Design and development of power processing units for applications in electrically-propelled satellite systems

Electrospray technology provides a way to ionize specialized liquids by applying high voltages across a sharp porous tip and a metallic mesh. This technology is widely used in the field of mass spectroscopy for generating ions for testing purposes. The dawn of nano-satellites posed new challenges in the miniaturization of many conventional satellite sub-systems. One significant challenge faced in such a process was the miniaturization of the propulsion system. Electrosprays have started to find their application in the field of Aerospace Engineering and now are formally known as Electrospray Thrusters. These thrusters provide high specific impulse and are attractive substitutes to conventional gas propelled thrusters as they can be scaled down in size and can also provide extended mission times. Some of the new challenges faced in such applications are the generation of high voltages from a low voltage onboard battery, grounding, spacecraft charging, clearance, and reliability issues for long term usage. In this work, a complete design process is developed for the realization of such high voltages suitable for interfacing with an electrospray thruster. Simulation models for a new type of converter are assessed, and its feasibility is discussed. A hardware prototype is implemented, and the practical results are assessed. An analysis of the converter is presented, and the semiconductor and passive components are selected. Magnetic components are designed based on the analysis. Parallels are drawn between the theoretical and prototype model of the concept converter. Finally, the firmware of the converter is explained, and the communication protocol of the PPU is delineated. As the boards designed for the converter have to sustain high voltages and reliably operate in unfavorable environments, special PCB layout considerations must be used, which also forces a designer to look for various other materials for the PCB fabrication --Abstract, page iv

A Low-Power, Reconfigurable, Pipelined ADC with Automatic Adaptation for Implantable Bioimpedance Applications

Biomedical monitoring systems that observe various physiological parameters or electrochemical reactions typically cannot expect signals with fixed amplitude or frequency as signal properties can vary greatly even among similar biosignals. Furthermore, advancements in biomedical research have resulted in more elaborate biosignal monitoring schemes which allow the continuous acquisition of important patient information. Conventional ADCs with a fixed resolution and sampling rate are not able to adapt to signals with a wide range of variation. As a result, reconfigurable analog-to-digital converters (ADC) have become increasingly more attractive for implantable biosensor systems. These converters are able to change their operable resolution, sampling rate, or both in order convert changing signals with increased power efficiency. Traditionally, biomedical sensing applications were limited to low frequencies. Therefore, much of the research on ADCs for biomedical applications focused on minimizing power consumption with smaller bias currents resulting in low sampling rates. However, recently bioimpedance monitoring has become more popular because of its healthcare possibilities. Bioimpedance monitoring involves injecting an AC current into a biosample and measuring the corresponding voltage drop. The frequency of the injected current greatly affects the amplitude and phase of the voltage drop as biological tissue is comprised of resistive and capacitive elements. For this reason, a full spectrum of measurements from 100 Hz to 10-100 MHz is required to gain a full understanding of the impedance. For this type of implantable biomedical application, the typical low power, low sampling rate analog-to-digital converter is insufficient. A different optimization of power and performance must be achieved. Since SAR ADC power consumption scales heavily with sampling rate, the converters that sample fast enough to be attractive for bioimpedance monitoring do not have a figure-of-merit that is comparable to the slower converters. Therefore, an auto-adapting, reconfigurable pipelined analog-to-digital converter is proposed. The converter can operate with either 8 or 10 bits of resolution and with a sampling rate of 0.1 or 20 MS/s. Additionally, the resolution and sampling rate are automatically determined by the converter itself based on the input signal. This way, power efficiency is increased for input signals of varying frequency and amplitude

All Digital, Background Calibration for Time-Interleaved and Successive Approximation Register Analog-to-Digital Converters

