The Effect Of Adding Silver Nanoparticles In Tin Surface Finish Electroplated With Ultrasonication On Wettability And Strength Of SAC305 Solder Joint

The development of electronic packaging has introduced various types of surface finish on copper substrate to improve bonding performance of solder. This affects the soldering and the intermetallic compound that formed at the solder/substrate interface which eventually influence the reliability of solder joint. The purpose of this study is to develop nanocomposite coating by co-depositing Ag nanoparticles into Sn via ultrasonic-assisted electroplating technique with ultrasonication. Sn coating and Sn/AgNPs coating were prepared using electroplating process with incorporation of 0W, 10W, 20W, 40W, 60W, and 80W ultrasonication. Phase analysis via X-ray diffraction was done to assess phases in the coating, and thickness of coating was measured via scanning electron microscope. Coatings were later analysed for surface roughness via atomic force microscope, before proceeded to reflow of commercial SAC305 solder at 250oC for 150 seconds. Wetting angle of solder reflowed on coated substrate was measured and single-lap joint shear test was done to assess strength of solder joint. The results demonstrated that coating electroplated with ultrasonication of 40W exhibited the lowest surface roughness (4.07μm and 13.44μm) and the thickest coating layer (6.61μm and 11.3μm) for Sn coating and Sn/AgNPs coating respectively. Sn/AgNPs coating exhibited higher surface roughness and thicker coating layer compared with Sn coating. The lowest surface roughness obtained by coatings with 40W ultrasonication exhibited the best wettability with the lowest contact angle (20o-22o). The addition of Ag nanoparticles in Sn coating resulted in thicker IMCs layer of solder joint (4.33μm-5.95μm), but significantly reduced the contact angle by mitigating surface tension of bulk solder and improved the shear strength of SAC305 solder alloy due to lower contact angle

種々の表面処理を行った鉛フリーハンダ接合部の機械的性質と信頼性

Tohoku University小池淳一課

Properties and behaviour of Pb-free solders in flip-chip scale solder interconnections

Due to pending legislations and market pressure, lead-free solders will replace Sn–Pb solders in 2006. Among the lead-free solders being studied, eutectic Sn–Ag, Sn–Cu and Sn–Ag–Cu are promising candidates and Sn–3.8Ag–0.7Cu could be the most appropriate replacement due to its overall balance of properties. In order to garner more understanding of lead-free solders and their application in flip-chip scale packages, the properties of lead free solders, including the wettability, intermetallic compound (IMC) growth and distribution, mechanical properties, reliability and corrosion resistance, were studied and are presented in this thesis. [Continues.

Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications

Ph.DDOCTOR OF PHILOSOPH

PCB Quality Metrics that Drive Reliability (PD 18)

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions

Study of ionic contamination in electronic product assembly

Dissertação de mestrado em Chemical Analysis and Characterization TechniquesThe ever-growing demand for better PCB (printed circuit board) performance as well as component miniaturization and increasing density, are all challenges the automotive industry is facing nowadays. However, these alterations in the PCB layout alongside changes in production materials and techniques may jeopardize product reliability. One of the factors that has the ability to threaten PCB functioning is the introduction of ionic contaminants that increase the probability of electrochemical reactions and premature circuit failures. Methods have been created along the years in order to evaluate the presence of these contaminants on printed boards; one of them is the ROSE (Resistivity of Solvent Extract) test. This thesis aimed to study the ionic contamination in electronic product assembly using the CM22 contaminometer, a ROSE test machine. Essentially, this project was divided in two studies. The first one was the study of ROSE machine response and establishment of parameters to test its performance at Bosch Car Multimedia Portugal S.A. The results revealed that although the relation between the machine response and the dissolved contamination was linear, there was some disparity in values of PCBs from the same product family. The temperature and regeneration time of the extraction bath were identified as possible influencers of this discrepancy. Further tests showed temperature is not a significant factor for this behaviour and, at lower contamination levels, the regeneration time has little impact. The second study intended to evaluate the ionic contamination levels of printed circuit boards in 5 different stages of their production run. This research revealed that the ROSE levels of the PCBs obtained from the supplier decrease during the first steps of the process. Solder paste application, component insertion and reflow steps do not introduce much ionic residues on the board surface. Yet, the most important conclusion to this study is that the flux used for rework and selective soldering greatly increases surface contamination presence. In conclusion, the CM22 ROSE contaminometer is suitable to monitor processes in assembly plants. It can detect contamination trends at a process line and can be used as process control tool especially in a no-clean soldering process like the one used in Bosch. For this reason, the evaluation of ionic content should be carried out in different stages of PCBA production since it can be very deceptive to do them only after reflow process as it normally done.A crescente demanda por melhor desempenho de PCBs (placas de circuito impresso), bem como a miniaturização de componentes e o aumento da sua densidade, são desafios que a indústria automóvel enfrenta atualmente. No entanto, as alterações no seu design juntamente com as mudanças nos materiais e técnicas de produção podem comprometer a fiabilidade destas placas. Um dos fatores que tem a capacidade de ameaçar o funcionamento de um PCB é a introdução de contaminantes iónicos capazes de criar falhas elétricas no circuito. Vários métodos foram criados para avaliar a presença destes contaminantes em placas impressas; um deles é o teste ROSE (Resistividade do Extrato Solvente). Esta tese teve como objetivo o estudo da contaminação iónica na montagem de produtos eletrónicos utilizando o contaminometer CM22, um dispositivo de teste ROSE. Para isto, primeiro estudou-se a resposta da máquina ROSE e estabeleceu-se parâmetros para testar o seu desempenho na Bosch Car Multimedia Portugal S.A. Os resultados revelaram que embora a relação entre a resposta do aparelho e a contaminação dissolvida seja linear, existiu alguma disparidade nos valores de placas da mesma família. A temperatura e o tempo de regeneração do banho foram identificados como possíveis influenciadores desta discrepância. Testes adicionais mostraram que a temperatura não influencia este comportamento e, em níveis de contaminação mais baixos, o tempo de regeneração tem pouco impacto. O segundo estudo pretendia avaliar os níveis de contaminação iónica de placas de circuito impresso em 5 fases diferentes da sua montagem. Este estudo permitiu verificar que o PCB obtido do fornecedor possui um nível de ROSE que diminui ao longo dos primeiros passos do processo. As etapas de aplicação da pasta de solda, inserção dos componentes e refluxo não introduzem muitos resíduos à superfície da placa. No entanto, a conclusão mais importante deste estudo é que o fluxo usado para retrabalho e soldadura seletiva aumentam muito a contaminação na superfície das placas. Em conclusão, o contaminometer CM22 é adequado para monitorizar os processos de fabrico. Ele pode detetar tendências de contaminação na linha de produção e pode ser usado como ferramenta de controlo de processo, especialmente num processo sem limpeza como o da Bosch. Por esse motivo, a avaliação do conteúdo iónico deve ser realizada em diferentes etapas da produção de PCBAs, dado que pode ser enganoso fazê-lo somente após o refluxo, como normalmente é

