Graphics Processing Unit-Based Computer-Aided Design Algorithms for Electronic Design Automation

The electronic design automation (EDA) tools are a specific set of software that play important roles in modern integrated circuit (IC) design. These software automate the design processes of IC with various stages. Among these stages, two important EDA design tools are the focus of this research: floorplanning and global routing. Specifically, the goal of this study is to parallelize these two tools such that their execution time can be significantly shortened on modern multi-core and graphics processing unit (GPU) architectures. The GPU hardware is a massively parallel architecture, enabling thousands of independent threads to execute concurrently. Although a small set of EDA tools can benefit from using GPU to accelerate their speed, most algorithms in this field are designed with the single-core paradigm in mind. The floorplanning and global routing algorithms are among the latter, and difficult to render any speedup on the GPU due to their inherent sequential nature. This work parallelizes the floorplanning and global routing algorithm through a novel approach and results in significant speedups for both tools implemented on the GPU hardware. Specifically, with a complete overhaul of solution space and design space exploration, a GPU-based floorplanning algorithm is able to render 4-166X speedup, while achieving similar or improved solutions compared with the sequential algorithm. The GPU-based global routing algorithm is shown to achieve significant speedup against existing state-of-the-art routers, while delivering competitive solution quality. Importantly, this parallel model for global routing renders a stable solution that is independent from the level of parallelism. In summary, this research has shown that through a design paradigm overhaul, sequential algorithms can also benefit from the massively parallel architecture. The findings of this study have a positive impact on the efficiency and design quality of modern EDA design flow

Heurísticas bioinspiradas para el problema de Floorplanning 3D térmico de dispositivos MPSoCs

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadores y Automática, leída el 20-06-2013Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Manticore: Hardware-Accelerated RTL Simulation with Static Bulk-Synchronous Parallelism

The demise of Moore's Law and Dennard Scaling has revived interest in specialized computer architectures and accelerators. Verification and testing of this hardware heavily uses cycle-accurate simulation of register-transfer-level (RTL) designs. The best software RTL simulators can simulate designs at 1--1000~kHz, i.e., more than three orders of magnitude slower than hardware. Faster simulation can increase productivity by speeding design iterations and permitting more exhaustive exploration. One possibility is to use parallelism as RTL exposes considerable fine-grain concurrency. However, state-of-the-art RTL simulators generally perform best when single-threaded since modern processors cannot effectively exploit fine-grain parallelism. This work presents Manticore: a parallel computer designed to accelerate RTL simulation. Manticore uses a static bulk-synchronous parallel (BSP) execution model to eliminate runtime synchronization barriers among many simple processors. Manticore relies entirely on its compiler to schedule resources and communication. Because RTL code is practically free of long divergent execution paths, static scheduling is feasible. Communication and synchronization no longer incur runtime overhead, enabling efficient fine-grain parallelism. Moreover, static scheduling dramatically simplifies the physical implementation, significantly increasing the potential parallelism on a chip. Our 225-core FPGA prototype running at 475 MHz outperforms a state-of-the-art RTL simulator on an Intel Xeon processor running at $\approx$ 3.3 GHz by up to 27.9$\times$ (geomean 5.3$\times$) in nine Verilog benchmarks

AutoMM: Energy-Efficient Multi-Data-Type Matrix Multiply Design on Heterogeneous Programmable System-on-Chip

As the increasing complexity of Neural Network(NN) models leads to high demands for computation, AMD introduces a heterogeneous programmable system-on-chip (SoC), i.e., Versal ACAP architectures featured with programmable logic (PL), CPUs, and dedicated AI engines (AIE) ASICs which has a theoretical throughput up to 6.4 TFLOPs for FP32, 25.6 TOPs for INT16 and 102.4 TOPs for INT8. However, the higher level of complexity makes it non-trivial to achieve the theoretical performance even for well-studied applications like matrix-matrix multiply. In this paper, we provide AutoMM, an automatic white-box framework that can systematically generate the design for MM accelerators on Versal which achieves 3.7 TFLOPs, 7.5 TOPs, and 28.2 TOPs for FP32, INT16, and INT8 data type respectively. Our designs are tested on board and achieve gains of 7.20x (FP32), 3.26x (INT16), 6.23x (INT8) energy efficiency than AMD U250 FPGA, 2.32x (FP32) than Nvidia Jetson TX2 GPU, 1.06x (FP32), 1.70x (INT8) than Nvidia A100 GPU

