Capacitance to voltage converter design for biosensor applications

Due to advances in MEMS fabrication, Lab-on-Chip (LoC) technology gained great progress. LoC refers to small chips that might do similar works to equipped laboratory. Miniaturization of laboratory platform results in low area, low sampleconsumption and less measurement time. Hence, LoC with IC integration finds numerous implementations in biomedical applications. Electrochemical biosensors are preferred for LoC applications because electrochemical biosensors can be easily integrated into IC designs due to electrode-based transducing. Capacitive biosensors are distinctive in electrochemical biosensors because of their reliability and sensitivity advantages. Therefore Interdigitated electrode (IDE) capacitor based biosensor system is preferred for development of biosensor platform. In this thesis, capacitive biosensor system with new Capacitance to Voltage Converter (CVC) designs for LoC applications is presented. Multiple IDE capacitor sensing and varactor-based compensation are new ideas that are presented in this thesis. Proposed system consists of five blocks; IDE Capacitor based tranducer, CVC, Low-Pass Filter, Linear LC-Tank Voltage Controlled Oscillator (VCO) and Class-E Power Amplifier (PA). System building blocks are designed and fabricated using IHP's 0.25 µm SiGe BiCMOS process because of its advantage at high frequency and post-process that IHP offers. Varactor tunable CVC design provides highly linear relationship between output voltage and capacitance change in sensing capacitor. Varactor is used in reference capacitor to compensate changes in sensing capacitor. Total chip area is 0.4 mm2 including pads. 10 MHz operating frequency is achieved. Total power consumption changes between 441 µW and 1,037 mW depending on the sensor capacitance

Remotely interrogated MEMS pressure sensor

This thesis considers the design and implementation of passive wireless microwave readable pressure sensors on a single chip. Two novel-all passive devices are considered for wireless pressure operation. The first device consists of a tuned circuit operating at 10 GHz fabricated on SiO2 membrane, supported on a silicon wafer. A pressure difference across the membrane causes it to deflect so that a passive resonant circuit detunes. The circuit is remotely interrogated to read off the sensor data. The chip area is 20 mm2 and the membrane area is 2mm2 with thickness of 4 µm. Two on chip passive resonant circuits were investigated: a meandered dipole and a zigzag antenna. Both have a physical length of 4.25 mm. the sensors show a shift in their resonant frequency in response to changing pressure of 10.28-10.27 GHz for the meandered dipole, and 9.61-9.58 GHz for the zigzag antenna. The sensitivities of the meandered dipole and zigzag sensors are 12.5 kHz and 16 kHz mbar, respectively. The second device is a pressure sensor on CMOS chip. The sensing element is capacitor array covering an area of 2 mm2 on a membrane. This sensor is coupled with a dipole antenna operating at 8.77 GHz. The post processing of the CMOS chip is carried out only in three steps, and the sensor on its own shows a sensitivity of 0.47fF/mbar and wireless sensitivity of 27 kHz/mbar. The MIM capacitors on membrane can be used to detune the resonant frequency of an antenna

