Energy-Efficient and Reliable Computing in Dark Silicon Era

Dark silicon denotes the phenomenon that, due to thermal and power constraints, the fraction of transistors that can operate at full frequency is decreasing in each technology generation. Moore’s law and Dennard scaling had been backed and coupled appropriately for five decades to bring commensurate exponential performance via single core and later muti-core design. However, recalculating Dennard scaling for recent small technology sizes shows that current ongoing multi-core growth is demanding exponential thermal design power to achieve linear performance increase. This process hits a power wall where raises the amount of dark or dim silicon on future multi/many-core chips more and more. Furthermore, from another perspective, by increasing the number of transistors on the area of a single chip and susceptibility to internal defects alongside aging phenomena, which also is exacerbated by high chip thermal density, monitoring and managing the chip reliability before and after its activation is becoming a necessity. The proposed approaches and experimental investigations in this thesis focus on two main tracks: 1) power awareness and 2) reliability awareness in dark silicon era, where later these two tracks will combine together. In the first track, the main goal is to increase the level of returns in terms of main important features in chip design, such as performance and throughput, while maximum power limit is honored. In fact, we show that by managing the power while having dark silicon, all the traditional benefits that could be achieved by proceeding in Moore’s law can be also achieved in the dark silicon era, however, with a lower amount. Via the track of reliability awareness in dark silicon era, we show that dark silicon can be considered as an opportunity to be exploited for different instances of benefits, namely life-time increase and online testing. We discuss how dark silicon can be exploited to guarantee the system lifetime to be above a certain target value and, furthermore, how dark silicon can be exploited to apply low cost non-intrusive online testing on the cores. After the demonstration of power and reliability awareness while having dark silicon, two approaches will be discussed as the case study where the power and reliability awareness are combined together. The first approach demonstrates how chip reliability can be used as a supplementary metric for power-reliability management. While the second approach provides a trade-off between workload performance and system reliability by simultaneously honoring the given power budget and target reliability

Adaptive Knobs for Resource Efficient Computing

Performance demands of emerging domains such as artificial intelligence, machine learning and vision, Internet-of-things etc., continue to grow. Meeting such requirements on modern multi/many core systems with higher power densities, fixed power and energy budgets, and thermal constraints exacerbates the run-time management challenge. This leaves an open problem on extracting the required performance within the power and energy limits, while also ensuring thermal safety. Existing architectural solutions including asymmetric and heterogeneous cores and custom acceleration improve performance-per-watt in specific design time and static scenarios. However, satisfying applications’ performance requirements under dynamic and unknown workload scenarios subject to varying system dynamics of power, temperature and energy requires intelligent run-time management. Adaptive strategies are necessary for maximizing resource efficiency, considering i) diverse requirements and characteristics of concurrent applications, ii) dynamic workload variation, iii) core-level heterogeneity and iv) power, thermal and energy constraints. This dissertation proposes such adaptive techniques for efficient run-time resource management to maximize performance within fixed budgets under unknown and dynamic workload scenarios. Resource management strategies proposed in this dissertation comprehensively consider application and workload characteristics and variable effect of power actuation on performance for pro-active and appropriate allocation decisions. Specific contributions include i) run-time mapping approach to improve power budgets for higher throughput, ii) thermal aware performance boosting for efficient utilization of power budget and higher performance, iii) approximation as a run-time knob exploiting accuracy performance trade-offs for maximizing performance under power caps at minimal loss of accuracy and iv) co-ordinated approximation for heterogeneous systems through joint actuation of dynamic approximation and power knobs for performance guarantees with minimal power consumption. The approaches presented in this dissertation focus on adapting existing mapping techniques, performance boosting strategies, software and dynamic approximations to meet the performance requirements, simultaneously considering system constraints. The proposed strategies are compared against relevant state-of-the-art run-time management frameworks to qualitatively evaluate their efficacy

Virtual Runtime Application Partitions for Resource Management in Massively Parallel Architectures

