Arc tracking control in insulation systems for aeronautic applications: challenges, opportunities, and research needs

Next generation aircrafts will use more electrical power to reduce weight, fuel consumption, system complexity and greenhouse gas emissions. However, new failure modes and challenges arise related to the required voltage increase and consequent rise of electrical stress on wiring insulation materials, thus increasing the risk of electrical arc appearance. This work performs a critical and comprehensive review concerning arc tracking effects in wiring insulation systems, underlying mechanisms, role of materials and possible mitigation strategies, with a special focus on aircraft applications. To this end an evaluation of the scientific and technological state of the art is carried out from the analysis of theses, research articles, technical reports, international standards and white papers. This review paper also reports the limitations of existing insulation materials, standard test methods and mitigation approaches, while identifying the research needs to comply with the future demands of the aircraft industryPeer ReviewedPostprint (published version

IMPACT OF DUST ON THE RELIABILITY OF PRINTED CIRCUIT ASSEMBLIES

Dust is a ubiquitous component of the environments in which we live and work. It can deposit on printed circuit assembly to act as a source of ionic contamination. Two common consequences of dust contaminations in the printed circuit boards are loss of impedance (i.e., loss of surface insulation resistance) and electrochemical migration between traces and component leads. Both failure mechanisms involve the contamination forming a current leakage path on a printed circuit board. Based on studies on ionic contaminations, researchers have argued that the impact of dust in these two failure mechanisms is dependent on its pH, its hygroscopic compositions, and the critical relative humidity of the salts in it. However, due to the lack of experimental results and the complexity of dust compositions, the argument is not substantiated. Very few papers concerning the impact of different natural dusts on these two failure mechanisms can be found in the literature. In practice, mixtures of Arizona dust and salts are used as a substitute for dust in experiments. In this research, natural dusts were collected from four locations: natural outdoor and indoor dust samples from Massachusetts, U.S., natural outdoor dust from Tianjin, China, and the ISO standard test dust (Arizona test dust). Loss of impedance in dust contaminated printed circuit boards was investigated under controlled temperature (20ºC to 60ºC) and relative humidity (50% to 95%) ranges. The impact of dust on electrochemical migration and corrosion was evaluated under temperature-humidity-bias tests (50ºC, 90% RH, and 10 VDC). In addition to the conventional DC measurement where only resistive data can be obtained, electrochemical impedance spectroscopy were adopted to obtain nonlinear equivalent circuit models of the electrochemical process, which helps to understand the underlying physics-of-failure. The variation of impedance with relative humidity exhibited a transition range. Below the range, the impedance was constant, and above it, the impedance degraded by orders of magnitude. The value of the transition range decreased with an increase of dust deposition density. The equivalent circuit modeling showed that the dominant resistive path gradually shifted from the bulk to the interfacial with the increase of temperature from 20 ºC to 60 ºC. There were big variations among different dusts, which were quantified using the degradation factor introduced in the research, the critical transition range, and time-to-failure. This result demonstrated that a single salt or a mixture of compounds can not be representative of all dusts. It also indicated that using the ISO standard test dust in place of natural dust samples for reliability evaluation could lead to inaccurate results. Dust should be collected from the field in order to evaluate its impact. It is showed in this thesis that some critical characteristics of dust can be used to classify different dusts for the failure mechanisms of interest. Moisture sorption capability of dust can be used to classify different dusts regarding the loss of impedance failure. The dust with the highest moisture sorption capability had the highest degradation factor. Ion species/concentration or conductivity of dust aqueous solution can be used to classify dust regarding the electrochemical migration related failures. Dust with the highest ion concentration and conductivity had the lowest time-to-failure. The underlying principals behind those critical characteristics were described and discussed based on the physics-of-failure

PCB Quality Metrics that Drive Reliability (PD 18)

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions

Improved micro-contact resistance model that considers material deformation, electron transport and thin film characteristics

This paper reports on an improved analytic model forpredicting micro-contact resistance needed for designing microelectro-mechanical systems (MEMS) switches. The originalmodel had two primary considerations: 1) contact materialdeformation (i.e. elastic, plastic, or elastic-plastic) and 2) effectivecontact area radius. The model also assumed that individual aspotswere close together and that their interactions weredependent on each other which led to using the single effective aspotcontact area model. This single effective area model wasused to determine specific electron transport regions (i.e. ballistic,quasi-ballistic, or diffusive) by comparing the effective radius andthe mean free path of an electron. Using this model required thatmicro-switch contact materials be deposited, during devicefabrication, with processes ensuring low surface roughness values(i.e. sputtered films). Sputtered thin film electric contacts,however, do not behave like bulk materials and the effects of thinfilm contacts and spreading resistance must be considered. Theimproved micro-contact resistance model accounts for the twoprimary considerations above, as well as, using thin film,sputtered, electric contact