High Performance Tunable Active Inductors For Microwave Circuits

Tez (Doktora) -- İstanbul Teknik Üniversitesi, Fen Bilimleri Enstitüsü, 2016Thesis (PhD) -- İstanbul Technical University, Institute of Science and Technology, 2016RF uygulamalarında enduktif karakteristiğe önemli ölçüde ihtiyaç duyulmaktadır; bunlar, özellikle filtreler, düşük gürültülü yükselteçler (LNA, low noise amplifiers), gerilim kontrollü osilatörler (VCO, voltage controlled oscillators), pek çok farklı türde yükselteç için band genişliği iyileştirilmesi, faz kaydırıcılar, güç bölücüler ve eşleştirme (matching) devreleri vb. uygulamalardır. Pasif sarmal çip-içi CMOS endüktansların eksik yönleri ayrıntılı olarak literatürde tartışılmıştır. Bu tür endüktanslar düşük değer katsayısı (quality factor), düşük öz-rezonans frekansı (SRF, self-resonance frequency), sabit ve düşük değerli endüktans ve geniş bir silikon (silicon) alanı gerektirmeleri gibi istenmeyen özelliklere sahiptirler. Diğer yandan, MOS transistorlar kullanılarak sentezlenen CMOS aktif endüktansların, pasif sarmal eşdeğer yapıları ile karşılaştırıldığında pek çok çekici karakteristik özellik sunabildikleri gösterilmiştir. Bunlar; geniş bir bölgede ayarlanabilir öz-rezonans frekansı başarımı, geniş bir bölgede ayarlanabilir endüktans başarımı, geniş bir bölgede ayarlanabilir değer katsayısı başarımı, CMOS teknolojileri ile tümüyle gerçeklenebilme ve az alan kaplama gibi karakteristik özellikleri olarak ortaya konulmaktadır. Literatürde jiratör-C (GC) prensibi, topolojisi, karakterizasyonu ve uygulamaları ayrıntılı olarak ele alınmaktadır. İşlemsel geçiş-iletkenliği kuvvetlendiricisi (OTA, operational transconductance amplifier) ile gerçeklenen GC devreleri, RF uygulamaları için oldukça uygundur. Bu özellik, GC yapılarının söz konusu yapı kullanılarak en az sayıda aktif eleman ile gerçeklenebilmesinden kaynaklanmaktadır. Gerek topraklı (grounded) gerekse yüzen (floating) aktif endüktansların GC devreleri ile gerçeklenebildiği gösterilmiştir. Aktif endüktansların başarımlarının nicel olarak ölçülmesi amacıyla, çok sayıda ölçüt ortaya konulmuştur. Bu ölçütler frekans çalışma aralığı, endüktans ayarlanabilirliği, değer katsayısı, gürültü ve güç tüketimi gibi temel özellikleri içerirler. CMOS transistorların parazitik bileşenlerinden dolayı tasarlanan aktif endüktanslar belirli bir frekans bölgesinde endüktif davranış gösterirler. Alt frekans sınırı, GC devrelerinin sıfır frekansı ile belirlenirken; üst frekans sınırı ise öz-rezonans frekansı ile belirlenir. Aktif endüktansların pasif sarmal eşdeğer yapılarına göre en önemli üstünlüklerinden biri de; endüktanslarının geniş bir değer aralığıunda ayarlanabilir olmasıdır. GC aktif endüktansların endüktans değeri, transistorların geçiş-iletkenliklerinin ya da MOS varaktörlerle gerçeklenen yük kapasitanslarının değiştirilmesi ile ayarlanabilir. Literatürde, GC topolojisine dayalı pek çok CMOS AI (active inductor) devresi bildirilmiştir. Bunların tümü, farklı teknikler kullanılarak yüksek başarımlı AI yapıları oluşturmayı amaçlamışlardır. Bu tezde, bunlardan güncel olan bazı GAI (grounded AI) ve FAI (floating AI) yapıları gözden geçirilmiştir. Bunlardan bazıları, değer katsayısını (QF) iyileştirmek amacıyla, AI kaybını telafi etmek için negatif direnç kullanmışlardır. GC yapıları RF uygulamaları için tasarlandıklarında en az sayıda transistor kullanımı çok kritiktir. Çünkü bu durum AI öz-rezonans frekansının artmasına yardımcı olur. AI’ler, kazanç artırma amacıyla LNA’lerde geniş kullanım alanı bulabilmektedirler. Diğer taraftan, AI yapılarının en önemli dezvantajlarından biri gürültü başarımının pasif endüktanslara nispeten yüksek olmasıdır. Literatürde bu dezavantajı gidermek amacıyla teklif edilen yaklaşımlardan biri dejenerasyon direncinin bulunduğu bir geribesleme katı kullanılarak girişe gelen gürültü katkısını azaltmayı amaçlamıştır. Literatürde teklif edilen tekniklerin amacı, parazitik bileşenlerin etkisini azaltmak ya da tümüyle ortadan