This thesis presents a novel design paradigm, called Virtual Runtime Application Partitions (VRAP), to judiciously utilize the on-chip resources. As the dark silicon era approaches, where the power considerations will allow only a fraction chip to be powered on, judicious resource management will become a key consideration in future designs. Most of the works on resource management treat only the physical components (i.e. computation, communication, and memory blocks) as resources and manipulate the component to application mapping to optimize various parameters (e.g. energy efficiency). To further enhance the optimization potential, in addition to the physical resources we propose to manipulate abstract resources (i.e. voltage/frequency operating point, the fault-tolerance strength, the degree of parallelism, and the configuration architecture). The proposed framework (i.e. VRAP) encapsulates methods, algorithms, and hardware blocks to provide each application with the abstract resources tailored to its needs. To test the efficacy of this concept, we have developed three distinct self adaptive environments: (i) Private Operating Environment (POE), (ii) Private Reliability Environment (PRE), and (iii) Private Configuration Environment (PCE) that collectively ensure that each application meets its deadlines using minimal platform resources. In this work several novel architectural enhancements, algorithms and policies are presented to realize the virtual runtime application partitions efficiently. Considering the future design trends, we have chosen Coarse Grained Reconfigurable Architectures (CGRAs) and Network on Chips (NoCs) to test the feasibility of our approach. Specifically, we have chosen Dynamically Reconfigurable Resource Array (DRRA) and McNoC as the representative CGRA and NoC platforms. The proposed techniques are compared and evaluated using a variety of quantitative experiments. Synthesis and simulation results demonstrate VRAP significantly enhances the energy and power efficiency compared to state of the art.Siirretty Doriast

OrthoNoC: a broadcast-oriented dual-plane wireless network-on-chip architecture

© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other worksOn-chip communication remains as a key research issue at the gates of the manycore era. In response to this, novel interconnect technologies have opened the door to new Network-on-Chip (NoC) solutions towards greater scalability and architectural flexibility. Particularly, wireless on-chip communication has garnered considerable attention due to its inherent broadcast capabilities, low latency, and system-level simplicity. This work presents ORTHONOC, a wired-wireless architecture that differs from existing proposals in that both network planes are decoupled and driven by traffic steering policies enforced at the network interfaces. With these and other design decisions, ORTHONOC seeks to emphasize the ordered broadcast advantage offered by the wireless technology. The performance and cost of ORTHONOC are first explored using synthetic traffic, showing substantial improvements with respect to other wired-wireless designs with a similar number of antennas. Then, the applicability of ORTHONOC in the multiprocessor scenario is demonstrated through the evaluation of a simple architecture that implements fast synchronization via ordered broadcast transmissions. Simulations reveal significant execution time speedups and communication energy savings for 64-threaded benchmarks, proving that the value of ORTHONOC goes beyond simply improving the performance of the on-chip interconnect.Peer ReviewedPostprint (author's final draft

Optimization-based power and thermal management for dark silicon aware 3D chip multiprocessors using heterogeneous cache hierarchy

Management of a problem recently known as “dark silicon” is a new challenge in multicore designs. Prior innovative studies have addressed the dark silicon problem in the fields of power-efficient core design. However, addressing dark silicon challenges in uncore component designs such as cache hierarchy, on-chip interconnect etc. that consume significant portion of the on-chip power consumption is largely unexplored. In this paper, for the first time, we propose an integrated approach which considers the impact of power consumption of core and uncore components simultaneously to improve multi/many-core performance in the dark silicon era. The proposed approach dynamically (1) predicts the changing program behavior on each core; (2) re-determines frequency/voltage, cache capacity and technology in each level of the cache hierarchy based on the program's scalability in order to satisfy the power and temperature constraints. In the proposed architecture, for future chip-multiprocessors (CMPs), we exploit emerging technologies such as non-volatile memories (NVMs) and 3D techniques to combat dark silicon. Also, for the first time, we propose a detailed power model which is useful for future dark silicon CMPs power modeling. Experimental results on SPEC 2000/2006 benchmarks show that the proposed method improves throughput by about 54.3% and energy-delay product by about 61% on average, respectively, in comparison with the conventional CMP architecture with homogenous cache system. (A preliminary short version of this work was presented in the 18th Euromicro Conference on Digital System Design (DSD), 2015.) © 2017 Elsevier B.V

Next Generation Silicon Photonic Transceiver: From Device Innovation to System Analysis