Controlling tin nucleation and grain orientations in Pb-free solders

Lead-free solder joints made with Sn-Ag-Cu or Sn-Ag solders usually contain only a single βSn grain or three twinned βSn grains which are oriented differently in every joint. Due to the anisotropy of βSn every joint therefore has unique thermomechanical properties and, in an array of numerous joints, it is likely that some will be poorly oriented and could cause early failure of a component. The problems of few grains with variable orientation can be attributed to the nucleation of βSn. This thesis explores catalyzing βSn nucleation using heterogeneous nucleation and develops methods to control βSn microstructures and orientations in Sn-3Ag-0.5Cu/Cu solder joints. The developed droplet nucleation technique in this study provides a new ‘motorway’ for heterogeneous nucleation study, and the introduced orientation control method paves the way to solve chronic problems, such as electromigration, thermomechanical fatigue, and shear fatigue in the electronic packaging industry. It is found that Co additions and Co substrates are effective at catalyzing βSn nucleation. This is demonstrated to be due to heterogeneous nucleation on αCoSn3 crystals. By using a ‘droplet nucleation technique’, in which Sn droplets are solidified directly on an intermetallic compound (IMC) particle, it is proved that αCoSn3 forms a reproducible orientation relationship (OR) with βSn that has a good lattice match. Strong grain refinement occurred in 60g Co-microalloyed Sn-3.0Ag-0.5Cu samples but only weak grain refinement occurred in 550μm solder balls and joints. When soldering Sn-3.0Ag-0.5Cu on Co substrates, βSn is always observed to grow from the interfacial αCoSn3 layer with an orientation inherited from the αCoSn3 layer texture. However, it is shown that nucleation on the αCoSn3 layer does not give useful βSn orientation control. The droplet nucleation technique was then applied to gain a deeper understanding of βSn nucleation on a range of IMC phases. A family of transition metal stannides, PtSn4, PdSn4, and βIrSn4 that have similar crystal structures to αCoSn3, were identified as potent nucleants for βSn. The common solder IMCs, Cu6Sn5, Ag3Sn, Ni3Sn4, were also investigated. It was found that reproducible ORs formed on all IMCs studied and the nucleation mechanisms were explored by combining nucleation undercooling measurements with measured ORs. The nucleation potency of all studied intermetallics is: αCoSn3>βIrSn4 >PdSn4>PtSn4 >Ni3Sn4> Ag3Sn, Cu6Sn5. The droplet nucleation technique also generated new insights into solidification twinning in solder joints. It was found that cyclic twins formed in droplets when the undercooling was sufficiently high and the liquid contained Ag, Cu and/or Ni. Complex interrelated cyclic twins were found in droplets on Cu6Sn5, Ag3Sn, and Ni3Sn4 where up to five rings of cyclic twins formed each related by a common . The twinning mechanisms in these cases were explored and discussed. The thesis then applies the new understanding developed in the previous chapters to develop a technique to reliably control the orientation of βSn in solder joints. Ball grid array (BGA) joints were fabricated reproducibly by introducing an extra step into the manufacturing process: bonding a nucleant IMC ‘seed crystal’ onto each Cu pad so as to control the nucleation location, nucleation undercooling and crystallographic orientation of βSn at the moment of nucleation. Each joint made by this technique had a uniform single-grain microstructure with the c-axis of βSn parallel with the substrate plane. This orientation is reported in the literature to give the best resistance to electromigration and shear fatigue.Open Acces

Modeling the SAC microstructure evolution under thermal, thermomechanical and electrical constraints

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