kaldırmaktır. Bu tezde, ileri devre teknikleri kullanılarak, yeni topraklı (grounded) ve yüzen (floting) AI yapıları tasarlanmıştır. AI giriş ve çıkış düğümlerine ait iletkenlikleri azaltmak için çoklu-düzenlenmiş kaskod (multi-regulated cascode, MRC) katları QF değerini iyileştirme amacıyla kullanılmaktadır. MRC katı PMOS transistorlarıyla oluşturulmuştur. PMOS transistor kullanımı, • ikinci kat kutuplamasını ayarlayabilmek amacıyla, giriş transistor boyutunun mümkün olduğunca azaltılmasını, • ana AC işaret yolundaki transistor sayısının azaltılmasını, sağlamaktadır. Tezde sunulan teorik analiz ve serim sonrası benzetim sonuçları, MRC katı kullanımının AI özelliklerine yaptığı etkiyi göstermektedir. Elde edilen sonuçlar bu katların AI tasarımında yüksek QF elde edilmesini imkan tanıdığını ortaya koynaktadır. Literatürde, iki ana AI başarım karakteristiği olan SRF ve QF başarımlarının iyileştirmesi için çok sayıda çalışma bulunmaktadır. Bu tezde, birbirlerini etkilemeksizin SRF ve QF başarımlarının ayarlanabilmesi özelliğine sahip bir AI’ın tasarımı ve benzetgimi yapılmıştır. Kaskod ve RC geribesleme yapıları yeni AI tasarımında kullanılmıştır. Daha önce de tartışıldığı üzere, AI karakterizasyonu açısından giriş transistoru çok önemlidir. Girişi transistorunun kaskodlanması, ilk jiratörün geçiş-iletkenliğinin ve giriş parazitik kapasitansının birbirinden bağımsız olarak ayarlanması gibi önemli ve kullanışlı bir özelliği beraberinde getirir. Bunun yanısıra, endüktansın değeri diğer transistorun iletkenliği ile ayarlanabilir. AI parazitik seri-rezistansını yok etmek amacıyla kullanılan RC geribeslemesi, QF iyileştirmesini sağlayabilmektedir. Kaskod transistorların kutuplama koşulu bir diyot-bağlı transistor ile sağlandığından; önerilen yapı proses, gerilim ve sıcaklık değişimleri açısından kararlı ve yüksek başarımlıdır. AI yapılarında karşılaşılan düşük gürültü başarımı, AI’ların LNA gibi RF uygulamalarda kullanımını sınırlamaktadır. Bir AI’ın ana gürültü kaynağı giriş transistorudur. Düşük gürültülü AI elde etmek için, giriş transistoru yeterince büyük boyutlu olarak tasarlanmalıdır. Ne var ki, büyük boyutlu böyle bir transistor, düşük bir SRF ve dolayısıyla sınırlı bir endüktif bandı beraberinde getirir. Bu tezde, düşük gürültülü ve az kayıplı uygun bir AI, düşük gürültü gerektiren RF uygulamaları için sunulmuştur. Teklif edilen AI devresindeki tüm transistorların ortak-kaynak (common-source, CS) yapısında kullanılması, düşük iletkenliğe sahip düğümlerin dolayısıyla yüksek QF değerine sahip bir AI’ın elde edilmesine olanak sağlamaktadır. AI gürültüsünü azaltmak için, sırasıyla P-tipi MOS transistorlar ve ileri-besleme yolu yapısı (feed-forward path, FFP) kullanılmaktadır. Bilindiği gibi, sensörler çok çeşitli fiziksel büyüklüklerin eletrik mühendisiliği alanına taşınmasını sağlamaktadır. Çok geniş kullanım alanı bulan sensör tiplerinden biri kapasitif mikro algılıyıcılardır. Kapasitif mikro algılayıcılar mekanik hareketleri küçük kapasitans değişimlerine çevirirler. Micro algılayıcıdaki kapasitans değişimi femto-Farad mertebesinde olup algılamayı zorlaştırmaktadır. Diğer yandan, küçük bir kapasitans değişimini yüksek bir empedans değişimine çevirebilmeleri dolayısıyla, GC topolojilerinin kapasitif algılayıcılarda kullanılabileceğini söylemek mümkündür. Bu tezde, bu düşünceden yola çıkılarak, kesit duyarlılığını yok etme yeteneğine sahip yeni bir 3-eksen ivme-ölçer tasarlanmıştır. Yapının, her eksendeki ivmeyi bağımsız olarak algılayabilmesi için, algılayıcı elektrodları uygun olarak yerleştirilmiştir. Daha sonra, bir kapasitif algılayıcıdaki çok küçük kapasitans değişimlerini algılayabilmek için yeni bir GC yapısı teklif edilmiştir. Önerilen yapıda, çalışma frekansı aralığı ve ölçekleme çarpanı, kutuplama akımlarının ayarlanması suretiyle birbirini etkilemeksizin ayarlanabilmektedir. Ayrıca, önerilen yapıda, parazitik bileşenlerin etkisini yok etmek için RC geribesleme ve kaskod yapılar kullanılmaktadır. Son olarak, bu tezde sunulan