2,771 research outputs found

    トランジスタ・アレイ方式に基づくアナログレイアウトにおける密度最適化

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    In integrated circuit design of advanced technology nodes, layout density uniformity significantly influences the manufacturability due to the CMP variability. In analog design, especially, designers are suffering from passing the density checking since there are few useful tools. To tackle this issue, we focus on a transistor-array(TA)-style analog layout, and propose a density optimization algorithm consistent with complicated design rules. Based on TA-style, we introduce a density-aware layout format to explicitly control the layout pattern density, and provide the mathematical optimization approach. Hence, a design flow incorporating our density optimization can drastically reduce the design time with fewer iterations. In a design case of an OPAMP layout in a 65nm CMOS process, the result demonstrates that the proposed approach achieves more than 48× speed-up compared with conventional manual layout, meanwhile, it shows a good circuit performance in the post-layout simulation.北九州市立大

    Advanced analog layout design automation in compliance with density uniformity

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    To fabricate a reliable integrated circuit chip, foundries follow specific design rules and layout processing techniques. One of the parameters, which affect circuit performance and final electronic product quality, is the variation of thickness for each semiconductor layer within the fabricated chips. The thickness is closely dependent on the density of geometric features on that layer. Therefore, to ensure consistent thickness, foundries normally have to seriously control distribution of the feature density on each layer by using post-processing operations. In this research, the methods of controlling feature density distribution on different layers of an analog layout during the process of layout migration from an old technology to a new one or updated design specifications in the same technology have been investigated. We aim to achieve density-uniformity-aware layout retargeting for facilitating manufacturing process in the advanced technologies. This can offer an advantage right to the design stage for the designers to evaluate the effects of applying density uniformity to their drafted layouts, which are otherwise usually done by the foundries at the final manufacturing stage without considering circuit performance. Layout modification for density uniformity includes component position change and size modification, which may induce crosstalk noise caused by extra parasitic capacitance. To effectively control this effect, we have also investigated and proposed a simple yet accurate analytic method to model the parasitic capacitance on multi-layer VLSI chips. Supported by this capacitance modeling research, a unique methodology to deal with density-uniformity-aware analog layout retargeting with the capability of parasitic capacitance control has been presented. The proposed operations include layout geometry position rearrangement, interconnect size modification, and extra dummy fill insertion for enhancing layout density uniformity. All of these operations are holistically coordinated by a linear programming optimization scheme. The experimental results demonstrate the efficacy of the proposed methodology compared to the popular digital solutions in terms of minimum density variation and acute parasitic capacitance control

    Macro- and micro-modeling of crack propagation in encapsulation-based self-healing materials : application of XFEM and cohesive surface techniques

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    Encapsulation-based materials are produced introducing some small healing fluid-filled capsules in a matrix. These materials can self-heal when internal cracks intercept and break the capsules. If the healing agent is released, the crack can be sealed. However, this is not always the case. These capsules need to be designed with the adequate shape and material to be properly broken. This paper presents two application models based on the combination of eXtended Finite Element Method (XFEM) elements and Cohesive Surfaces technique (CS) to predict crack propagation. Two types of encapsulated systems are considered: a concrete beam in a three-point bending test, and a micro-scale model of a representative volume element of a polymer subjected to a uniaxial tensile test. Despite both systems rely on different capsule shapes and different constituent materials, the models predict a similar non-linear response of the overall material strength governed by the coupled effect of the interface strength and the capsule radii-to-thickness ratio. Furthermore, even if an inadequate material and geometry combination is used, it is found that the mere presence of capsules might achieve, under certain conditions, an interesting overall reinforcement effect. This effect is discussed in terms of clustering and volume fraction of capsules

