Efficiency Comparison of Inductor-, Capacitor- and Resonant-based Converters Fully Integrated in CMOS Technology

International audienceThe full integration of DC-DC converters offers great promise for dramatic reduction in power consumption and the number of board-level components in complex systems on chip. Some papers compare the numerous published on-chip and on-die converter structures, but there is the need for an approach to accurately compare the main basic DC-DC conversion topologies. Therefore, this paper presents a method to compare the efficiencies of CMOS integrated capacitive-, inductive-and resonant-based switching converters. The loss mechanism of each structure in hard-switching conditions is detailed and the analytical equations of the power loss and output voltage are given as a function of few CMOS technology parameters. The resulting models can be used to accurately predict converter efficiency in the early design phase, to compare the basic structure in particular the technology node or to orient the passive choice. The proposed method is then applied to design, optimize and compare fully-integrated power delivery requirements on a 1mm 2 on-die area in 65nm CMOS technology over three decades of power density. The results also underline the high efficiency of the promising resonant-based converter. Index Terms—integrated switching power supply, on-chip voltage regulator, switched-capacitor converter, inductive power converter, resonant converte

Investigation of the power-clock network impact on adiabatic logic

International audienceAdiabatic logic is architecture design style which seems to be a good candidate to reduce the power consumption of digital cores. One key difference is that the power supply is also the clock signal. A lot of work on different adiabatic logic families has been done but the impact of the power supply and the power-clock network still remains to be studied. In this paper, we investigate the power-clock network effect on adiabatic energy dissipation. We derive closed-form analytical formulas to represent the output signal voltage and energy dissipation while taking into account the parasitic impedance of the power-clock network with respect to switching frequency such that adiabatic conditions are still met. Experiments, based on simulation, show that the power-clock network impacts both the energy efficiency of the circuit and its frequency

Dual-Input Switched Capacitor Converter Suitable for Wide Voltage gain Range

International audienceThe capacitive-based switching converter suffers from low efficiency, except for a few conversion ratios, thus limiting its use in fine dynamic voltage and frequency scaling for the power management of digital circuits. Therefore, this paper proposes a Multiple Input Single Output Switched Capacitor Converter (MISO-CSC) to provide flatness efficiency over a large voltage gain range. First, the power efficiency calculation in MISO configuration is given, and then the best ones to optimize the number of switched capacitor structures is selected. By using two power supplies, the MISO converter produces 18 ratios instead of three in SISO (Single Input Single Output) mode. Using a CMOS 65nm technology, the transistor-based simulations exhibit an average 15% efficiency gain over a 0.5-1.4V output voltage range compared to the SISO-CSC. Index Terms— switched capacitor converter, multi-input converter, power efficiency optimization, fully integrated voltage regulator, dynamic voltage and frequency scaling

High-current integrated battery chargers for mobile applications

Battery charging circuits for mobile applications, such as smart phones and tablets, require both small area and low losses. In addition, to reduce the charging time, high current is needed through the converter. In this work, exploration of the Buck, the 3-Level Buck and the Hybrid Buck converter is performed over the input voltage, the total FET area and the load current. An analytical loss model for each topology is constructed and constrated by experimental results. In addition, packaging and bond wire impact on on-chip losses is analyzed by 3D modeling. Finally, a comparison between the topologies is presented determining potential candidates for a maximum on-chip loss of 2 W at output voltage of 4 V and 10 A of output current