Cross-layer design of thermally-aware 2.5D systems

Over the past decade, CMOS technology scaling has slowed down. To sustain the historic performance improvement predicted by Moore's Law, in the mid-2000s the computing industry moved to using manycore systems and exploiting parallelism. The on-chip power densities of manycore systems, however, continued to increase after the breakdown of Dennard's Scaling. This leads to the `dark silicon' problem, whereby not all cores can operate at the highest frequency or can be turned on simultaneously due to thermal constraints. As a result, we have not been able to take full advantage of the parallelism in manycore systems. One of the 'More than Moore' approaches that is being explored to address this problem is integration of diverse functional components onto a substrate using 2.5D integration technology. 2.5D integration provides opportunities to exploit chiplet placement flexibility to address the dark silicon problem and mitigate the thermal stress of today's high-performance systems. These opportunities can be leveraged to improve the overall performance of the manycore heterogeneous computing systems. Broadly, this thesis aims at designing thermally-aware 2.5D systems. More specifically, to address the dark silicon problem of manycore systems, we first propose a single-layer thermally-aware chiplet organization methodology for homogeneous 2.5D systems. The key idea is to strategically insert spacing between the chiplets of a 2.5D manycore system to lower the operating temperature, and thus reclaim dark silicon by allowing more active cores and/or higher operating frequency under a temperature threshold. We investigate manufacturing cost and thermal behavior of 2.5D systems, then formulate and solve an optimization problem that jointly maximizes performance and minimizes manufacturing cost. We then enhance our methodology by incorporating a cross-layer co-optimization approach. We jointly maximize performance and minimize manufacturing cost and operating temperature across logical, physical, and circuit layers. We propose a novel gas-station link design that enables pipelining in passive interposers. We then extend our thermally-aware optimization methodology for network routing and chiplet placement of heterogeneous 2.5D systems, which consist of central processing unit (CPU) chiplets, graphics processing unit (GPU) chiplets, accelerator chiplets, and/or memory stacks. We jointly minimize the total wirelength and the system temperature. Our enhanced methodology increases the thermal design power budget and thereby improves thermal-constraint performance of the system

Efficient architectures of heterogeneous fpga-gpu for 3-d medical image compression

The advent of development in three-dimensional (3-D) imaging modalities have generated a massive amount of volumetric data in 3-D images such as magnetic resonance imaging (MRI), computed tomography (CT), positron emission tomography (PET), and ultrasound (US). Existing survey reveals the presence of a huge gap for further research in exploiting reconfigurable computing for 3-D medical image compression. This research proposes an FPGA based co-processing solution to accelerate the mentioned medical imaging system. The HWT block implemented on the sbRIO-9632 FPGA board is Spartan 3 (XC3S2000) chip prototyping board. Analysis and performance evaluation of the 3-D images were been conducted. Furthermore, a novel architecture of context-based adaptive binary arithmetic coder (CABAC) is the advanced entropy coding tool employed by main and higher profiles of H.264/AVC. This research focuses on GPU implementation of CABAC and comparative study of discrete wavelet transform (DWT) and without DWT for 3-D medical image compression systems. Implementation results on MRI and CT images, showing GPU significantly outperforming single-threaded CPU implementation. Overall, CT and MRI modalities with DWT outperform in term of compression ratio, peak signal to noise ratio (PSNR) and latency compared with images without DWT process. For heterogeneous computing, MRI images with various sizes and format, such as JPEG and DICOM was implemented. Evaluation results are shown for each memory iteration, transfer sizes from GPU to CPU consuming more bandwidth or throughput. For size 786, 486 bytes JPEG format, both directions consumed bandwidth tend to balance. Bandwidth is relative to the transfer size, the larger sizing will take more latency and throughput. Next, OpenCL implementation for concurrent task via dedicated FPGA. Finding from implementation reveals, OpenCL on batch procession mode with AOC techniques offers substantial results where the amount of logic, area, register and memory increased proportionally to the number of batch. It is because of the kernel will copy the kernel block refer to batch number. Therefore memory bank increased periodically related to kernel block. It was found through comparative study that the tree balance and unroll loop architecture provides better achievement, in term of local memory, latency and throughput

TransCODE: Co-design of Transformers and Accelerators for Efficient Training and Inference

Automated co-design of machine learning models and evaluation hardware is critical for efficiently deploying such models at scale. Despite the state-of-the-art performance of transformer models, they are not yet ready for execution on resource-constrained hardware platforms. High memory requirements and low parallelizability of the transformer architecture exacerbate this problem. Recently-proposed accelerators attempt to optimize the throughput and energy consumption of transformer models. However, such works are either limited to a one-sided search of the model architecture or a restricted set of off-the-shelf devices. Furthermore, previous works only accelerate model inference and not training, which incurs substantially higher memory and compute resources, making the problem even more challenging. To address these limitations, this work proposes a dynamic training framework, called DynaProp, that speeds up the training process and reduces memory consumption. DynaProp is a low-overhead pruning method that prunes activations and gradients at runtime. To effectively execute this method on hardware for a diverse set of transformer architectures, we propose ELECTOR, a framework that simulates transformer inference and training on a design space of accelerators. We use this simulator in conjunction with the proposed co-design technique, called TransCODE, to obtain the best-performing models with high accuracy on the given task and minimize latency, energy consumption, and chip area. The obtained transformer-accelerator pair achieves 0.3% higher accuracy than the state-of-the-art pair while incurring 5.2$\times$ lower latency and 3.0$\times$ lower energy consumption