Variation-Aware Modeling and Design of Nanophotonic Interconnects

Optical interconnects have started to replace electrical interconnects in the communications between racks and circuit boards with potential benefits in bandwidth, delay, power efficiency, and crosstalk. Silicon photonics has emerged to be a highly promising enabling technology for the short-reach nanophotonic interconnects because it offers favorable CMOS compatibility and high integration level. The fast-growing complexity of photonic integrated circuit (PIC) and close electro-optical integration call for computer-aided design (CAD) for integrated photonics, and electronic-photonic design automation (EPDA) including accurate behavior models and efficient simulation methodologies for integrated electro-optical systems. Also, the nanophotonic devices are highly sensitive to fabrication process variation and thermal variation effects, which requires proper modeling, optimization, and management schemes. To address these problems, this thesis is dedicated to the following two tasks: (1) compact modeling and circuit-level simulation of nanophotonic interconnects, and (2) power-efficient management of the variation effects in nanophotonic interconnects.The first part of the thesis develops compact models for key components in nanophotonic interconnects including silicon microring modulators, diode lasers, electro-absorption modulators (EAM), photodetectors, etc. These compact models are developed based on their electrical and optical properties, and are then extensively validated by measurement data. The model parameters are extracted from common electrical and optical tests. Implemented in Verilog-A, the models are used in SPICE simulations of optical links, whose results again agree well with measurement data. The compact model library and the simulation methodology enable electro-optical co-simulations and optical device design explorations in the circuit-level.In the second part of the thesis, we propose modeling methods and power-efficient management schemes for the process and thermal variations in optical interconnects. The proposed adaptive tuning technique performs on-chip self-tests and adaptively allocates just enough power for link operations. The technique saves significant amount of power compared to worst-case based conservative designs, and scales well w.r.t. variations and network size. We also design power-efficient pairing algorithms for microring-based optical interconnects. Our algorithms optimally mix-and-match microring-based devices to minimize the power consumption for tuning. The algorithms are tested on both measured and synthetic data sets, demonstrating promising results of power reduction and scalability for handling a large number of devices. Lastly, we decompose and analyze wafer-scale spatial patterns of process variations in microring modulators. We further investigate the correlations between the spatial patterns and fabrication process steps, which is valuable for understanding process variation sources and improving fabrication processes for uniformity

Optically-Connected Memory: Architectures and Experimental Characterizations

Growing demands on future data centers and high-performance computing systems are driving the development of processor-memory interconnects with greater performance and flexibility than can be provided by existing electronic interconnects. A redesign of the systems' memory devices and architectures will be essential to enabling high-bandwidth, low-latency, resilient, energy-efficient memory systems that can meet the challenges of exascale systems and beyond. By leveraging an optics-based approach, this thesis presents the design and implementation of an optically-connected memory system that exploits both the bandwidth density and distance-independent energy dissipation of photonic transceivers, in combination with the flexibility and scalability offered by optical networks. By replacing the electronic memory bus with an optical interconnection network, novel memory architectures can be created that are otherwise infeasible. With remote optically-connected memory nodes accessible to processors as if they are local, programming models can be designed to utilize and efficiently share greater amounts of data. Processors that would otherwise be idle, being starved for data while waiting for scarce memory resources, can instead operate at high utilizations, leading to drastic improvements in the overall system performance. This work presents a prototype optically-connected memory module and a custom processor-based optical-network-aware memory controller that communicate transparently and all-optically across an optical interconnection network. The memory modules and controller are optimized to facilitate memory accesses across the optical network using a packet-switched, circuit-switched, or hybrid packet-and-circuit-switched approach. The novel memory controller is experimentally demonstrated to be compatible with existing processor-memory access protocols, with the memory controller acting as the optics-computing interface to render the optical network transparent. Additionally, the flexibility of the optical network enables additional performance benefits including increased memory bandwidth through optical multicasting. This optically-connected architecture can further enable more resilient memory system realizations by expanding on current error dectection and correction memory protocols. The integration of optics with memory technology constitutes a critical step for both optics and computing. The scalability challenges facing main memory systems today, especially concerning bandwidth and power consumption, complement well with the strengths of optical communications-based systems. Additionally, ongoing efforts focused on developing low-cost optical components and subsystems that are suitable for computing environments may benefit from the high-volume memory market. This work therefore takes the first step in merging the areas of optics and memory, developing the necessary architectures and protocols to interface the two technologies, and demonstrating potential benefits while identifying areas for future work. Future computing systems will undoubtedly benefit from this work through the deployment of high-performance, flexible, energy-efficient optically-connected memory architectures

Reinventing Integrated Photonic Devices and Circuits for High Performance Communication and Computing Applications

