Model order reduction of time-delay systems using a laguerre expansion technique

The demands for miniature sized circuits with higher operating speeds have increased the complexity of the circuit, while at high frequencies it is known that effects such as crosstalk, attenuation and delay can have adverse effects on signal integrity. To capture these high speed effects a very large number of system equations is normally required and hence model order reduction techniques are required to make the simulation of the circuits computationally feasible. This paper proposes a higher order Krylov subspace algorithm for model order reduction of time-delay systems based on a Laguerre expansion technique. The proposed technique consists of three sections i.e., first the delays are approximated using the recursive relation of Laguerre polynomials, then in the second part, the reduced order is estimated for the time-delay system using a delay truncation in the Laguerre domain and in the third part, a higher order Krylov technique using Laguerre expansion is computed for obtaining the reduced order time-delay system. The proposed technique is validated by means of real world numerical examples

Delay Extraction Based Equivalent Elmore Model For RLC On-Chip Interconnects

As feature sizes for VLSI technology is shrinking, associated with higher operating frequency, signal integrity analysis of on-chip interconnects has become a real challenge for circuit designers. For this purpose, computer-aided-design (CAD) tools are necessary to simulate signal propagation of on-chip interconnects which has been an active area for research. Although SPICE models exist which can accurately predict signal degradation of interconnects, they are computationally expensive. As a result, more effective and analytic models for interconnects are required to capture the response at the output of high speed VLSI circuits. This thesis contributes to the development of efficient and closed form solution models for signal integrity analysis of on-chip interconnects. The proposed model uses a delay extraction algorithm to improve the accuracy of two-pole Elmore based models used in the analysis of on-chip distributed RLC interconnects. In the proposed scheme, the time of fight signal delay is extracted without increasing the number of poles or affecting the stability of the transfer function. This algorithm is used for both unit step and ramp inputs. From the delay rational approximation of the transfer function, analytic fitted expressions are obtained for the 50% delay and rise time for unit step input. The proposed algorithm is tested on point to point interconnections and tree structure networks. Numerical examples illustrate improved 50% delay and rise time estimates when compared to traditional Elmore based two-pole models

Performance and power optimization in VLSI physical design

As VLSI technology enters the nanoscale regime, a great amount of efforts have been made to reduce interconnect delay. Among them, buffer insertion stands out as an effective technique for timing optimization. A dramatic rise in on-chip buffer density has been witnessed. For example, in two recent IBM ASIC designs, 25% gates are buffers. In this thesis, three buffer insertion algorithms are presented for the procedure of performance and power optimization. The second chapter focuses on improving circuit performance under inductance effect. The new algorithm works under the dynamic programming framework and runs in provably linear time for multiple buffer types due to two novel techniques: restrictive cost bucketing and efficient delay update. The experimental results demonstrate that our linear time algorithm consistently outperforms all known RLC buffering algorithms in terms of both solution quality and runtime. That is, the new algorithm uses fewer buffers, runs in shorter time and the buffered tree has better timing. The third chapter presents a method to guarantee a high fidelity signal transmission in global bus. It proposes a new redundant via insertion technique to reduce via variation and signal distortion in twisted differential line. In addition, a new buffer insertion technique is proposed to synchronize the transmitted signals, thus further improving the effectiveness of the twisted differential line. Experimental results demonstrate a 6GHz signal can be transmitted with high fidelity using the new approaches. In contrast, only a 100MHz signal can be reliably transmitted using a single-end bus with power/ground shielding. Compared to conventional twisted differential line structure, our new techniques can reduce the magnitude of noise by 45% as witnessed in our simulation. The fourth chapter proposes a buffer insertion and gate sizing algorithm for million plus gates. The algorithm takes a combinational circuit as input instead of individual nets and greatly reduces the buffer and gate cost of the entire circuit. The algorithm has two main features: 1) A circuit partition technique based on the criticality of the primary inputs, which provides the scalability for the algorithm, and 2) A linear programming formulation of non-linear delay versus cost tradeoff, which formulates the simultaneous buffer insertion and gate sizing into linear programming problem. Experimental results on ISCAS85 circuits show that even without the circuit partition technique, the new algorithm achieves 17X speedup compared with path based algorithm. In the meantime, the new algorithm saves 16.0% buffer cost, 4.9% gate cost, 5.8% total cost and results in less circuit delay

On-Chip Digital Decoupling Capacitance Methodology

Signal integrity has become a major problem in digital IC design. One cause of this problem is device scaling which results in a sharp reduction of supply voltage, creating stringent noise margin requirements to ensure functionality. Reductions in feature size also result in increased clock speeds leading to many different high frequency noise producing components. As on-chip area increases to allow for more computational capability, so does the amount of digital logic to be placed, magnifying the effects of noisy interconnect structures. Supply noise, modeled as AV = Ldi/dt , is caused by rapid current spikes during a rise or fall time. Decoupling capacitors often fill empty on-chip space for the purpose of limiting this noise. This work introduces a novel methodology that attempts to quantify and locate decoupling capacitors within a power distribution network. The bondwire attached on the periphery of the face of the die is taken to be the dominant source of inductance. It is shown that distributing capacitance closer to the switching elements is most effective at reducing supply noise. A chip has been designed using TSMC 90 nm technology that implements the ideas presented in this work. Simulation results show that noise fluctuations are high enough such that random placement of decoupling capacitance is not effective for large digital structures. The amount of interconnect generated on-chip noise increases with area, resulting in the need for an optimal decoupling scheme. As scaling continues, supply voltages and noise margins will decrease, creating the need for a robust decoupling capacitance methodology

Analysis of crosstalk and field coupling to lossy MTL's in a SPICE environment

This paper proposes a circuit model for lossy multiconductor transmission lines (MTLs) suitable for implementation in modern SPICE simulators, as well as in any simulator supporting differential operators. The model includes the effects of a uniform or nonuniform disturbing field illuminating the line and is especially devised for the transient simulation of electrically long wideband interconnects with frequency dependent per-unit-length parameters. The MTL is characterized by its transient matched scattering responses, which are computed including both dc and skin losses by means of a specific algorithm for the inversion of the Laplace transform. The line characteristics are then represented in terms of differential operators and ideal delays to improve the numerical efficiency and to simplify the coding of the model in existing simulators. The model can be successfully applied to many kinds of interconnects ranging from micrometric high-resistivity metallizations to low-loss PCBs and cables, and can be considered a practical extension of the widely appreciated lossless MTL SPICE model, which maintains the simplicity and efficienc

Balanced truncation for time-delay systems via approximate gramians

In circuit simulation, when a large RLC network is connected with delay elements, such as transmission lines, the resulting system is a time-delay system (TDS). This paper presents a new model order reduction (MOR) scheme for TDSs with state time delays. It is the first time to reduce a TDS using balanced truncation. The Lyapunov-type equations for TDSs are derived, and an analysis of their computational complexity is presented. To reduce the computational cost, we approximate the controllability and observability Gramians in the frequency domain. The reduced-order models (ROMs) are then obtained by balancing and truncating the approximate Gramians. Numerical examples are presented to verify the accuracy and efficiency of the proposed algorithm. ©2011 IEEE.published_or_final_versionThe 16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011), Yokohama, Japan, 25-28 January 2011. In Proceedings of the 16th ASP-DAC, 2011, p. 55-60, paper 1C-

Modelling and analysis of crosstalk in scaled CMOS interconnects

The development of a general coupled RLC interconnect model for simulating scaled bus structures m VLSI is presented. Several different methods for extracting submicron resistance, inductance and capacitance parameters are documented. Realistic scaling dimensions for deep submicron design rules are derived and used within the model. Deep submicron HSPICE device models are derived through the use of constant-voltage scaling theory on existing 0.75µm and 1.0µm models to create accurate interconnect bus drivers. This complete model is then used to analyse crosstalk noise and delay effects on multiple scaling levels to determine the dependence of crosstalk on scaling level. Using this data, layout techniques and processing methods are suggested to reduce crosstalk in system

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast