Capacitive micromachined ultrasound transducer (CMUT) design and fabrication for intracardiac echocardiography

The objective of this research is to develop capacitive micromachined ultrasonic transducer (CMUT) arrays with novel geometry for intracardiac echocardiography (ICE) imaging along with a novel reliable CMUT fabrication process to improve the system performance. We used custom CMOS electronics and monolithically integrated our CMUT arrays to CMOS chips. The arrays are designed for 9-Fr (<3mm) ICE catheters over a total area of about 2.6x11 mm2 at around 7MHz center frequency with ~80% fractional bandwidth in both 1-D and 2-D configurations. The 1-D array transducer includes 64 channels with beam-steering capabilities for cross sectional ICE imaging application at distance range of about 5-cm. The ICE image with 40dB dynamic range from 7 metal wires has been obtained. Several 2-D (sparse) arrays are designed based on signal-to-noise ratio (SNR) optimization capable of generating volumetric images. The CMUT-on-CMOS technique is used for arrays integration with our ASICs using vias for top and bottom electrode connections to the related electronics pads. A 60V pulse is optimized during transmit operation and 2MPa surface pressure has been achieved that is in agreement with our simulation results. We also developed an improved CMOS compatible low temperature sacrificial layer fabrication process for CMUTs. The process adds the fabrication step of silicon oxide evaporation which is followed by a lift-off step to define the membrane support area without a need for an extra mask. The parasitic capacitance is reduced about 15% and device long-term test demonstrates 72-hours stable output pressure showing no significant degradation on performance. We have also developed a new energy-based calculation method for CMUT performance evaluation that is valid during both small and large signal operation since well-known frequency and capacitance based coupling coefficients definitions are not valid for large signal and nonlinear operation regimes. The quantitative modeling results show that CMUTs do not need DC bias to achieve high efficiency large signal transduction: AC only signals at half the operation frequency with amplitudes beyond the collapse voltage can provide energy conversion ratio (ECR) above 0.9 with harmonic content below -25dB. The overall modeling approach is also qualitatively validated by experiments.Ph.D

Capacitive Micromachined Ultrasonic Transducers for Non-destructive Testing Applications

Ultrasound is a popular technique for industrial non-destructive testing (NDT) applications. By sending ultrasonic waves into an object and observing the amplitude and the delay of the reflected or transmitted waves, one can characterize the material, measure the thickness of the object, and detect discontinuities (flaws) as well as the size, location, and orientation of the defects in the object. Traditionally, ultrasonic transducers for NDT are made with piezoelectric crystals. Meanwhile, another class of ultrasonic transducers known as capacitive micromachined ultrasonic transducers (CMUTs) have become popular in medical ultrasound research because of their large bandwidths and other attributes that allow them to be integrated into the tip of a catheter. However, CMUTs have not been widely adopted in ultrasonic NDT applications. In this thesis, three important CMUTs characteristics that could potentially make them attractive for NDT applications are introduced and demonstrated. First, CMUTs can be beneficial to NDT because the fabrication techniques of CMUTs can easily be used to implement high-frequency, high-density phased arrays, which are essential for high resolution scanning. Surface scanning using a 2-D row-column addressed CMUT array was demonstrated. Secondly, CMUTs can be integrated with supporting microelectronic circuits, thus one can implement a highly integrated transducer system, which can be useful in structural health monitoring NDT applications. Front-end microelectronic circuits that include a transmit pulser and a receive amplifier were designed, tested, and characterized. Thirdly, CMUTs are suitable for air-coupled applications because of their low acoustic impedance at resonance. Air-coupled CMUTs fabricated in a standard RF-MEMS process were characterized and tested. This thesis concludes with an analysis of the potential usefulness of CMUTs for ultrasonic NDT. While many ultrasonic NDT applications are better off being performed using conventional piezoelectric transducers, CMUTs can and should be used in certain NDT applications that can take advantage of the beneficial characteristics of this exciting transducer technology

Capacitive Micromachined Ultrasonic Transducers for Non-destructive Testing Applications

Ultrasound is a popular technique for industrial non-destructive testing (NDT) applications. By sending ultrasonic waves into an object and observing the amplitude and the delay of the reflected or transmitted waves, one can characterize the material, measure the thickness of the object, and detect discontinuities (flaws) as well as the size, location, and orientation of the defects in the object. Traditionally, ultrasonic transducers for NDT are made with piezoelectric crystals. Meanwhile, another class of ultrasonic transducers known as capacitive micromachined ultrasonic transducers (CMUTs) have become popular in medical ultrasound research because of their large bandwidths and other attributes that allow them to be integrated into the tip of a catheter. However, CMUTs have not been widely adopted in ultrasonic NDT applications. In this thesis, three important CMUTs characteristics that could potentially make them attractive for NDT applications are introduced and demonstrated. First, CMUTs can be beneficial to NDT because the fabrication techniques of CMUTs can easily be used to implement high-frequency, high-density phased arrays, which are essential for high resolution scanning. Surface scanning using a 2-D row-column addressed CMUT array was demonstrated. Secondly, CMUTs can be integrated with supporting microelectronic circuits, thus one can implement a highly integrated transducer system, which can be useful in structural health monitoring NDT applications. Front-end microelectronic circuits that include a transmit pulser and a receive amplifier were designed, tested, and characterized. Thirdly, CMUTs are suitable for air-coupled applications because of their low acoustic impedance at resonance. Air-coupled CMUTs fabricated in a standard RF-MEMS process were characterized and tested. This thesis concludes with an analysis of the potential usefulness of CMUTs for ultrasonic NDT. While many ultrasonic NDT applications are better off being performed using conventional piezoelectric transducers, CMUTs can and should be used in certain NDT applications that can take advantage of the beneficial characteristics of this exciting transducer technology

Row-Column Capacitive Micromachined Ultrasonic Transducers for Medical Imaging

Ultrasound imaging plays an important role in modern medical diagnosis. Recent progress in real-time 3-D ultrasound imaging can offer critical information such as the accurate estimation of organ, cyst, or tumour volumes. However, compared to conventional 2-D ultrasound imaging, the large amount of data and circuit complexity found in 3-D ultrasound imaging results in very expensive systems. Therefore, a simplification scheme for 3-D ultrasound imaging technology is needed for a more wide-spread use and to advance clinical development of volumetric ultrasound. Row-column addressing 2-D array is one particular simplification scheme that requires only N + N addressing lines to activate each element in an N × N array. As a result, the fabrication, circuit, and processing complexity dramatically decrease. Capacitive micromachined ultrasonic transducer (CMUT) technology was chosen to fabricate the array as it offers micro-precision fabrication and a wide bandwidth, which make it an attractive transducer technology. The objective of this thesis is to investigate and demonstrate the imaging potential of row-column CMUT arrays for RT3D imaging. First, the motivation, physics, and modelling of both CMUTs and row-column arrays are described, followed by the demonstration of a customized row-column CMUT pseudo-real-time 3-D imaging system. One particular limitation about row-column arrays discovered as part of this dissertation work is the limited field-of-view of the row-column arrays’ imaging performance. A curved row-column CMUT array was proposed to improve the field-of-view, and the resulting modelling of the acoustic field and simulated reconstructed image are presented. Furthermore, a new fabrication process was proposed to construct a curved row-column CMUT array. The resulting device was tested to demonstrate its flexibility to achieve the necessary curvature. Finally, a new wafer bonding process is introduced to tackle the next generation of RC-CMUT fabrication. Many of the new fabrication techniques reported in this work are useful for CMUT fabrication engineers. The analysis on row-column array also provides additional insights for 2-D array simplification research