Optimizing the Use of Behavioral Locking for High-Level Synthesis

The globalization of the electronics supply chain requires effective methods to thwart reverse engineering and IP theft. Logic locking is a promising solution, but there are many open concerns. First, even when applied at a higher level of abstraction, locking may result in significant overhead without improving the security metric. Second, optimizing a security metric is application-dependent and designers must evaluate and compare alternative solutions. We propose a meta-framework to optimize the use of behavioral locking during the high-level synthesis (HLS) of IP cores. Our method operates on chip's specification (before HLS) and it is compatible with all HLS tools, complementing industrial EDA flows. Our meta-framework supports different strategies to explore the design space and to select points to be locked automatically. We evaluated our method on the optimization of differential entropy, achieving better results than random or topological locking: 1) we always identify a valid solution that optimizes the security metric, while topological and random locking can generate unfeasible solutions; 2) we minimize the number of bits used for locking up to more than 90% (requiring smaller tamper-proof memories); 3) we make better use of hardware resources since we obtain similar overheads but with higher security metric.Comment: Accepted for publication in IEEE Transactions on Computer-Aided Design of Integrated Circuits and System

ENABLING IOT AUTHENTICATION, PRIVACY AND SECURITY VIA BLOCKCHAIN

Although low-power and Internet-connected gadgets and sensors are increasingly integrated into our lives, the optimal design of these systems remains an issue. In particular, authentication, privacy, security, and performance are critical success factors. Furthermore, with emerging research areas such as autonomous cars, advanced manufacturing, smart cities, and building, usage of the Internet of Things (IoT) devices is expected to skyrocket. A single compromised node can be turned into a malicious one that brings down whole systems or causes disasters in safety-critical applications. This dissertation addresses the critical problems of (i) device management, (ii) data management, and (iii) service management in IoT systems. In particular, we propose an integrated platform solution for IoT device authentication, data privacy, and service security via blockchain-based smart contracts. We ensure IoT device authentication by blockchain-based IC traceability system, from its fabrication to its end-of-life, allowing both the supplier and a potential customer to verify an IC’s provenance. Results show that our proposed consortium blockchain framework implementation in Hyperledger Fabric for IC traceability achieves a throughput of 35 transactions per second (tps). To corroborate the blockchain information, we authenticate the IC securely and uniquely with an embedded Physically Unclonable Function (PUF). For reliable Weak PUF-based authentication, our proposed accelerated aging technique reduces the cumulative burn-in cost by ∼ 56%. We also propose a blockchain-based solution to integrate the privacy of data generated from the IoT devices by giving users control of their privacy. The smart contract controlled trust-base ensures that the users have private access to their IoT devices and data. We then propose a remote configuration of IC features via smart contracts, where an IC can be programmed repeatedly and securely. This programmability will enable users to upgrade IC features or rent upgraded IC features for a fixed period after users have purchased the IC. We tailor the hardware to meet the blockchain performance. Our on-die hardware module design enforces the hardware configuration’s secure execution and uses only 2,844 slices in the Xilinx Zedboard Zynq Evaluation board. The blockchain framework facilitates decentralized IoT, where interacting devices are empowered to execute digital contracts autonomously

Platform-based design, test and fast verification flow for mixed-signal systems on chip

This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG

Enhancing Processor Design Obfuscation Through Security-Aware On-Chip Memory and Data Path Design

A sizable body of work has identified the importance of architecture and application level security when using logic locking, a family of module level supply chain security techniques, to secure processor ICs. However, prior logic locking research proposes configuring logic locking using only module level considerations. To begin our work, we perform a systematic design space exploration of logic locking in modules throughout a processor IC. This exploration shows that locking with only module level considerations cannot guarantee architecture/application level security, regardless of the locking technique used. To remedy this, we propose a tool-driven security-aware approach to enhance the 2 most effective candidate locking locations, on-chip memory and data path. We show that through minor design modifications of the on-chip memory and data path architecture, one can exponentially improve the architecture/application level security of prior locking art with only a modest design overhead. Underlying our design space exploration and security-aware design approach is ObfusGEM, an open-source logic locking simulation framework released with this work to quantitatively evaluate the architectural effectiveness of logic locking in custom processor architecture configurations

Design of electronic systems for automotive sensor conditioning

This thesis deals with the development of sensor systems for automotive, mainly targeting the exploitation of the new generation of Micro Electro-Mechanical Sensors (MEMS), which achieve a dramatic reduction of area and power consumption but at the same time require more complexity in the sensor conditioning interface. Several issues concerning the development of automotive ASICs are presented, together with an overview of automotive electronics market and its main sensor applications. The state of the art for sensor interfaces design (the generic sensor interface concept), consists in sharing the same electronics among similar sensor applications, thus saving cost and time-to-market but also implementing a sub-optimal system with area and power overheads. A Platform Based Design methodology is proposed to overcome the limitations of generic sensor interfaces, by keeping the platform generality at the highest design layers and pursuing the maximum optimization and performances in the platform customization for a specific sensor. A complete design flow is presented (up to the ASIC implementation for gyro sensor conditioning), together with examples regarding IP development for reuse and low power optimization of third party designs. A further evolution of Platform Based Design has been achieved by means of implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform. ISIF is a highly programmable mixed-signal chip which allows a substantial reduction of design space exploration time, as it can implement in a short time a wide class of sensor conditioning architectures. Thus it lets the designers evaluate directly on silicon the impact of different architectural choices, as well as perform feasibility studies, sensor evaluations and accurate estimation of the resulting dedicated ASIC performances. Several case studies regarding fast prototyping possibilities with ISIF are presented: a magneto-resistive position sensor, a biosensor (which produces pA currents in presence of surface chemical reactions) and two capacitive inertial sensors, a gyro and a low-g YZ accelerometer. The accelerometer interface has also been implemented in miniboards of about 3 cm2 (with ISIF and sensor dies bonded together) and a series of automatic trimming and characterization procedures have been developed in order to evaluate sensor and interface behaviour over the automotive temperature range, providing a valuable feedback for the implementation of a dedicated accelerometer interface

System Design and Implementation for Hybrid Network Function Virtualization

With the application of virtualization technology in computer networks, many new research areas and techniques have been explored, such as network function virtualization (NFV). A significant benefit of virtualization is that it reduces the cost of a network system and increases its flexibility. Due to the increasing complexity of the network environment and constantly improving network scale and bandwidth, it is imperative to aim for higher performance, extensibility, and flexibility in the future network systems. In this dissertation, hybrid NFV platforms applying virtualization technology are proposed. We further explore the techniques used to improve the performance, scalability and resilience of these systems. In the first part of this dissertation, we describe a new heterogeneous hardware-software NFV platform that provides scalability and programmability while supporting significant hardware-level parallelism and reconfiguration. Our computing platform takes advantage of both field-programmable gate arrays (FPGAs) and microprocessors to implement numerous virtual network functions (VNFs) that can be dynamically customized to specific network flow needs. Traffic management and hardware reconfiguration functions are performed by a global coordinator which allows for the rapid sharing of network function states and continuous evaluation of network function needs. With the help of state sharing mechanism offered by the coordinator, customer-defined VNF instances can be easily migrated between heterogeneous middleboxes as the network environment changes. A resource allocation algorithm dynamically assesses resource deployments as network flows and conditions are updated. In the second part of this thesis document, we explore a new session-level approach for NFV that implements distributed agents in heterogeneous middleboxes to steer packets belonging to different sessions through session-specific service chains. Our session-level approach supports inter-domain service chaining with both FPGA- and processor-based middleboxes, dynamic reconfiguration of service chains for ongoing sessions, and the application of session-level approaches for UDP-based protocols. To demonstrate our approach, we establish inter-domain service chains for QUIC sessions, and reconfigure the service chains across a range of FPGA- and processor-based middleboxes. We show that our session-level approach can successfully reconfigure service chains for individual QUIC sessions. Compared with software implementations, the distributed agents implemented on FPGAs show better performance in various test scenarios