AI’ların çok amaçlı özellikte olduğunu göstermek amacıyla, 3 ve 6. dereceden geniş bantlı mikrodalga filtrelerde kullanılmaları ele alınmıştır. İlki 3. dereceden bir Chebyshev alçak geçiren filtredir. Basitleştirilmiş gerçel frekans tekniği (SRFT, simplified real frequency technique) ile tasarlanan ikincisi ise, 6. dereceden bir Chebyshev band geçiren filtredir. Filtrelerin benzetimle elde edilmiş frekans yanıtları, bu tezde sunulan AI’ların literatürdeki yapılara güçlü birer alternatif olduklarını ortaya koymaktadır.There is critical need for inductive characteristics in RF applications, especially in filters, LNA, VCO, bandwidth-enhancement in many kinds of amplifiers, phase shifters, power divider and matching networks. The drawbacks of using passive and spiral inductors in CMOS process are discussed in the literature. It is shown that these kind of inductors suffer from a low quality factor, a low self-resonant frequency, a low and fixed inductance value and the need for a large silicon area. Furthermore, it is shown in the literature that CMOS Active Inductors (AIs), which are synthesized using MOS transistors, offer a number of attractive characteristics as compared with their spiral counterparts. These characteristics include a low silicon consumption, a large and tunable self-resonant frequency, a large and tunable inductance, a large and tunable quality factor, and fully realizable in digital CMOS technologies. Then principles, topologies, characterizations and implementation of the Gyrator-C (GC) network is discussed in-depth. The GC networks, which are implemented by operational transconductance amplifier, are suitable for RF application. This property arises from their minimum usage of active elements. It is shown that both grounded and floating active inductors can be implemented by GC networks. To provide a quantitative measure of the performance of AIs, a number of figure-of-merits have been introduced in the thesis. These figure-of-merits include frequency range, inductance tunability, quality factor, noise and power consumption. Due to parasitic components of CMOS transistors, designed AIs have inductive behavior in a specified frequency range. The low frequency bound is set by the frequency of the zero of the gyrator-C networks while the upper frequency bound is set by Self-Resonance Frequency (SRF). One of the key advantages of active inductors over their spiral counterparts is the large tunability of their inductance. The inductance of GC AIs can be tuned by varying either the transconductances of the transconductors or the load capacitance, which is implemented by MOS varactor. Based on GC topology, there are many reported CMOS AI circuits in literature. All of them have tried to invent high performance AI by using different techniques. Some of recent proposed Grounded AI (GAI) and Floating AI (FAI) circuits are reviewed in the thesis. Some of them use negative resistor to compensate the loss of AI for QF enhancement. Some others try to use minimum number of transistors in order to increase the self-resonance frequency of AI for RF applications. In some applications, AIs are used in LNA circuits for gain boosting purpose. In that applications, designers have tried to cancel the noise of AI by using a feedback stage with a degeneration resistor to reduce the noise contribution to the input. The main aim of all the techniques is to cancel or reduce the effects of parasitic components. In the thesis, four new grounded and floating AIs are designed by using advanced circuit techniques. The first one, Multi Regulated Cascode (MRC) stages are employed for lowering conductance in input and output nodes of AI. Thus, Q performance is improved. Since these stages are used only for increasing impedance of input/output nodes, they are made up of PMOS transistors in order to: • minimize the input transistor as small as possible in order to adjust second stage biasing, • decrease the number of transistors in main path of AC signal Theoretical analysis and post-layout simulation results shows the effectiveness of using MRC stages usage in properties of AI. High Q symmetric floating version of low loss inductor is also designed by utilizing MRC stages. Designers do their best to improve SRF and QF, two main characteristics in term of AI performance. An AI with ability to adjust its SRF and QF without affecting each other is designed and simulated as a third. The cascoding and RC feedback structures are used in the new design of AI. As it discussed before, input transistor is very important regarding to AI characterizations. Cascoding input transistor gives the ability to adjust the first gyrator’s transconductance and input parasitic capacitance independently which it results in adjusting the self-resonance frequency and quality factor separately. Due to our best knowledge from literature reviewing, it is first time that the properties of an inductor can be adjusted independently. Furthermore, the inductance value can be adjusted by other transistor’s transconductances. Also, the RC feedback is utilized to cancel the parasitic series-resistance of AI which results in QF enhancement. Since, bias condition of cascoding transistors is provided by a diode-connected transistor, the proposed structure is robust in terms of performance over variation in process, voltage and temperature. The Noise of designed AIs has limited the use of them in RF applications such as LNAs. The main noise source of an AI is its input transistor. In order to have low noise AI, the input transistor should be designed large enough. But it leads to low SRF which limited the inductive frequency band. As a fourth active inductor design, a low-noise and low-loss AI is presented suitable for RF low noise applications. Utilizing all transistors in Common Sourse (CS) configuration on the AI circuit leads to low conductance nodes which causes the AI to have high Q. P-type MOS transistors and Feed-Forward Path (FFP) are employed to decrease noise of the AI, respectively. The GC topologies can convert a low capacitance variation to high impedance changing which makes it a good choice for capacitive sensors. The capacitive based micro sensors convert mechanical signals to small capacitance variation. The capacitance variation in micro sensor is in the range of femto-Farads which makes it difficult to sense. Thus, the GC topologies can be used in capacitive sensors in order to sense small capacitive variations. In the thesis, this technique is used in a new accelerometer sensor. It is first time that a gyrator-C network is employed as an interface circuit for capacitive change detection in micro sensors. The new accelerometer structure is designed by using with ability to cancel cross section sensitivity. The sensor’s electrodes are located in such a way that enables the structure to detect acceleration in 3-axis independently. Embedding all 3-axis detecting electrodes in a single proof mass and ability to detect acceleration orientation are salient features of the proposed sensor. Consequently, a new GC configuration for sensing very small capacitance changes in a capacitive sensor is presented in the thesis. In the proposed configuration, the operating frequency range and scaling factor can be adjusted without affecting each other by tuning the bias currents of utilized gyrators. In addition, the proposed configuration employs RC feedback together with the cascoding technique to cancel the effect of the parasitic components in order to get accurate scaling from gyrator-C network. Finally, in order to show versatility of designed AIs, they are used in designed third and sixth order broadband microwave filters. The first one is a third order Chebyshev low pass filter. The second one, which is designed by using simplified real frequency technique is a sixth order Chebyshev band pass filter. The simulated frequency response of filters prove the workability of the designed AIs.DoktoraPh