    A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures

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    To reduce the product development time and achieve first-pass silicon success, fast and accurate estimation of very-large-scale integration (VLSI) interconnect, packaging and 3DI (3D integrated circuits) thermal profiles has become important. Present commercial thermal analysis tools are incapable of handling very complex structures and have integration difficulties with existing design flows. Many analytical thermal models, which could provide fast estimates, are either too specific or oversimplified. This paper highlights a methodology, which exploits electrical resistance solvers for thermal simulation, to allow acquisition of thermal profiles of complex structures with good accuracy and reasonable computation cost. Moreover, a novel accurate closed-form thermal model is developed. The model allows an isotropic or anisotropic equivalent medium to replace the noncritical back-end-of-line (BEOL) regions so that the simulation complexity is dramatically reduced. Using these techniques, this paper introduces the thermal modeling of practical complex VLSI structures to facilitate thermal guideline generation. It also demonstrates the benefits of the proposed anisotropic equivalent medium approximation for real VLSI structures in terms of the accuracy and computational cost. © 2006 IEEE.published_or_final_versio

    Turbofan commuter aircraft project design studies

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    Designing successful commercial aircraft is a difficult business; the stakes are high and the risks numerous. Researchers in the past have developed methods that assist the designers in reducing these risks. In recent years such methods have benefited from improvements in computer technology. The work described in this thesis extends these methods to the design of commuter aircraft. These aircraft are more sensitive to operational requirements than other types due in part to their high zero-fuel mass ratio. It is essential that, for such aircraft, the best information possible is available to the designers. The identification of the optimum aircraft configuration and mission characteristics constitutes a vital part of this knowledge. A review of literature, involving both modem computer-based and traditional search methods, has shown continuing interest in aircraft project design methods from the earliest times to the latest conference. The work presented in this thesis is seen to compliment this interest in computer methods and to apply these techniques to the relatively neglected area of commuter aircraft design. A survey of commuter operation and aircraft types revealed the often conflicting requirements and regulations which govern the design process in this area. Detailed statistical analysis on a collection of commuter aircraft showed no consistent data patterns, but did indicate the bouyant state of the market. Earlier research work on the design of twin-engined turbo-prop aircraft had provided some experience in the design of short-haul aircraft. The new work improves these methods and applies them to larger and faster turbo-fan commuter aircraft. Since the turbo-prop work, the optimiser developed at RAE (Farnborough) has been rewritten to work more efficiently and allow larger problems to be tackled. This new optimiser s linked to a new synthesis routine which simulates turbo-fan aircraft design. The synthesis program was calibrated against industrial design calculations and shown to give acceptably accuracte predictions. The resulting design program is fully described and computer listings are presented. To illustrate the use of the optimisation methods in the devleopment of a new aircraft, a series of industrially related design studies is presented. These studies range from the selection of the initial baseline configuration, through various parameters sensitivity investigations, to the evaluation of aircraft and engine stretch options. To demonstrate more general types of design study, a series of optimisations in which the engine size is variable was conducted. This provides the designer with a knowledge of the absolute (optimum) design surface and allows him to judge the 'penalties' inherent in his chosen configuration

    A Survey of What to Share in Federated Learning: Perspectives on Model Utility, Privacy Leakage, and Communication Efficiency

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    Federated learning (FL) has emerged as a highly effective paradigm for privacy-preserving collaborative training among different parties. Unlike traditional centralized learning, which requires collecting data from each party, FL allows clients to share privacy-preserving information without exposing private datasets. This approach not only guarantees enhanced privacy protection but also facilitates more efficient and secure collaboration among multiple participants. Therefore, FL has gained considerable attention from researchers, promoting numerous surveys to summarize the related works. However, the majority of these surveys concentrate on methods sharing model parameters during the training process, while overlooking the potential of sharing other forms of local information. In this paper, we present a systematic survey from a new perspective, i.e., what to share in FL, with an emphasis on the model utility, privacy leakage, and communication efficiency. This survey differs from previous ones due to four distinct contributions. First, we present a new taxonomy of FL methods in terms of the sharing methods, which includes three categories of shared information: model sharing, synthetic data sharing, and knowledge sharing. Second, we analyze the vulnerability of different sharing methods to privacy attacks and review the defense mechanisms that provide certain privacy guarantees. Third, we conduct extensive experiments to compare the performance and communication overhead of various sharing methods in FL. Besides, we assess the potential privacy leakage through model inversion and membership inference attacks, while comparing the effectiveness of various defense approaches. Finally, we discuss potential deficiencies in current methods and outline future directions for improvement
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