Silicon photonics is recognized as a disruptive technology that has the potential to reshape many application areas, for example, data center communication, telecommunications, high-performance computing, and sensing. The key capability that silicon photonics offers is to leverage CMOS-style design, fabrication, and test infrastructure to build compact, energy-efficient, and high-performance integrated photonic systems-on- chip at low cost. As the need to squeeze more data into a given bandwidth and a given footprint increases, silicon photonics becomes more and more promising. This work develops and demonstrates novel devices, methodologies, and architectures to resolve the challenges facing the next-generation silicon photonic transceivers. The first part of this thesis focuses on the topology optimization of passive silicon photonic devices. Specifically, a novel device optimization methodology - particle swarm optimization in conjunction with 3D finite-difference time-domain (FDTD), has been proposed and proven to be an effective way to design a wide range of passive silicon photonic devices. We demonstrate a polarization rotator and a 90◦ optical hybrid for polarization-diversity and phase-diversity communications - two important schemes to increase the communication capacity by increasing the spectral efficiency. The second part of this thesis focuses on the design and characterization of the next- generation silicon photonic transceivers. We demonstrate a polarization-insensitive WDM receiver with an aggregate data rate of 160 Gb/s. This receiver adopts a novel architecture which effectively reduces the polarization-dependent loss. In addition, we demonstrate a III-V/silicon hybrid external cavity laser with a tuning range larger than 60 nm in the C-band on a silicon-on-insulator platform. A III-V semiconductor gain chip is hybridized into the silicon chip by edge-coupling to the silicon chip. The demonstrated packaging method requires only passive alignment and is thus suitable for high-volume production. We also demonstrate all silicon-photonics-based transmission of 34 Gbaud (272 Gb/s) dual-polarization 16-QAM using our integrated laser and silicon photonic coherent transceiver. The results show no additional penalty compared to commercially available narrow linewidth tunable lasers. The last part of this thesis focuses on the chip-scale optical interconnect and presents two different types of reconfigurable memory interconnects for multi-core many-memory computing systems. These reconfigurable interconnects can effectively alleviate the memory access issues, such as non-uniform memory access, and Network-on-Chip (NoC) hot-spots that plague the many-memory computing systems by dynamically directing the available memory bandwidth to the required memory interface

Design and Optimization of Networks-on-Chip for Future Heterogeneous Systems-on-Chip

Due to the tight power budget and reduced time-to-market, Systems-on-Chip (SoC) have emerged as a power-efficient solution that provides the functionality required by target applications in embedded systems. To support a diverse set of applications such as real-time video/audio processing and sensor signal processing, SoCs consist of multiple heterogeneous components, such as software processors, digital signal processors, and application-specific hardware accelerators. These components offer different flexibility, power, and performance values so that SoCs can be designed by mix-and-matching them. With the increased amount of heterogeneous cores, however, the traditional interconnects in an SoC exhibit excessive power dissipation and poor performance scalability. As an alternative, Networks-on-Chip (NoC) have been proposed. NoCs provide modularity at design-time because communications among the cores are isolated from their computations via standard interfaces. NoCs also exploit communication parallelism at run-time because multiple data can be transferred simultaneously. In order to construct an efficient NoC, the communication behaviors of various heterogeneous components in an SoC must be considered with the large amount of NoC design parameters. Therefore, providing an efficient NoC design and optimization framework is critical to reduce the design cycle and address the complexity of future heterogeneous SoCs. This is the thesis of my dissertation. Some existing design automation tools for NoCs support very limited degrees of automation that cannot satisfy the requirements of future heterogeneous SoCs. First, these tools only support a limited number of NoC design parameters. Second, they do not provide an integrated environment for software-hardware co-development. Thus, I propose FINDNOC, an integrated framework for the generation, optimization, and validation of NoCs for future heterogeneous SoCs. The proposed framework supports software-hardware co-development, incremental NoC design-decision model, SystemC-based NoC customization and generation, and fast system protyping with FPGA emulations. Virtual channels (VC) and multiple physical (MP) networks are the two main alternative methods to provide better performance, support quality-of-service, and avoid protocol deadlocks in packet-switched NoC design. To examine the effect of using VCs and MPs with other NoC architectural parameters, I completed a comprehensive comparative analysis that combines an analytical model, synthesis-based designs for both FPGAs and standard-cell libraries, and system-level simulations. Based on the results of this analysis, I developed VENTTI, a design and simulation environment that combines a virtual platform (VP), a NoC synthesis tool, and four NoC models characterized at different abstraction levels. VENTTI facilitates an incremental decision-making process with four NoC abstraction models associated with different NoC parameters. The selected NoC parameters can be validated by running simulations with the corresponding model instantiated in the VP. I augmented this framework to complete FINDNOC by implementing ICON, a NoC generation and customization tool that dynamically combines and customizes synthesizable SystemC components from a predesigned library. Thanks to its flexibility and automatic network interface generation capabilities, ICON can generate a rich variety of NoCs that can be then integrated into any Embedded Scalable Platform (ESP) architectures for fast prototying with FPGA emulations. I designed FINDNOC in a modular way that makes it easy to augmenting it with new capabilities. This, combined with the continuous progress of the ESP design methodology, will provide a seamless SoC integration framework, where the hardware accelerators, software applications, and NoCs can be designed, validated, and integrated simultaneously, in order to reduce the design cycle of future SoC platforms