164 research outputs found

    Bandwidth enhancement in multimode polymer waveguides using waveguide layout for optical printed circuit boards

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    © 2016 OSA. Dispersion studies demonstrate that waveguide layout can be used to enhance the bandwidth performance of multimode polymer waveguides for use in board-level optical interconnects, providing >40 GHz×m without the need for any launch conditioning.The authors would like to acknowledge Dow Corning for providing the waveguide samples and EPSRC for supporting the work. Additional data related to this publication is available at the University of Cambridge data repository (https://www.repository.cam.ac.uk/handle/1810/251390)

    Pluggable Optical Connector Interfaces for Electro-Optical Circuit Boards

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    A study is hereby presented on system embedded photonic interconnect technologies, which would address the communications bottleneck in modern exascale data centre systems driven by exponentially rising consumption of digital information and the associated complexity of intra-data centre network management along with dwindling data storage capacities. It is proposed that this bottleneck be addressed by adopting within the system electro-optical printed circuit boards (OPCBs), on which conventional electrical layers provide power distribution and static or low speed signaling, but high speed signals are conveyed by optical channels on separate embedded optical layers. One crucial prerequisite towards adopting OPCBs in modern data storage and switch systems is a reliable method of optically connecting peripheral cards and devices within the system to an OPCB backplane or motherboard in a pluggable manner. However the large mechanical misalignment tolerances between connecting cards and devices inherent to such systems are contrasted by the small sizes of optical waveguides required to support optical communication at the speeds defined by prevailing communication protocols. An innovative approach is therefore required to decouple the contrasting mechanical tolerances in the electrical and optical domains in the system in order to enable reliable pluggable optical connectivity. This thesis presents the design, development and characterisation of a suite of new optical waveguide connector interface solutions for electro-optical printed circuit boards (OPCBs) based on embedded planar polymer waveguides and planar glass waveguides. The technologies described include waveguide receptacles allowing parallel fibre connectors to be connected directly to OPCB embedded planar waveguides and board-to-board connectors with embedded parallel optical transceivers allowing daughtercards to be orthogonally connected to an OPCB backplane. For OPCBs based on embedded planar polymer waveguides and embedded planar glass waveguides, a complete demonstration platform was designed and developed to evaluate the connector interfaces and the associated embedded optical interconnect. Furthermore a large portfolio of intellectual property comprising 19 patents and patent applications was generated during the course of this study, spanning the field of OPCBs, optical waveguides, optical connectors, optical assembly and system embedded optical interconnects

    Design, measurement and analysis of multimode light guides and waveguides for display systems and optical backplane interconnections

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    The aim of the research in this thesis was to design and model multimode lightguides for optimising visible light for liquid crystal display systems and to design, model and experimentally test infrared light propagation within polymer multimode waveguides as board-to-board interconnects for high data rate communication. Ray tracing models the behaviour of a novel LCD colour separating backlight to optimize its efficiency by establishing the optimum dimensions and position for a unique micro-mirror array within the light guide. The output efficiency increased by 38.2% compared to the case without the embedded mirror array. A novel simulation technique combined a model of liquid crystal director orientation and a non-sequential ray tracing program was used first time to compute the reflected intensity from a LCOS device for a rear projection TV system. The performance of the LCOS display was characterised by computing the contrast ratio over a ±15° viewing cone. Photolithographically manufactured embedded multimode waveguides made from acrylate Truemode® polymer are characterized by measuring the optical transmission loss of key waveguide components including. straight, bend and crossing. Design rules derived from the experimental measurement were used to optimize optical PCB (OPCB) layout. A most compact and complex optical interconnects layout up-to-date for data centres, including parallel straight waveguide sections, cascaded 90° bends and waveguide crossing other than 90° angles, was designed, tested and used in an optic-electrical demonstration platform to convey a 10.3 Gb/s data. A further new method for reducing the end facet roughness and so the coupling loss, by curing a thin layer of core material at the end of the waveguide facet to cover the roughness fluctuations, was proposed and successfully demonstrated giving the best results reported to date resulting in an improvement of 2.8 dB which was better than the results obtained by using index matching fluid

    Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

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    We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges
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