Time domain analysis of switching transient fields in high voltage substations

Switching operations of circuit breakers and disconnect switches generate transient currents propagating along the substation busbars. At the moment of switching, the busbars temporarily acts as antennae radiating transient electromagnetic fields within the substations. The radiated fields may interfere and disrupt normal operations of electronic equipment used within the substation for measurement, control and communication purposes. Hence there is the need to fully characterise the substation electromagnetic environment as early as the design stage of substation planning and operation to ensure safe operations of the electronic equipment. This paper deals with the computation of transient electromagnetic fields due to switching within a high voltage air-insulated substation (AIS) using the finite difference time domain (FDTD) metho

Study of ionic contamination in electronic product assembly

Dissertação de mestrado em Chemical Analysis and Characterization TechniquesThe ever-growing demand for better PCB (printed circuit board) performance as well as component miniaturization and increasing density, are all challenges the automotive industry is facing nowadays. However, these alterations in the PCB layout alongside changes in production materials and techniques may jeopardize product reliability. One of the factors that has the ability to threaten PCB functioning is the introduction of ionic contaminants that increase the probability of electrochemical reactions and premature circuit failures. Methods have been created along the years in order to evaluate the presence of these contaminants on printed boards; one of them is the ROSE (Resistivity of Solvent Extract) test. This thesis aimed to study the ionic contamination in electronic product assembly using the CM22 contaminometer, a ROSE test machine. Essentially, this project was divided in two studies. The first one was the study of ROSE machine response and establishment of parameters to test its performance at Bosch Car Multimedia Portugal S.A. The results revealed that although the relation between the machine response and the dissolved contamination was linear, there was some disparity in values of PCBs from the same product family. The temperature and regeneration time of the extraction bath were identified as possible influencers of this discrepancy. Further tests showed temperature is not a significant factor for this behaviour and, at lower contamination levels, the regeneration time has little impact. The second study intended to evaluate the ionic contamination levels of printed circuit boards in 5 different stages of their production run. This research revealed that the ROSE levels of the PCBs obtained from the supplier decrease during the first steps of the process. Solder paste application, component insertion and reflow steps do not introduce much ionic residues on the board surface. Yet, the most important conclusion to this study is that the flux used for rework and selective soldering greatly increases surface contamination presence. In conclusion, the CM22 ROSE contaminometer is suitable to monitor processes in assembly plants. It can detect contamination trends at a process line and can be used as process control tool especially in a no-clean soldering process like the one used in Bosch. For this reason, the evaluation of ionic content should be carried out in different stages of PCBA production since it can be very deceptive to do them only after reflow process as it normally done.A crescente demanda por melhor desempenho de PCBs (placas de circuito impresso), bem como a miniaturização de componentes e o aumento da sua densidade, são desafios que a indústria automóvel enfrenta atualmente. No entanto, as alterações no seu design juntamente com as mudanças nos materiais e técnicas de produção podem comprometer a fiabilidade destas placas. Um dos fatores que tem a capacidade de ameaçar o funcionamento de um PCB é a introdução de contaminantes iónicos capazes de criar falhas elétricas no circuito. Vários métodos foram criados para avaliar a presença destes contaminantes em placas impressas; um deles é o teste ROSE (Resistividade do Extrato Solvente). Esta tese teve como objetivo o estudo da contaminação iónica na montagem de produtos eletrónicos utilizando o contaminometer CM22, um dispositivo de teste ROSE. Para isto, primeiro estudou-se a resposta da máquina ROSE e estabeleceu-se parâmetros para testar o seu desempenho na Bosch Car Multimedia Portugal S.A. Os resultados revelaram que embora a relação entre a resposta do aparelho e a contaminação dissolvida seja linear, existiu alguma disparidade nos valores de placas da mesma família. A temperatura e o tempo de regeneração do banho foram identificados como possíveis influenciadores desta discrepância. Testes adicionais mostraram que a temperatura não influencia este comportamento e, em níveis de contaminação mais baixos, o tempo de regeneração tem pouco impacto. O segundo estudo pretendia avaliar os níveis de contaminação iónica de placas de circuito impresso em 5 fases diferentes da sua montagem. Este estudo permitiu verificar que o PCB obtido do fornecedor possui um nível de ROSE que diminui ao longo dos primeiros passos do processo. As etapas de aplicação da pasta de solda, inserção dos componentes e refluxo não introduzem muitos resíduos à superfície da placa. No entanto, a conclusão mais importante deste estudo é que o fluxo usado para retrabalho e soldadura seletiva aumentam muito a contaminação na superfície das placas. Em conclusão, o contaminometer CM22 é adequado para monitorizar os processos de fabrico. Ele pode detetar tendências de contaminação na linha de produção e pode ser usado como ferramenta de controlo de processo, especialmente num processo sem limpeza como o da Bosch. Por esse motivo, a avaliação do conteúdo iónico deve ser realizada em diferentes etapas da produção de PCBAs, dado que pode ser enganoso fazê-lo somente após o refluxo, como normalmente é

Agitation for the electrodeposition of printed circuit boards

A detailed study of the characteristics of vibratory and air agitation including cathode reciprocation methods for electrodeposition processes and their application for plating of composites and printed circuit boards has been carried out. In tanks agitated by air bubbles, it was found that the enhancing effect of air bubbles on the mass transfer coefficient is a function of the gas voidage fraction, irrespective of the absolute values of the liquid flow velocity, the gas flow rate and the gas distributor employed. A sensor based on limiting current density characteristics of a wire tip electrode has been shown to be capable of measuring local variations of agitation and its effect on coating thickness variations during electrodeposition. The effectiveness of agitation is expressed as an enhancement factor

REMAINING LIFE ASSESSMENT PROCESS OF ELECTRONIC SYSTEMS

The remaining life assessment (RLA) process is a reliability prediction process, which predicts amount of life left in a system. Remaining life assessment is performed on hardware, which has already seen operational life. This thesis details the remaining life assessment process in detail and also provides a case study of remaining life assessment performed on the Shuttle Remote Manipulator System (SRMS). The electronics of Shuttle Remote Manipulator System was designed in the 1970s with a target application life of ten years. They have performed without any failures for over 20 years. The remaining life assessment process was done to investigate if the life of the SRMS could be extended until the year 2020. The remaining life assessment concluded that the electronics could be extended until 2020 due to the robust design and lack of damage caused to the assemblies

Electrical tracking over solid insulating materials for aerospace applications

The concept of More Electric Aircraft, where is to utilize the electrical power to drive more or all aircraft subsystem instead of conventional combination of pneumatic, hydraulic, mechanical and electrical power, can be recalled to World War II. It has been proven to have more advantages for decades in terms of energy efficiency, environmental issues, logistics and operational maintenance. It can also enhance aircraft weight, volume and battle damage reconfigurability.Thanks to the new electronics technologies and the emergence of new materials, It becomes feasible for high power density electrical power components to drive the majority of aircraft subsystem. However, sustaining the transmission of hundreds of kilowatts of electrical power at low voltages is not feasible owing to the penalties incurred due to high cable weights and voltage drop may become critical. It is very easy to come up with the solution of the increase of voltage. However, higher voltage will introduce other problems such as the reliability of insulation coordination on the aircraft due to the increased probability of electrical discharge. For aircraft designers, it is very important to understand the rules of insulation coordination on the aircraft including determining clearance and creepage distances, and also have a clear investigation of the phenomena and mechanism of electrical discharges. Past research has identified a number of the concerns of operating electrical systems at higher voltages in an aerospace environment, especially for dimensioning of clearances. However, there is little study on dimensioning of creepage distances and relevantly flashover and electrical tracking on solid insulating material surfaces. This thesis firstly discusses the rules for determining clearances and creepage distances. The experimental validation work was done for breakdown in air gap and on the solid insulating material surfaces under dry condition so that some standard recommended values can be evaluated not only with theoretical values such Paschen's law. Suggestions of application of those standards were provided. Secondly, the complex electrical discharge under wet condition on solid insulating material surfaces was discussed. A mathematical model to predict this type of electrical failure -electrical tracking (the electrical discharges on solid insulation materials which will lead to physical damage in the materials) with the consideration of different environmental conditions including air pressure, ambient temperature, and pollution degrees was developed. A series of electrical tracking tests were carried out on organic materials to find out the mechanism of electrical tracking and validate the finding by the mathematic model. Finite element analysis simulations were also conducted to find out the background thermal transfer mechanism to support our explanation of those phenomena of electrical tracking. Different test techniques have ben developed for specific impact factors. Finally, the suggestions for utilization of the standards and feasible test techniques for electrical tracking under wet conditions were provided.EThOS - Electronic Theses Online ServiceGBUnited Kingdo