Design, implementation and experimental validation of a 5G energy-aware reconfigurable hotspot

Flexibility and energy efficiency are considered two principal requirements of future fifth generation (5G) systems. From an architectural point of view, centralized processing and a dense deployment of small cells will play a vital role in enabling the efficient and dynamic operation of 5G networks. In this context, reconfigurable hotspots will provide on-demand services and adapt their operation in accordance to traffic re quirements, constituting a vital element of the heterogeneous 5G network infrastructure. In this paper we present a reconfigurable hotspot which is able to flexibly distribute its underlying communication functions across the network, as well as to adapt various parameters affecting the generation of the transmitted signal. The reconfiguration of the hotspot focuses on minimizing its energy footprint, while accounting for the current operative requirements. A real-time hotspot prototype has been developed to facilitate the realistic evaluation of the energy saving gains of the proposed scheme. The development flexibly combines software (SW) and hardware (HW) accelerated (HWA) functions in order to enable the agile reconfiguration of the hotspot. Actual power consumption measurements are presented for various relevant 5G networking scenarios and hotspot configurations. This thorough characterization of the energy footprint of the different subsystems of the prototype allows to map reconfiguration strategies to different use cases. Finally, the energy-aware design and implementation of the hotspot prototype is widely detailed in an effort to underline its importance to the provision of the flexibility and energy efficiency to future 5G systems.This work was supported by the European Commission in the framework of the H2020-ICT-2014-2 project Flex5Gware (Grant agreement no. 671563). The work of CTTC was also partially supported by the Generalitat de Catalunya (2017 SGR 891) and by the Spanish Government under project TEC2014-58341-C4-4-R

Experimental Evaluation and Comparison of Time-Multiplexed Multi-FPGA Routing Architectures

Emulating large complex designs require multi-FPGA systems (MFS). However, inter-FPGA communication is confronted by the challenge of lack of interconnect capacity due to limited number of FPGA input/output (I/O) pins. Serializing parallel signals onto a single trace effectively addresses the limited I/O pin obstacle. Besides the multiplexing scheme and multiplexing ratio (number of inter-FPGA signals per trace), the choice of the MFS routing architecture also affect the critical path latency. The routing architecture of an MFS is the interconnection pattern of FPGAs, fixed wires and/or programmable interconnect chips. Performance of existing MFS routing architectures is also limited by off-chip interface selection. In this dissertation we proposed novel 2D and 3D latency-optimized time-multiplexed MFS routing architectures. We used rigorous experimental approach and real sequential benchmark circuits to evaluate and compare the proposed and existing MFS routing architectures. This research provides a new insight into the encouraging effects of using off-chip optical interface and three dimensional MFS routing architectures. The vertical stacking results in shorter off-chip links improving the overall system frequency with the additional advantage of smaller footprint area. The proposed 3D architectures employed serialized interconnect between intra-plane and inter-plane FPGAs to address the pin limitation problem. Additionally, all off-chip links are replaced by optical fibers that exhibited latency improvement and resulted in faster MFS. Results indicated that exploiting third dimension provided latency and area improvements as compared to 2D MFS. We also proposed latency-optimized planar 2D MFS architectures in which electrical interconnections are replaced by optical interface in same spatial distribution. Performance evaluation and comparison showed that the proposed architectures have reduced critical path delay and system frequency improvement as compared to conventional MFS. We also experimentally evaluated and compared the system performance of three inter-FPGA communication schemes i.e. Logic Multiplexing, SERDES and MGT in conjunction with two routing architectures i.e. Completely Connected Graph (CCG) and TORUS. Experimental results showed that SERDES attained maximum frequency than the other two schemes. However, for very high multiplexing ratios, the performance of SERDES & MGT became comparable