The growth of digital systems underscores the need to convert analog information to the digital domain at high speeds and with great accuracy. Analog-to-Digital Converter (ADC) calibration is often a limiting factor, requiring longer calibration times to achieve higher accuracy. The goal of this dissertation is to perform a fully digital background calibration using an arbitrary input signal for A/D converters. The work presented here adapts the cyclic Split-ADC calibration method to the time interleaved (TI) and successive approximation register (SAR) architectures. The TI architecture has three types of linear mismatch errors: offset, gain and aperture time delay. By correcting all three mismatch errors in the digital domain, each converter is capable of operating at the fastest speed allowed by the process technology. The total number of correction parameters required for calibration is dependent on the interleaving ratio, M. To adapt the Split-ADC method to a TI system, 2M+1 half-sized converters are required to estimate 3(2M+1) correction parameters. This thesis presents a 4:1 Split-TI converter that achieves full convergence in less than 400,000 samples. The SAR architecture employs a binary weight capacitor array to convert analog inputs into digital output codes. Mismatch in the capacitor weights results in non-linear distortion error. By adding redundant bits and dividing the array into individual unit capacitors, the Split-SAR method can estimate the mismatch and correct the digital output code. The results from this work show a reduction in the non-linear distortion with the ability to converge in less than 750,000 samples

Investigation of a GaN-Based Power Supply Topology Utilizing Solid State Transformer for Low Power Applications

Gallium nitride (GaN) power devices exhibit a much lower gate capacitance for a similar on-resistance than its silicon counterparts, making it highly desirable for high-frequency operation in switching converters, which leads to their significant benefits on power density, cost, and system volume. High-density switching converters are being realized with GaN power devices due to their high switching speeds that reduce the size of energy-storage circuit components. The purpose of this dissertation research is to investigate a new isolated GaN AC/DC switching converter based on solid-state transformer configuration with a totem-pole power factor corrector (PFC) front-end, a half-bridge series-resonant converter (SRC) for power conversion, and a current-doubler rectifier (CDR) at its output. A new equivalent circuit model for the converter is constructed consisting of a loss-free resistor model for the PFC rectifier with first harmonic approximation model for the SRC and the CDR. Then, state-space analysis is performed to derive the converter transfer function in order to design the controllers to yield sufficient phase margins. The converter offers the advantages of voltage regulation feature of the solid-state transformer, low harmonics and close-to-unity power factor of the PFC rectifier, soft-switching of the half-bridge SRC, reduced size of the high-frequency transformer, and smaller leakage inductance of the CDR which is used for low-voltage high-current applications as the CDR draws half of the load current in the transformer secondary side yielding less copper losses. A high-frequency nanocrystalline toroid transformer, based on a modified equation to determine its leakage inductance, is designed and fabricated to satisfy the performance specifications of the converter. A meticulously planned gate driving strategy together with a Kelvin-source return circuitry is used to mitigate Miller effects, minimize gate ringing, and minimize the parasitics of the pull-down and pull-up loops of the converter. A new programming method that combines MATLAB Simulink embedded coder with code composer studio for the TMS320F28335 digital signal processor (DSP) controller is developed and demonstrated. Finally, the GaN-based AC/DC converter is experimentally verified for a 120Vac to 48Vdc/60Vdc conversion operating at 100 kHz for various loadings

High Performance Power Management Integrated Circuits for Portable Devices

abstract: Portable devices often require multiple power management IC (PMIC) to power different sub-modules, Li-ion batteries are well suited for portable devices because of its small size, high energy density and long life cycle. Since Li-ion battery is the major power source for portable device, fast and high-efficiency battery charging solution has become a major requirement in portable device application. In the first part of dissertation, a high performance Li-ion switching battery charger is proposed. Cascaded two loop (CTL) control architecture is used for seamless CC-CV transition, time based technique is utilized to minimize controller area and power consumption. Time domain controller is implemented by using voltage controlled oscillator (VCO) and voltage controlled delay line (VCDL). Several efficiency improvement techniques such as segmented power-FET, quasi-zero voltage switching (QZVS) and switching frequency reduction are proposed. The proposed switching battery charger is able to provide maximum 2 A charging current and has an peak efficiency of 93.3%. By configure the charger as boost converter, the charger is able to provide maximum 1.5 A charging current while achieving 96.3% peak efficiency. The second part of dissertation presents a digital low dropout regulator (DLDO) for system on a chip (SoC) in portable devices application. The proposed DLDO achieve fast transient settling time, lower undershoot/overshoot and higher PSR performance compared to state of the art. By having a good PSR performance, the proposed DLDO is able to power mixed signal load. To achieve a fast load transient response, a load transient detector (LTD) enables boost mode operation of the digital PI controller. The boost mode operation achieves sub microsecond settling time, and reduces the settling time by 50% to 250 ns, undershoot/overshoot by 35% to 250 mV and 17% to 125 mV without compromising the system stability.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process