Diagnosis of Multiple Scan-Chain Faults in the Presence of System Logic Defects

We present a combined hardware-software based approach to scan-chain diagnosis, when the outcome of a test may be affected by system faults occurring in the logic outside of the scan chain. For the hardware component we adopt the double-tree scan (DTS) chain architecture, which has previously been shown to be effective in reducing power, volume, and application time of tests for stuck-at and delay faults. We develop a version of flush test which can resolve a multiple fault in a DTS chain to a small number of suspect candidates. Further resolution to a unique multiple fault is enabled by the software component comprising of fault simulation and analysis of the response of the circuit to test patterns produced by ATPG. Experimental results on benchmark circuits show that near-perfect scan-chain diagnosis for multiple faults is possible even when a large number of random system faults are injected in the circuit

Scan Test Coverage Improvement Via Automatic Test Pattern Generation (Atpg) Tool Configuration

The scan test coverage improvement by using automatic test pattern generation (ATPG) tool configuration was investigated. Improving the test coverage is essential in detecting manufacturing defects in semiconductor industry so that high quality products can be supplied to consumers. The ATPG tool used was Mentor Graphics Tessent TestKompress (version 2014.1). The study was done by setting up a few experiments of utilizing and modifying ATPG commands and switches, observing the test coverage improvement from the statistical reports provided during pattern generation process and providing relatable discussions. By modifying the ATPG commands, it can be expected to have some improvement in the test coverage. The scan test patterns generated were stuck-at test patterns. Based on the experiments done, comparison was made on the different coverage readings and the most optimized method and flow of ATPG were determined. The most optimized flow gave an improvement of 0.91% in test coverage which is acceptable since this method does not involve a change in design. The test patterns generated were converted and tested using automatic test equipment (ATE) to observe its performance on real silicon. The test coverage improvement using ATPG tool instead of the design-based method is important as a faster workaround for back-end engineers to provide high quality test contents in such a short product development duration

Diagnosis of Multiple Scan-Chain Faults in the Presence of System Logic Defects

We present a combined hardware-software based approach to scan-chain diagnosis, when the outcome of a test may be affected by system faults occurring in the logic outside of the scan chain. For the hardware component we adopt the double-tree scan (DTS) chain architecture, which has previously been shown to be effective in reducing power, volume, and application time of tests for stuck-at and delay faults. We develop a version of flush test which can resolve a multiple fault in a DTS chain to a small number of suspect candidates. Further resolution to a unique multiple fault is enabled by the software component comprising of fault simulation and analysis of the response of the circuit to test patterns produced by ATPG. Experimental results on benchmark circuits show that near-perfect scan-chain diagnosis for multiple faults is possible even when a large number of random system faults are injected in the circuit

A Novel Sequence Generation Approach to Diagnose Faults in Reconfigurable Scan Networks

With the complexity of nanoelectronic devices rapidly increasing, an efficient way to handle large number of embedded instruments became a necessity. The IEEE 1687 standard was introduced to provide flexibility in accessing and controlling such instrumentation through a reconfigurable scan chain. Nowadays, together with testing the system for defects that may affect the scan chains themselves, the diagnosis of such faults is also important. This article proposes a method for generating stimuli to precisely identify permanent high-level faults in a IEEE 1687 reconfigurable scan chain: the system is modeled as a finite state automaton where faults correspond to multiple incorrect transitions; then, a dynamic greedy algorithm is used to select a sequence of inputs able to distinguish between all possible faults. Experimental results on the widely-adopted ITC'02 and ITC'16 benchmark suites, as well as on synthetically generated circuits, clearly demonstrate the applicability and effectiveness of the proposed approach: generated sequences are two orders of magnitude shorter compared to previous methodologies, while the computational resources required remain acceptable even for larger benchmarks

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Design of On-Chip Self-Testing Signature Register

Over the last few years, scan test has turn out to be too expensive to implement for industry standard designs due to increasing test data volume and test time. The test cost of a chip is mainly governed by the resource utilization of Automatic Test Equipment (ATE). Also, it directly depends upon test time that includes time required to load test program, to apply test vectors and to analyze generated test response of the chip. An issue of test time and data volume is increasingly appealing designers to use on-chip test data compactors, either on input side or output side or both. Such techniques significantly address the former issues but have little hold over increasing number of input-outputs under test mode. Further, test pins on DUT are increasing over the generations. Thus, scan channels on test floor are falling short in number for placement of such ICs. To address issues discussed above, we introduce an on-chip self-testing signature register. It comprises a response compactor and a comparator. The compactor compacts large chunk of response data to a small test signature whereas the comparator compares this test signature with desired one. The overall test result for the design is generated on single output pin. Being no storage of test response is demanded, the considerable reduction in ATE memory can be observed. Also, with only single pin to be monitored for test result, the number of tester channels and compare edges on ATE side significantly reduce at the end of the test. This cuts down maintenance and usage cost of test floor and increases its life time. Furthermore reduction in test pins gives scope for DFT engineers to increase number of scan chains so as to further reduce test time

Ensuring a High Quality Digital Device through Design for Testability

An electronic device is reliable if it is available for use most of the times throughout its life. The reliability can be affected by mishandling and use under abnormal operating conditions. High quality product cannot be achieved without proper verification and testing during the product development cycle. If the design is difficult to test, then it is very likely that most of the faults will not be detected before it is shipped to the customer. This paper describes how product quality can be improved by making the hardware design testable. Various designs for testability techniqueswere discussed. A three bit counter circuit was used to illustrate the benefits of design for testability by using scan chain methodology

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements