Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs

For practical testing and detection of electromigration (EM) induced failures in dual damascene copper interconnects, one critical issue is creating stressing conditions to induce the chip to fail exclusively under EM in a very short period of time so that EM sign-off and validation can be carried out efficiently. Existing acceleration techniques, which rely on increasing temperature and current densities beyond the known limits, also accelerate other reliability effects making it very difficult, if not impossible, to test EM in isolation. In this article, we propose novel EM wear-out acceleration techniques to address the aforementioned issue. First we show that multi-segment interconnects with reservoir and sink structures can be exploited to significantly speedup the EM wear-out process. Based on this observation, we propose three strategies to accelerate EM induced failure: reservoir-enhanced acceleration, sink-enhanced acceleration, and a hybrid method that combines both reservoir and sink structures. We then propose several configurable interconnect structures that exploit atomic reservoirs and sinks for accelerated EM testing. Such configurable interconnect structures are very flexible and can be used to achieve significant lifetime reductions at the cost of some routing resources. Using the proposed technique, EM testing can be carried out at nominal current densities, and at a much lower temperature compared to traditional testing methods. This is the most significant contribution of this work since, to our knowledge, this is the only method that allows EM testing to be performed in a controlled environment without the risk of invoking other reliability effects that are also accelerated by elevated temperature and current density. Simulation results show that, using the proposed method, we can reduce the EM lifetime of a chip from 10 years down to a few hours 10^5X acceleration under the 150C temperature limit, which is sufficient for practical EM testing of typical nanometer CMOS ICs

Statistical Power Supply Dynamic Noise Prediction in Hierarchical Power Grid and Package Networks

One of the most crucial high performance systems-on-chip design challenge is to front their power supply noise sufferance due to high frequencies, huge number of functional blocks and technology scaling down. Marking a difference from traditional post physical-design static voltage drop analysis, /a priori dynamic voltage drop/evaluation is the focus of this work. It takes into account transient currents and on-chip and package /RLC/ parasitics while exploring the power grid design solution space: Design countermeasures can be thus early defined and long post physical-design verification cycles can be shortened. As shown by an extensive set of results, a carefully extracted and modular grid library assures realistic evaluation of parasitics impact on noise and facilitates the power network construction; furthermore statistical analysis guarantees a correct current envelope evaluation and Spice simulations endorse reliable result

Thermally induced mechanical stress in the stator windings of electrical machines

The lifetime of an electrical machine mainly depends on the thermal overloading. Modern day applications of electrical machines on one hand require compact machines with high power density, while on the other hand force electrical machines to undergo frequent temperature cycling. Until recently, in the case of electrical machines, the main factor related to the degradation of the winding insulation was thought to be the thermal oxidization of the insulation materials. It has now been revealed that thermal overloading can also induce mechanical stress in the windings of electrical machines, which over time could lead to fatigue and degradation. In this paper, a comprehensive study of the thermally induced mechanical stress in the windings of an electrical machine is presented. The study is performed using combined thermo-mechanical models. The numerical results are validated by experiments on a segmented stator winding set-up

Physics-Based Electromigration Modeling and Analysis and Optimization

Long-term reliability is a major concern in modern VLSI design. Literature has shown that reliability gets worse as technology advances. It is expected that the future VLSI systems would have shorter reliability-induced lifetime comparing with previous generations. Being one of the most serious reliability effects, electromigration (EM) is a physical phenomenon of the migration of metal atoms due to the momentum exchange between atoms and the conducting electrons. It can cause wire resistance change or open circuit and result in functional failure of the circuit. Power-ground networks are the most vulnerable part to EM effect among all the interconnect wires since the current flow on this part is the largest on the chip. With new generation oftechnology node and aggressive design strategies, more accurate and efficient EM models are required. However, traditional EM approaches are very conservative and cannot meet current aggressive design strategies. Besides circuit level, EM also need to be thoroughly studied in system level due to limited power and temperature budgets among cores on chip. This research focuses on developing physical level EM model for VLSI circuits and system level EM optimization for multi-core systems in order to overcome the aforementioned problems. Specifically, for physical level, we develop two EM immortality check methods and a power grid EM check method. Firstly, a voltage based EM immortality analysis has been developed. Immortality condition in nucleation phase can be determined fast and accurately for multi-segment interconnect wires. Secondly, a saturation volume based incubation phase immortality check method has been proposed. This method can further reduce the redundancy in VLSI circuit design by immortality check in multiphase. Furthermore, both immortality check methods are integrated into a new power grid EM check methodology (EMspice) as filter for EM analysis. These filters can accelerate the simulation by filtering out immortal trees so that we only need to do simulation on fewer trees that are mortal. Coupled EM simulation considering both hydrostatic stress and electronic current/voltage in the power grid network will be applied to these mortal trees. This tool can work seamlessly with commercial synthesis flow. Besides physical level reliability models, system level reliability optimization is also discussed in this research. A deep reinforcement learning based EM optimization has been proposed for multi-core system. Both long term reliability effect (hard error) and transient soft error are considered. Energy can be optimized with all the reliability and other constraints fast and accurately compared to existing reliability management techniques. Last but not least, a scheduling based reliability optimization method for multi-core systems has been proposed. NBTI, HCI and EM are considered jointly. Lifetime of the system can be improved significantly compared to traditional methods which mainly focus on utilization

High-speed imaging in fluids

High-speed imaging is in popular demand for a broad range of experiments in fluids. It allows for a detailed visualization of the event under study by acquiring a series of image frames captured at high temporal and spatial resolution. This review covers high-speed imaging basics, by defining criteria for high-speed imaging experiments in fluids and to give rule-of-thumbs for a series of cases. It also considers stroboscopic imaging, triggering and illumination, and scaling issues. It provides guidelines for testing and calibration. Ultra high-speed imaging at frame rates exceeding 1 million frames per second is reviewed, and the combination of conventional experiments in fluids techniques with high-speed imaging techniques are discussed. The review is concluded with a high-speed imaging chart, which summarizes criteria for temporal scale and spatial scale and which facilitates the selection of a high-speed imaging system for the applicatio

Integrated Application of Active Controls (IAAC) technology to an advanced subsonic transport project: Current and advanced act control system definition study. Volume 2: Appendices

The current status of the Active Controls Technology (ACT) for the advanced subsonic transport project is investigated through analysis of the systems technical data. Control systems technologies under examination include computerized reliability analysis, pitch axis fly by wire actuator, flaperon actuation system design trade study, control law synthesis and analysis, flutter mode control and gust load alleviation analysis, and implementation of alternative ACT systems. Extensive analysis of the computer techniques involved in each system is included

Power Side Channels in Security ICs: Hardware Countermeasures

Power side-channel attacks are a very effective cryptanalysis technique that can infer secret keys of security ICs by monitoring the power consumption. Since the emergence of practical attacks in the late 90s, they have been a major threat to many cryptographic-equipped devices including smart cards, encrypted FPGA designs, and mobile phones. Designers and manufacturers of cryptographic devices have in response developed various countermeasures for protection. Attacking methods have also evolved to counteract resistant implementations. This paper reviews foundational power analysis attack techniques and examines a variety of hardware design mitigations. The aim is to highlight exposed vulnerabilities in hardware-based countermeasures for future more secure implementations