The long-standing technological pillars for computing systems evolution, namely Moore\u27s law and Von Neumann architecture, are breaking down under the pressure of meeting the capacity and energy efficiency demands of computing and communication architectures that are designed to process modern data-centric applications related to Artificial Intelligence (AI), Big Data, and Internet-of-Things (IoT). In response, both industry and academia have turned to \u27more-than-Moore\u27 technologies for realizing hardware architectures for communication and computing. Fortunately, Silicon Photonics (SiPh) has emerged as one highly promising ‘more-than-Moore’ technology. Recent progress has enabled SiPh-based interconnects to outperform traditional electrical interconnects, offering advantages like high bandwidth density, near-light speed data transfer, distance-independent bitrate, and low energy consumption. Furthermore, SiPh-based electro-optic (E-O) computing circuits have exhibited up to two orders of magnitude improvements in performance and energy efficiency compared to their electronic counterparts. Thus, SiPh stands out as a compelling solution for creating high-performance and energy-efficient hardware for communication and computing applications. Despite their advantages, SiPh-based interconnects face various design challenges that hamper their reliability, scalability, performance, and energy efficiency. These include limited optical power budget (OPB), high static power dissipation, crosstalk noise, fabrication and on-chip temperature variations, and limited spectral bandwidth for multiplexing. Similarly, SiPh-based E-O computing circuits also face several challenges. Firstly, the E-O circuits for simple logic functions lack the all-electrical input handling, raising hardware area and complexity. Secondly, the E-O arithmetic circuits occupy vast areas (at least 100x) while hardly achieving more than 60% hardware utilization, versus CMOS implementations, leading to high idle times, and non-amortizable area and static power overheads. Thirdly, the high area overhead of E-O circuits hinders them from achieving high spatial parallelism on-chip. This is because the high area overhead limits the count of E-O circuits that can be implemented on a reticle-size limited chip. My research offers significant contributions to address the aforementioned challenges. For SiPh-based interconnects, my contributions focus on enhancing OPB by mitigating crosstalk noise, addressing the optical non-linearity-related issues through the development of Silicon-on-Sapphire-based photonic interconnects, exploring multi-level signaling, and evaluating various device-level design pathways. This enables the design of high throughput (\u3e1Tbps) and energy-efficient (\u3c1pJ/bit) SiPh interconnects. In the context of SiPh-based E-O circuits, my contributions include the design of a microring-based polymorphic E-O logic gate, a hybrid time-amplitude analog optical modulator, and an indium tin oxide-based silicon nitride microring modulator and a weight bank for neural network computations. These designs significantly reduce the area overhead of current E-O computing circuits while enhancing the energy-efficiency, and hardware utilization

Pulsar: Design and Simulation Methodology for Dynamic Bandwidth Allocation in Photonic Network-on-Chip Architectures in Heterogeneous Multicore Systems

As the computing industry moved toward faster and more energy-efficient solutions, multicore computers proved to be dependable. Soon after, the Network-on-Chip (NoC) paradigm made headway as an effective method of connecting multiple cores on a single chip. These on-chip networks have been used to relay communication between homogeneous and heterogeneous sets of cores and core clusters. However, the variation in bandwidth requirements of heterogeneous systems is often neglected. Therefore, at a given moment, bandwidth may be in excess at one node while it is insufficient at another leading to lower performance and higher energy costs. This work proposes and examines dynamic schemes for the allocation of photonic channels in a Photonic Network-on-Chip (PNoC) as an alternative to their static-provision counterparts and proposes a method of simulating and selecting the characteristics of a dynamic system at the time of design as to achieve maximum system performance in a Photonic Network-on-Chip for a given application type

Architectural Exploration and Design Methodologies of Photonic Interconnection Networks

Photonic technology is becoming an increasingly attractive solution to the problems facing today's electronic chip-scale interconnection networks. Recent progress in silicon photonics research has enabled the demonstration of all the necessary optical building blocks for creating extremely high-bandwidth density and energy-efficient links for on- and off-chip communications. From the feasibility and architecture perspective however, photonics represents a dramatic paradigm shift from traditional electronic network designs due to fundamental differences in how electronics and photonics function and behave. As a result of these differences, new modeling and analysis methods must be employed in order to properly realize a functional photonic chip-scale interconnect design. In this work, we present a methodology for characterizing and modeling fundamental photonic building blocks which can subsequently be combined to form full photonic network architectures. We also describe a set of tools which can be utilized to assess the physical-layer and system-level performance properties of a photonic network. The models and tools are integrated in a novel open-source design and simulation environment called PhoenixSim. Next, we leverage PhoenixSim for the study of chip-scale photonic networks. We examine several photonic networks through the synergistic study of both physical-layer metrics and system-level metrics. This holistic analysis method enables us to provide deeper insight into architecture scalability since it considers insertion loss, crosstalk, and power dissipation. In addition to these novel physical-layer metrics, traditional system-level metrics of bandwidth and latency are also obtained. Lastly, we propose a novel routing architecture known as wavelength-selective spatial routing. This routing architecture is analogous to electronic virtual channels since it enables the transmission of multiple logical optical channels through a single physical plane (i.e. the waveguides). The available wavelength channels are partitioned into separate groups, and each group is routed independently in the network. Each partition is spectrally multiplexed, as opposed to temporally multiplexed in the electronic case. The wavelength-selective spatial routing technique benefits network designers by provider lower contention and increased path diversity

Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications

Large scale data centers (DC) and high performance computing (HPC) systems require more and more computing power at higher energy efficiency. They are already consuming megawatts of power, and a linear extrapolation of trends reveals that they may eventually lead to unrealistic power consumption scenarios in order to satisfy future requirements (e.g., Exascale computing). Conventional complementary metal oxide semiconductor (CMOS)-based electronic interconnects are not expected to keep up with the envisioned future board-to-board and chip-to-chip (within multi-chip-modules) interconnect requirements because of bandwidth-density and power-consumption limitations. However, low-power and high-speed optics-based interconnects are emerging as alternatives for DC and HPC communications; they offer unique opportunities for continued energy-efficiency and bandwidth-density improvements, although cost is a challenge at the shortest length scales. Plasmonics-based interconnects on the other hand, due to their extremely small size, offer another interesting solution for further scaling operational speed and energy efficiency. At the device-level, CMOS compatibility is also an important issue, since ultimately photonics or plasmonics will have to be co-integrated with electronics. In this paper, we survey the available literature and compare the aforementioned interconnect technologies, with respect to their suitability for high-speed and energy-efficient on-chip and offchip communications. This paper refers to relatively short links with potential applications in the following interconnect distance hierarchy: local group of racks, board to board, module to module, chip to chip, and on chip connections. We compare different interconnect device modules, including low-energy output devices (such as lasers, modulators, and LEDs), photodetectors, passive devices (i.e., waveguides and couplers) and electrical circuitry (such as laserdiode drivers, modulator drivers, transimpedance, and limiting amplifiers). We show that photonic technologies have the potential to meet the requirements for selected HPC and DC applications in a shorter term. We also present that plasmonic interconnect modules could offer ultra-compact active areas, leading to high integration bandwidth densities, and low device capacitances allowing for ultra-high bandwidth operation that would satisfy the application requirements further into the future

Design of Optical Interconnect Transceiver Circuits and Network-on-chip Architectures for Inter- and Intra-chip Communication

The rapid expansion in data communication due to the increased multimedia applications and cloud computing services necessitates improvements in optical transceiver circuitry power efficiency as these systems scale well past 10 Gb/s. In order to meet these requirements, a 26 GHz transimpedance amplifier (TIA) is presented in a 0.25-µm SiGe BiCMOS technology. It employs a transformer-based regulated cascode (RGC) input stage which provides passive negative-feedback gain that enhances the effective transconductance of the TIA’s input common-base transistor; reducing the input resistance and pro- viding considerable bandwidth extension without significant noise degradation or power consumption. The TIA achieves a 53 dBΩ single-ended transimpedance gain with a 26√ GHz bandwidth and 21.3 pA/H z average input-referred noise current spectral density. Total chip power including output buffering is 28.2 mW from a 2.5 V supply, with the core TIA consuming 8.2 mW, and the chip area including pads is 960 µm × 780 µm. With the advance of photonic devices, optical interconnects becomes a promising technology to replace the conventional electrical channels for the high-bandwidth and power efficient inter/intra-chip interconnect. Second, a silicon photonic transceiver is presented for a silicon ring resonator-based optical interconnect architecture in a 1V standard 65nm CMOS technology. The transmitter circuits incorporate high-swing drivers with non-linear pre-emphasis and automatic bias-based tuning for resonance wavelength stabilization. An optical forwarded-clock adaptive inverter-based transimpedance amplifier (TIA) receiver trades-off power for varying link budgets by employing an on-die eye monitor and scaling the TIA supply for the required sensitivity. At 5 GB/s operation, the ring modulator un- der 4Vpp driver achieves 12.7dB extinction ratio with 4.04mW power consumption, while a 0.28nm tuning range is obtained at 6.8µW/GHz efficiency with the bias-based tuning scheme implemented with the 2Vpp transmitter. When tested with a wire-bonded 150f- F p-i-n photodetector, the receiver achieves -12.7dBm sensitivity at a BER=10−15 and consumes 2.2mW at 8 GB/s. Third, a novel Nano-Photonic Network-on-Chip (NoC) architecture, called LumiNoC, is proposed for high performance and power-efficient interconnects for the chip-multi- processors (CMPs). A 64-node LumiNoC under synthetic traffic enjoys 50% less latency at low loads versus other reported photonic NoCs, and ∼25% less latency versus the electrical 2D mesh NoCs on realistic workloads. Under the same ideal throughput, LumiNoC achieves laser power reduction of 78%, and overall power reduction of 44% versus competing designs