10,381 research outputs found

    Communication channel analysis and real time compressed sensing for high density neural recording devices

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    Next generation neural recording and Brain- Machine Interface (BMI) devices call for high density or distributed systems with more than 1000 recording sites. As the recording site density grows, the device generates data on the scale of several hundred megabits per second (Mbps). Transmitting such large amounts of data induces significant power consumption and heat dissipation for the implanted electronics. Facing these constraints, efficient on-chip compression techniques become essential to the reduction of implanted systems power consumption. This paper analyzes the communication channel constraints for high density neural recording devices. This paper then quantifies the improvement on communication channel using efficient on-chip compression methods. Finally, This paper describes a Compressed Sensing (CS) based system that can reduce the data rate by > 10x times while using power on the order of a few hundred nW per recording channel

    Roadmap on semiconductor-cell biointerfaces.

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    This roadmap outlines the role semiconductor-based materials play in understanding the complex biophysical dynamics at multiple length scales, as well as the design and implementation of next-generation electronic, optoelectronic, and mechanical devices for biointerfaces. The roadmap emphasizes the advantages of semiconductor building blocks in interfacing, monitoring, and manipulating the activity of biological components, and discusses the possibility of using active semiconductor-cell interfaces for discovering new signaling processes in the biological world

    A Sub-μVRms Chopper Front-End for ECoG Recording

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    This paper presents a low-noise, low-power fully differential chopper-modulated front-end circuit intended for ECoG signal recording. Among other features, it uses a subthreshold source-follower biquad in the forward path to reduce noise and avoid the implementation of a ripple rejection loop. The prototype was designed in 0.18μm CMOS technology with a 1V supply. Post-layout simulations were carried out showing a power consumption below 2μW and an integrated input-referred noise of 0.75μV rms , with a noise floor below 50 nV√Hz, over a bandwidth from 1 to 200Hz, for a noise efficiency factor of 2.7.Ministerio de Economía y Empresa TEC2016-80923-

    Artifact-Aware Analogue/Mixed-Signal Front-Ends for Neural Recording Applications

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    This paper presents a brief review of techniques to overcome the problems associated with artifacts in analog frontends for neural recording applications. These techniques are employed for handling Common-Mode (CM) Differential-Mode (DM) artifacts and include techniques such as Average Template Subtraction, Channel Blanking or Blind Adaptive Stimulation Artifact Rejection (ASAR), among others. Additionally, a new technique for DM artifacts compression is proposed. It allows to compress these artifacts to the requirements of the analog frontend and, afterwards, it allows to reconstruct the whole artifact or largely suppress it.Ministerio de Economía y Empresa TEC2016-80923-

    A 64-channel inductively-powered neural recording sensor array

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    This paper reports a 64-channel inductively powered neural recording sensor array. Neural signals are acquired, filtered, digitized and compressed in the channels. Additionally, each channel implements a local auto-calibration mechanism which configures the transfer characteristics of the recording site. The system has two operation modes; in one case the information captured by the channels is sent as uncompressed raw data; in the other, feature vectors extracted from the detected neural spikes are transmitted. Data streams coming from the channels are serialized by an embedded digital processor and transferred to the outside by means of the same inductive link used for powering the system. Simulation results show that the power consumption of the complete system is 377μW.Ministerio de Ciencia e Innovación TEC2009-0844
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