Analysis of CNT Bundle and Its Comparison with Copper Interconnect for CMOS and CNFET Drivers

In nanoscale regime as the CMOS process technology continues to scale, the standard copper (Cu) interconnect will become a major hurdle for onchip communication due to high resistivity and electromigration. This paper presents the comprehensive evaluation of mixed CNT bundle interconnects and investigates their prospects as a low power high-speed interconnect for future nanoscale-integrated circuits. The performance of mixed CNT bundle interconnect is examined with carbon nanotube field effect transistor (CNFET) as a driver and compared with the traditional interconnect, that is, CMOS driver on Cu interconnect. All HSPICE simulations are carried out at operating frequency of 1 GHz and it is found that mixed CNT bundle interconnects with CNFET as the driver can potentially provide a substantial delay reduction over traditional interconnects implemented at 32 nm process technology. Similarly, the CNFET driver with mixed CNT bundle as interconnect is more energy efficient than the traditional interconnect at all supply voltages (VDD) from 0.9 V to 0.3 V

A Modular Approach to Adaptive Reactive Streaming Systems

The latest generations of FPGA devices offer large resource counts that provide the headroom to implement large-scale and complex systems. However, there are increasing challenges for the designer, not just because of pure size and complexity, but also in harnessing effectively the flexibility and programmability of the FPGA. A central issue is the need to integrate modules from diverse sources to promote modular design and reuse. Further, the capability to perform dynamic partial reconfiguration (DPR) of FPGA devices means that implemented systems can be made reconfigurable, allowing components to be changed during operation. However, use of DPR typically requires low-level planning of the system implementation, adding to the design challenge. This dissertation presents ReShape: a high-level approach for designing systems by interconnecting modules, which gives a ‘plug and play’ look and feel to the designer, is supported by tools that carry out implementation and verification functions, and is carried through to support system reconfiguration during operation. The emphasis is on the inter-module connections and abstracting the communication patterns that are typical between modules – for example, the streaming of data that is common in many FPGA-based systems, or the reading and writing of data to and from memory modules. ShapeUp is also presented as the static precursor to ReShape. In both, the details of wiring and signaling are hidden from view, via metadata associated with individual modules. ReShape allows system reconfiguration at the module level, by supporting type checking of replacement modules and by managing the overall system implementation, via metadata associated with its FPGA floorplan. The methodology and tools have been implemented in a prototype for a broad domain-specific setting – networking systems – and have been validated on real telecommunications design projects

Développement des techniques de test et de diagnostic pour les FPGA hiérarchique de type mesh

The evolution trend of shrinking feature size and increasing complexity in modern electronics is being slowed down due to physical limits that generate numerous imperfections and defects during fabrication steps or projected life time of the chip. Field Programmable Gate Arrays (FPGAs) are used in complex digital systems mainly due to their reconfigurability and shorter time-to-market. To maintain a high reliability of such systems, FPGAs should be tested thoroughly for defects. FPGA architecture optimization for area saving and better signal routability is an ongoing process which directly impacts the overall FPGA testability, hence the reliability. This thesis presents a complete strategy for test and diagnosis of manufacturing defects in mesh-based FPGAs containing a novel multilevel interconnects topology which promises to provide better area and routability. Efficiency of the proposed test schemes is analyzed in terms of test cost, respective fault coverage and diagnostic resolution.L’évolution tendant à réduire la taille et augmenter la complexité des circuits électroniques modernes, est en train de ralentir du fait des limitations technologiques, qui génèrent beaucoup de d’imperfections et de defaults durant la fabrication ou la durée de vie de la puce. Les FPGAs sont utilisés dans les systèmes numériques complexes, essentiellement parce qu’ils sont reconfigurables et rapide à commercialiser. Pour garder une grande fiabilité de tels systèmes, les FPGAs doivent être testés minutieusement pour les defaults. L’optimisation de l’architecture des FPGAs pour l’économie de surface et une meilleure routabilité est un processus continue qui impacte directement la testabilité globale et de ce fait, la fiabilité. Cette thèse présente une stratégie complète pour le test et le diagnostique des defaults de fabrication des “mesh-based FPGA” contenant une nouvelle topologie d’interconnections à plusieurs niveaux, ce qui promet d’apporter une meilleure routabilité. Efficacité des schémas proposes est analysée en termes de temps de test, couverture de faute et résolution de diagnostique