A nanoindentation investigation of local strain rate sensitivity in dual-phase Ti alloys

Using nanoindentation we have investigated the local strain rate sensitivity in dual-phase Ti alloys, Ti-6Al-2Sn-4Zr-xMo (x=2 and 6), as strain rate sensitivity could be a potential factor causing cold dwell fatigue. Electron backscatter diffraction (EBSD) was used to select hard and soft grain orientations within each of the alloys. Nanoindentation based tests using the continuous stiffness measurement (CSM) method were performed with variable strain rates, on the order of 10−1 to 10−3s−1. Local strain rate sensitivity is determined using a power law linking equivalent flow stress and equivalent plastic strain rate. Analysis of residual impressions using both a scanning electron microscope (SEM) and a focused ion beam (FIB) reveals local deformation around the indents and shows that nanoindentation tested structures containing both α and β phases within individual colonies. This indicates that the indentation results are derived from averaged α/β properties. The results show that a trend of local rate sensitivity in Ti6242 and Ti6246 is strikingly different; as similar rate sensitivities are found in Ti6246 regardless of grain orientation, whilst a grain orientation dependence is observed in Ti6242. These findings are important for understanding dwell fatigue deformation modes, and the methodology demonstrated can be used for screening new alloy designs and microstructures

Investigations on micro-mechanical properties of polycrystalline Ti(C,N) and Zr(C,N) coatings

Micro-mechanical properties of Ti(C,N) and Zr(C,N) coatings deposited by chemical vapor deposition on a WC-Co cemented carbide substrate were examined by micro-compression testing using a nanoindenter equipped with a flat punch. Scanning Electron Microscopy, Focused Ion Beam, Electron Backscattered Diffraction and Finite Element Modeling were combined to analyze the deformation mechanisms of the carbonitride layers at room temperature. The results revealed that Ti(C,N) undergoes a pure intergranular crack propagation and grain decohesion under uniaxial compression; whereas the fracture mode of Zr(C,N) was observed to be inter/transgranular failure with unexpected plastic deformation at room temperature.Peer ReviewedPostprint (author's final draft

An investigation of nanoindentation tests on the single crystal copper thin film via an AFM and MD simulation

Nanoindentation tests performed in an atomic force microscope have been utilized to directly measure the mechanical properties of single crystal metal thin films fabricated by the vacuum vapor deposition technique. Nanoindentation tests were conducted at various indentation depths to study the effect of indentation depths on the mechanical properties of thin films. The results were interpreted by using the Oliver-Pharr method with which direct observation and measurement of the contact area are not required. The elastic modulus of the single crystal copper film at various indentation depths was determined as 67.0±6.9GPa on average which is in reasonable agreement with the results reported by others. The indentation hardness constantly increases with decreasing indentation depth, indicating a strong size effect. In addition to the experimental work, a three-dimensional nanoindentation model of molecular dynamics (MD) simulations with embedded atom method (EAM) potential is proposed to elucidate the mechanics and mechanisms of nanoindentation of thin films from the atomistic point of view. MD simulations results also show that due to the size effect the plastic deformation via amorphous transformation is more favorable than via the generation and propagation of dislocations in nanoindentation of single crystal copper thin films

Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques

In this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro- and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro- and bulk-coating technology and the associated techniques to determine the minimum damage defects left on the coatings are discussed and their use reviewed

The Influence Of Surface Roughness In Micro Indentation

The Influence Of Surface Roughness In Micro Indentatio

Computational and theoretical aspects of a grain-boundary model at finite deformations

A model to describe the role of grain boundaries in the overall response of a polycrystalline material at small length scales subject to finite deformations is presented. Three alternative thermodynamically consistent plastic flow relations on the grain boundary are derived and compared using a series of numerical experiments. The numerical model is obtained by approximating the governing relations using the finite element method. In addition, the infinitesimal and finite deformation theories are compared, and the limitations of the former made clear

Improved micro-contact resistance model that considers material deformation, electron transport and thin film characteristics

This paper reports on an improved analytic model forpredicting micro-contact resistance needed for designing microelectro-mechanical systems (MEMS) switches. The originalmodel had two primary considerations: 1) contact materialdeformation (i.e. elastic, plastic, or elastic-plastic) and 2) effectivecontact area radius. The model also assumed that individual aspotswere close together and that their interactions weredependent on each other which led to using the single effective aspotcontact area model. This single effective area model wasused to determine specific electron transport regions (i.e. ballistic,quasi-ballistic, or diffusive) by comparing the effective radius andthe mean free path of an electron. Using this model required thatmicro-switch contact materials be deposited, during devicefabrication, with processes ensuring low surface roughness values(i.e. sputtered films). Sputtered thin film electric contacts,however, do not behave like bulk materials and the effects of thinfilm contacts and spreading resistance must be considered. Theimproved micro-contact resistance model accounts for the twoprimary considerations above, as well as, using thin film,sputtered, electric contact