Multi-channel ultra-low-power receiver architecture for body area networks

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2011.Cataloged from PDF version of thesis.Includes bibliographical references (p. 85-91).In recently published integrated medical monitoring systems, a common thread is the high power consumption of the radio compared to the other system components. This observation is indicative of a natural place to attempt a reduction in system power. Narrowband receivers in-particular can enjoy significant power reduction by employing high-Q bulk acoustic resonators as channel select filters directly at RF, allowing down-stream analog processing to be simplified, resulting in better energy efficiency. But for communications in the ISM bands, it is important to employ multiple frequency channels to permit frequency-division-multiplexing and provide frequency diversity in the face of narrowband interferers. The high-Q nature of the resonators means that frequency tuning to other channels in the same band is nearly impossible; hence, a new architecture is required to address this challenge. A multi-channel ultra-low power OOK receiver for Body Area Networks (BANs) has been designed and tested. The receiver multiplexes three Film Bulk Acoustic Resonators (FBARs) to provide three channels of frequency discrimination, while at the same time offering competitive sensitivity and superior energy efficiency in this class of BAN receivers. The high-Q parallel resonance of each resonator determines the passband. The resonator's Q is on the order of 1000 and its center frequency is approximately 2.5 GHz, resulting in a -3 dB bandwidth of roughly 2.5 MHz with a very steep rolloff. Channels are selected by enabling the corresponding LNA and mixer pathway with switches, but a key benefit of this architecture is that the switches are not in series with the resonator and do not de-Q the resonance. The measured 1E-3 sensitivity is -64 dBm at 1 Mbps for an energy efficiency of 180 pJ/bit. The resonators are packaged beside the CMOS using wirebonds for the prototype.by Phillip Michel Nadeau.S.M

High Performance Optical Transmitter Ffr Next Generation Supercomputing and Data Communication

High speed optical interconnects consuming low power at affordable prices are always a major area of research focus. For the backbone network infrastructure, the need for more bandwidth driven by streaming video and other data intensive applications such as cloud computing has been steadily pushing the link speed to the 40Gb/s and 100Gb/s domain. However, high power consumption, low link density and high cost seriously prevent traditional optical transceiver from being the next generation of optical link technology. For short reach communications, such as interconnects in supercomputers, the issues related to the existing electrical links become a major bottleneck for the next generation of High Performance Computing (HPC). Both applications are seeking for an innovative solution of optical links to tackle those current issues. In order to target the next generation of supercomputers and data communication, we propose to develop a high performance optical transmitter by utilizing CISCO Systems®\u27s proprietary CMOS photonic technology. The research seeks to achieve the following outcomes: 1. Reduction of power consumption due to optical interconnects to less than 5pJ/bit without the need for Ring Resonators or DWDM and less than 300fJ/bit for short distance data bus applications. 2. Enable the increase in performance (computing speed) from Peta-Flop to Exa-Flops without the proportional increase in cost or power consumption that would be prohibitive to next generation system architectures by means of increasing the maximum data transmission rate over a single fiber. 3. Explore advanced modulation schemes such as PAM-16 (Pulse-Amplitude-Modulation with 16 levels) to increase the spectrum efficiency while keeping the same or less power figure. This research will focus on the improvement of both the electrical IC and optical IC for the optical transmitter. An accurate circuit model of the optical device is created to speed up the performance optimization and enable co-simulation of electrical driver. Circuit architectures are chosen to minimize the power consumption without sacrificing the speed and noise immunity. As a result, a silicon photonic based optical transmitter employing 1V supply, featuring 20Gb/s data rate is fabricated. The system consists of an electrical driver in 40nm CMOS and an optical MZI modulator with an RF length of less than 0.5mm in 0.13&mu m SOI CMOS. Two modulation schemes are successfully demonstrated: On-Off Keying (OOK) and Pulse-Amplitude-Modulation-N (PAM-N N=4, 16). Both versions demonstrate signal integrity, interface density, and scalability that fit into the next generation data communication and exa-scale computing. Modulation power at 20Gb/s data rate for OOK and PAM-16 of 4pJ/bit and 0.25pJ/bit are achieved for the first time of an MZI type optical modulator, respectively

RF MEMS/NEMS RESONATORS FOR WIRELESS COMMUNICATION SYSTEMS AND ADSORPTION-DESORPTION PHASE NOISE

During the past two decades a considerable effort has been made to develop radio-frequency (RF) resonators which are fabricated using the micro/nanoelectro-mechanical systems (MEMS/NEMS) technologies, in order to replace conventional large off-chip components in wireless transceivers and other high-speed electronic systems.The first part of the paper presents an overview of RF MEMS and NEMS resonators, including those based on two-dimensional crystals (e.g. graphene). The frequency tuning in MEMS/NEMS resonators is then analyzed. Improvements that would be necessary in order for MEMS/NEMS resonators to meet the requirements of wireless systems are also discussed.The analysis of noise of RF MEMS/NEMS resonators and oscillators is especially important in modern wireless communication systems due to increasingly stringent requirements regarding the acceptable noise level in every next generation. The second part of the paper presents the analysis of adsorption-desorption (AD) noise in RF MEMS/NEMS resonators, which becomes pronounced with the decrease of components' dimensions, and is not sufficiently elaborated in the existing literature about such components. Finally, a theoretical model of phase noise in RF MEMS/NEMS oscillators will be presented, with a special emphasize on the influence of the resonator AD noise on the oscillator phase noise

An Optofluidic Lens Biochip and an x-ray Readable Blood Pressure Microsensor: Versatile Tools for in vitro and in vivo Diagnostics.

Three different microfabricated devices were presented for use in vivo and in vitro diagnostic biomedical applications: an optofluidic-lens biochip, a hand held digital imaging system and an x-ray readable blood pressure sensor for monitoring restenosis. An optofluidic biochip–termed the ‘Microfluidic-based Oil-Immersion Lens’ (mOIL) biochip were designed, fabricated and test for high-resolution imaging of various biological samples. The biochip consists of an array of high refractive index (n = 1.77) sapphire ball lenses sitting on top of an oil-filled microfluidic network of microchambers. The combination of the high optical quality lenses with the immersion oil results in a numerical aperture (NA) of 1.2 which is comparable to the high NA of oil immersion microscope objectives. The biochip can be used as an add-on-module to a stereoscope to improve the resolution from 10 microns down to 0.7 microns. It also has a scalable field of view (FOV) as the total FOV increases linearly with the number of lenses in the biochip (each lens has ~200 microns FOV). By combining the mOIL biochip with a CMOS sensor, a LED light source in 3D printed housing, a compact (40 grams, 4cmx4cmx4cm) high resolution (~0.4 microns) hand held imaging system was developed. The applicability of this system was demonstrated by counting red and white blood cells and imaging fluorescently labelled cells. In blood smear samples, blood cells, sickle cells, and malaria-infected cells were easily identified. To monitor restenosis, an x-ray readable implantable blood pressure sensor was developed. The sensor is based on the use of an x-ray absorbing liquid contained in a microchamber. The microchamber has a flexible membrane that is exposed to blood pressure. When the membrane deflects, the liquid moves into the microfluidic-gauge. The length of the microfluidic-gauge can be measured and consequently the applied pressure exerted on the diaphragm can be calculated. The prototype sensor has dimensions of 1x0.6x10mm and adequate resolution (19mmHg) to detect restenosis in coronary artery stents from a standard chest x-ray. Further improvements of our prototype will open up the possibility of measuring pressure drop in a coronary artery stent in a non-invasively manner.PhDMacromolecular Science and EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/111384/1/toning_1.pd