Robust Circuit Design for Low-Voltage VLSI.

Voltage scaling is an effective way to reduce the overall power consumption, but the major challenges in low voltage operations include performance degradation and reliability issues due to PVT variations. This dissertation discusses three key circuit components that are critical in low-voltage VLSI. Level converters must be a reliable interface between two voltage domains, but the reduced on/off-current ratio makes it extremely difficult to achieve robust conversions at low voltages. Two static designs are proposed: LC2 adopts a novel pulsed-operation and modulates its pull-up strength depending on its state. A 3-sigma robustness is guaranteed using a current margin plot; SLC inherently reduces the contention by diode-insertion. Improvements in performance, power, and robustness are measured from 130nm CMOS test chips. SRAM is a major bottleneck in voltage-scaling due to its inherent ratioed-bitcell design. The proposed 7T SRAM alleviates the area overhead incurred by 8T bitcells and provides robust operation down to 0.32V in 180nm CMOS test chips with 3.35fW/bit leakage. Auto-Shut-Off provides a 6.8x READ energy reduction, and its innate Quasi-Static READ has been demonstrated which shows a much improved READ error rate. A use of PMOS Pass-Gate improves the half-select robustness by directly modulating the device strength through bitline voltage. Clocked sequential elements, flip-flops in short, are ubiquitous in today’s digital systems. The proposed S2CFF is static, single-phase, contention-free, and has the same number of devices as in TGFF. It shows a 40% power reduction as well as robust low-voltage operations in fabricated 45nm SOI test chips. Its simple hold-time path and the 3.4x improvement in 3-sigma hold-time is presented. A new on-chip flip-flop testing harness is also proposed, and measured hold-time variations of flip-flops are presented.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/111525/1/yejoong_1.pd

Low Leakage and PDP Optimized FinFET based 8T SRAM Design

The paper proposes a Fin Field Effect Transistors (FinFETs) based SRAM design comprising of 8 transistors. The circuit utilizes channel length of 22 nanometers. The operation of this circuit is dependent upon the control switch CS that decides the operating mode and minimizes the leakage current flowing in the cell which in turn lowers the leakage power to a minimal value of 0.331pW. The read buffer available in the design provides a different path for read mode and also enhances the Read Static Noise Margin (RSNM), thus enhancing the readability of the circuit.This design is also able to operate at a minimal voltage of 70mV, thus efficiently utilizing the power available. It also optimizes the power delay product (PDP) for both read and write operations

Ultra-Low Power Circuit Design for Cubic-Millimeter Wireless Sensor Platform.

Modern daily life is surrounded by smaller and smaller computing devices. As Bell’s Law predicts, the research community is now looking at tiny computing platforms and mm3-scale sensor systems are drawing an increasing amount of attention since they can create a whole new computing environment. Designing mm3-scale sensor nodes raises various circuit and system level challenges and we have addressed and proposed novel solutions for many of these challenges to create the first complete 1.0mm3 sensor system including a commercial microprocessor. We demonstrate a 1.0mm3 form factor sensor whose modular die-stacked structure allows maximum volume utilization. Low power I2C communication enables inter-layer serial communication without losing compatibility to standard I2C communication protocol. A dual microprocessor enables concurrent computation for the sensor node control and measurement data processing. A multi-modal power management unit allowed energy harvesting from various harvesting sources. An optical communication scheme is provided for initial programming, synchronization and re-programming after recovery from battery discharge. Standby power reduction techniques are investigated and a super cut-off power gating scheme with an ultra-low power charge pump reduces the standby power of logic circuits by 2-19× and memory by 30%. Different approaches for designing low-power memory for mm3-scale sensor nodes are also presented in this work. A dual threshold voltage gain cell eDRAM design achieves the lowest eDRAM retention power and a 7T SRAM design based on hetero-junction tunneling transistors reduces the standby power of SRAM by 9-19× with only 15% area overhead. We have paid special attention to the timer for the mm3-scale sensor systems and propose a multi-stage gate-leakage-based timer to limit the standard deviation of the error in hourly measurement to 196ms and a temperature compensation scheme reduces temperature dependency to 31ppm/°C. These techniques for designing ultra-low power circuits for a mm3-scale sensor enable implementation of a 1.0mm3 sensor node, which can be used as a skeleton for future micro-sensor systems in variety of applications. These microsystems imply the continuation of the Bell’s Law, which also predicts the massive deployment of mm3-scale computing systems and emergence of even smaller and more powerful computing systems in the near future.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/91438/1/sori_1.pd

Robust low-power digital circuit design in nano-CMOS technologies

Device scaling has resulted in large scale integrated, high performance, low-power, and low cost systems. However the move towards sub-100 nm technology nodes has increased variability in device characteristics due to large process variations. Variability has severe implications on digital circuit design by causing timing uncertainties in combinational circuits, degrading yield and reliability of memory elements, and increasing power density due to slow scaling of supply voltage. Conventional design methods add large pessimistic safety margins to mitigate increased variability, however, they incur large power and performance loss as the combination of worst cases occurs very rarely. In-situ monitoring of timing failures provides an opportunity to dynamically tune safety margins in proportion to on-chip variability that can significantly minimize power and performance losses. We demonstrated by simulations two delay sensor designs to detect timing failures in advance that can be coupled with different compensation techniques such as voltage scaling, body biasing, or frequency scaling to avoid actual timing failures. Our simulation results using 45 nm and 32 nm technology BSIM4 models indicate significant reduction in total power consumption under temperature and statistical variations. Future work involves using dual sensing to avoid useless voltage scaling that incurs a speed loss. SRAM cache is the first victim of increased process variations that requires handcrafted design to meet area, power, and performance requirements. We have proposed novel 6 transistors (6T), 7 transistors (7T), and 8 transistors (8T)-SRAM cells that enable variability tolerant and low-power SRAM cache designs. Increased sense-amplifier offset voltage due to device mismatch arising from high variability increases delay and power consumption of SRAM design. We have proposed two novel design techniques to reduce offset voltage dependent delays providing a high speed low-power SRAM design. Increasing leakage currents in nano-CMOS technologies pose a major challenge to a low-power reliable design. We have investigated novel segmented supply voltage architecture to reduce leakage power of the SRAM caches since they occupy bulk of the total chip area and power. Future work involves developing leakage reduction methods for the combination logic designs including SRAM peripherals

Design Of A Nonvolatile 8T1R SRAM Cell For Instant-On Operation

Now-a-days, Energy consumption is the major key factor in Memories. By switching the circuit in off mode and with an lower voltages, leads to decrease in an power dissipation of the circuit. Compared to DRAM SRAM’S are mostly used because of their data retaining capability. The major advantage of using SRAM’s rather than DRAM’S is that, they are providing fast power-on/off speeds. Hence SRAM’s are more preferred over DRAM’s for better instant-on operation. Generally SRAM’s are classified in to two types namely volatile and non-volatile SRAM’s. A non-volatile SRAM enables chip to achieve performance factors and also provides an restore operation which will be enabled by an restore signal to restore the data and also power-up operation is performed. This paper describes about novel NVSRAM circuit which produces better “instant-on operation” compared to previous techniques used in SRAM’s. In addition to normal 6T SRAM core, we are using RRAM circuitry (Resistive RAM) to provide better instant-on operation. By comparing the performance factors with 8T2R and 9T2R, 8T1R design performs the best in the Nano meter scale. Thus this paper provides better performances in power, energy, propagation delay and area factors as compared with other designs

Dynamic Power Management of High Performance Network on Chip

With increased density of modern System on Chip(SoC) communication between nodes has become a major problem. Network on Chip is a novel on chip communication paradigm to solve this by using highly scalable and efficient packet switched network. The addition of intelligent networking on the chip adds to the chip’s power consumption thus making management of communication power an interesting and challenging research problem. While VLSI techniques have evolved over time to enable power reduction in the circuit level, the highly dynamic nature of modern large SoC demand more than that. This dissertation explores some innovative dynamic solutions to manage the ever increasing communication power in the post sub-micron era. Today’s highly integrated SoCs require great level of cross layer optimizations to provide maximum efficiency. This dissertation aims at the dynamic power management problem from top. Starting with a system level distribution and management down to microarchitecture enhancements were found necessary to deliver maximum power efficiency. A distributed power budget sharing technique is proposed. To efficiently satisfy the established power budget, a novel flow control and throttling technique is proposed. Finally power efficiency of underlying microarchitecture is explored and novel buffer and link management techniques are developed. All of the proposed techniques yield improvement in power-performance efficiency of the NoC infrastructure

A Construction Kit for Efficient Low Power Neural Network Accelerator Designs

Implementing embedded neural network processing at the edge requires efficient hardware acceleration that couples high computational performance with low power consumption. Driven by the rapid evolution of network architectures and their algorithmic features, accelerator designs are constantly updated and improved. To evaluate and compare hardware design choices, designers can refer to a myriad of accelerator implementations in the literature. Surveys provide an overview of these works but are often limited to system-level and benchmark-specific performance metrics, making it difficult to quantitatively compare the individual effect of each utilized optimization technique. This complicates the evaluation of optimizations for new accelerator designs, slowing-down the research progress. This work provides a survey of neural network accelerator optimization approaches that have been used in recent works and reports their individual effects on edge processing performance. It presents the list of optimizations and their quantitative effects as a construction kit, allowing to assess the design choices for each building block separately. Reported optimizations range from up to 10'000x memory savings to 33x energy reductions, providing chip designers an overview of design choices for implementing efficient low power neural network accelerators

Design of High Performance SRAM Based Memory Chip

The semiconductor memory SRAM uses bi-stable latch circuit to store the logic data 1 or 0. It differs from Dynamic RAM (DRAM) which needs periodic refreshment operation for the storage of logic data. Depending upon the frequency of operation SRAM power consumption varies i.e. it consumes very high power at higher frequencies like DRAM. The Cache memory present in the microprocessor needs high speed memory hence SRAM can be used for that purpose in microprocessors. The DRAM is normally used in the Main memory of processors, where importance is given to the density than its speed. The SRAM is also used in industrial subsystems, scientific and automotive electronics. In this thesis 16-Kb Memory is designed by using memory banking method in UMC 90nm technology ,which operates at a frequency of 1GHz.The post layout simulation for the complete design is performed and also obtained power analysis for the overall design. All peripherals like pre-charge, Row Decoder, Word line driver, Sense amplifier, Column Decoder/Mux and write driver are designed and layouts of all the above peripherals also drawn in an optimised manner such that their layout occupies minimum area. The 6T SRAM cell is designed with operating frequency of 8 GHz and stability analysis are also performed for single SRAM cell. The layout of Single SRAM cell is drawn in a symmetric manner, such that two adjacent cells can share same contact, which results reduction in the area of cell layout. The Static Noise Margin, Read noise margin and Write Noise Margin of single cell are found to be 240mV, 115mV and 425mV respectively for a supply voltage of 1V.The effect of pull-up ratio and cell ratio on the stability of SRAM cell is observed

Low Leakage and Robust Sub-threshold SRAM Cell using Memristor

This work aims to improve the total power dissipation, leakage currents and stability without disturbing the logic state of SRAM cell with concept called sub-threshold operation. Though, sub-threshold SRAM proves to be advantageous but fails with basic 6T SRAM cell during readability and writability. In this paper we have investigated a non-volatile 6T2M (6 Transistors & 2 Memristors) sub-threshold SRAM cell working at lower supply voltage of VDD=0.3V, where Memristor is used to store the information even at power failures and restores previous data with successful read and write operation overcomes the challenge faced. This paper also proposes a new configuration of non-volatile 6T2M (6 Transistors & 2 Memristors) sub-threshold SRAM cell resulting in improved behaviour in terms of power, stability and leakage current where read and write power has improved by 40% and 90% respectively when compared to 6T2M (conventional) SRAM cell. The proposed 6T2M SRAM cell offers good stability of RSNM=65mV and WSNM=93mV which is much improved at low voltage when compared to conventional basic 6T SRAM cell, and improved leakage current of 4.92nA is achieved as compared

Low Leakage and Robust Sub-threshold SRAM Cell using Memristor

This work aims to improve the total power dissipation, leakage currents and stability without disturbing the logic state of SRAM cell with concept called sub-threshold operation. Though, sub-threshold SRAM proves to be advantageous but fails with basic 6T SRAM cell during readability and writability. In this paper we have investigated a non-volatile 6T2M (6 Transistors & 2 Memristors) sub-threshold SRAM cell working at lower supply voltage of VDD=0.3V, where Memristor is used to store the information even at power failures and restores previous data with successful read and write operation overcomes the challenge faced. This paper also proposes a new configuration of non-volatile 6T2M (6 Transistors & 2 Memristors) sub-threshold SRAM cell resulting in improved behaviour in terms of power, stability and leakage current where read and write power has improved by 40% and 90% respectively when compared to 6T2M (conventional) SRAM cell. The proposed 6T2M SRAM cell offers good stability of RSNM=65mV and WSNM=93mV which is much improved at low voltage when compared to conventional basic 6T SRAM cell, and improved leakage current of 4.92nA is achieved as compared