devices. Here we demonstrate that the concept of silicon-organic hybrid (SOH) integration is perfectly suited for meeting these challenges. The approach combines the unique processing advantages of large-scale silicon photonics with unrivalled electro-optic (EO) coefficients obtained by molecular engineering of organic materials. In our proof-of-concept experiments, we demonstrate generation and transmission of OOK signals with line rates of up to 100 Gbit/s using a 1.1 mm-long SOH Mach-Zehnder modulator (MZM) which features a {\pi}-voltage of only 0.9 V. This experiment represents not only the first demonstration of 100 Gbit/s OOK on the silicon photonic platform, but also leads to the lowest drive voltage and energy consumption ever demonstrated at this data rate for a semiconductor-based device. We support our experimental results by a theoretical analysis and show that the nonlinear transfer characteristic of the MZM can be exploited to overcome bandwidth limitations of the modulator and of the electric driver circuitry. The devices are fabricated in a commercial silicon photonics line and can hence be combined with the full portfolio of standard silicon photonic devices. We expect that high-speed power-efficient SOH modulators may have transformative impact on short-reach optical networks, enabling compact transceivers with unprecedented energy efficiency that will be at the heart of future Ethernet interfaces at Tbit/s data rates