3D orthodontics visualization

Master'sMASTER OF ENGINEERIN

Variational Point Encoding Deformation for Dental Modeling

Digital dentistry has made significant advancements in recent years, yet numerous challenges remain to be addressed. In this study, we release a new extensive dataset of tooth meshes to encourage further research. Additionally, we propose Variational FoldingNet (VF-Net), which extends FoldingNet to enable probabilistic learning of point cloud representations. A key challenge in existing latent variable models for point clouds is the lack of a 1-to-1 mapping between input points and output points. Instead, they must rely on optimizing Chamfer distances, a metric that does not have a normalized distributional counterpart, preventing its usage in probabilistic models. We demonstrate that explicit minimization of Chamfer distances can be replaced by a suitable encoder, which allows us to increase computational efficiency while simplifying the probabilistic extension. Our experimental findings present empirical evidence demonstrating the superior performance of VF-Net over existing models in terms of dental scan reconstruction and extrapolation. Additionally, our investigation highlights the robustness of VF-Net's latent representations. These results underscore the promising prospects of VF-Net as an effective and reliable method for point cloud reconstruction and analysis

Additively Manufactured Polymer and Metal Lattice Structures with Eulerian Path

Lattice structure manufacturing with polymers and metals can benefit from the use of Eulerian paths. In this research, two types of lattice fabrication methods are studied where the Eulerian path can be applicable. Polymer lattice is improved by using a new assembly design, while a new way of metal lattice fabrication is discussed. For the fused filament fabrication process, a new interlocking design and assemble-based lattice structure building approach is investigated by increasing continuity in layers and avoiding support structures. To minimize contour plurality, Eulerian paths between the edges were enforced. Two configurations in the form of cubic and octet lattice structures are examined. The compressive performance of the designed lattice structures is compared with the traditional single-build direct 3D printed lattice structures. The mechanical performance (e.g., peak stress, specific energy absorption) of the assembled structures is found to be generally better than their direct print counterparts. The empirical constants of the Ashby-Gibson power law are found to be larger than their suggested values in both direct print and assembly techniques. However, their values are more compliant for octet assembled structures, which are less susceptible to manufacturing imperfections. A novel method of metal lattice manufacturing is introduced where a straight wire is bent to make intermediate structures, they are stacked, and loose nodes are joined to get the final lattice. The limitations of this method are studied, and a machine is constructed that can overcome some of the limitations and produce fabricable and stackable structures. These structures, generated by a custom-made visual basic code, can be periodic or aperiodic using a function to optimize the topology. The transient liquid phase (TLP) diffusion bonding method is studied as an appropriate joining method due to the inaccessibility of the nodes after stacking

Groupwise non-rigid registration for automatic construction of appearance models of the human craniofacial complex for analysis, synthesis and simulation

Finally, a novel application of 3D appearance modelling is proposed: a faster than real-time algorithm for statistically constrained quasi-mechanical simulation. Experiments demonstrate superior realism, achieved in the proposed method by employing statistical appearance models to drive the simulation, in comparison with the comparable state-of-the-art quasi-mechanical approaches.EThOS - Electronic Theses Online ServiceGBUnited Kingdo

Neural Extended Kalman Filter for State Estimation of Automated Guided Vehicle in Manufacturing Environment

To navigate autonomously in a manufacturing environment Automated Guided Vehicle (AGV) needs the ability to infer its pose. This paper presents the implementation of the Extended Kalman Filter (EKF) coupled with a feedforward neural network for the Visual Simultaneous Localization and Mapping (VSLAM). The neural extended Kalman filter (NEKF) is applied on-line to model error between real and estimated robot motion. Implementation of the NEKF is achieved by using mobile robot, an experimental environment and a simple camera. By introducing neural network into the EKF estimation procedure, the quality of performance can be improved

Prediction of Robot Execution Failures Using Neural Networks

In recent years, the industrial robotic systems are designed with abilities to adapt and to learn in a structured or unstructured environment. They are able to predict and to react to the undesirable and uncontrollable disturbances which frequently interfere in mission accomplishment. In order to prevent system failure and/or unwanted robot behaviour, various techniques have been addressed. In this study, a novel approach based on the neural networks (NNs) is employed for prediction of robot execution failures. The training and testing dataset used in the experiment consists of forces and torques memorized immediately after the real robot failed in assignment execution. Two types of networks are utilized in order to find best prediction method - recurrent NNs and feedforward NNs. Moreover, we investigated 24 neural architectures implemented in Matlab software package. The experimental results confirm that this approach can be successfully applied to the failures prediction problem, and that the NNs outperform other artificial intelligence techniques in this domain. To further validate a novel method, real world experiments are conducted on a Khepera II mobile robot in an indoor structured environment. The obtained results for trajectory tracking problem proved usefulness and the applicability of the proposed solution

Peripheral soldering of flip chip joints on passive RFID tags

Flip chip is the main component of a RFID tag. It is used in billions each year in electronic packaging industries because of its small size, high performance and reliability as well as low cost. They are used in microprocessors, cell phones, watches and automobiles. RFID tags are applied to or incorporated into a product, animal, or person for identification and tracking using radio waves. Some tags can be read from several meters away or even beyond the line of sight of the reader. Passive RFID tags are the most common type in use that employ external power source to transmit signals. Joining chips by laser beam welding have wide advantages over other methods of joining, but they are seen limited to transparent substrates. However, connecting solder bumps with anisotropic conductive adhesives (ACA) produces majority of the joints. A high percentage of them fail in couple of months, particularly when exposed to vibration. In the present work, failure of RFID tags under dynamic loading or vibration was studied; as it was identified as one of the key issue to explore. Earlier investigators focused more on joining chip to the bump, but less on its assembly, i.e., attaching to the substrate. Either of the joints, between chip and bump or between antenna and bump can fail. However, the latter is more vulnerable to failure. Antenna is attached to substrate, relatively fixed when subjected to oscillation. It is the flip chip not the antenna moves during vibration. So, the joint with antenna suffers higher stresses. In addition to this, the strength of the bonding agent i.e., ACA also much smaller compared to the metallic bond at the other end of the bump. Natural frequency of RFID tags was calculated both analytically and numerically, found to be in kilohertz range, high enough to cause resonance. Experimental investigations were also carried out to determine the same. However, the test results for frequency were seen to be in hundred hertz range, common to some applications. It was recognized that the adhesive material, commonly used for joining chips, was primarily accountable for their failures. Since components to which the RFID tags are attached to experience low frequency vibration, chip joints fail as they face resonance during oscillation. Adhesives having much lower modulus than metals are used for attaching bumps to the substrate antennas, and thus mostly responsible for this reduction in natural frequency. Poor adhesive bonding strength at the interface and possible rise in temperature were attributed to failures under vibration. In order to overcome the early failure of RFID tag joints, Peripheral Soldering, an alternative chip joining method was devised. Peripheral Soldering would replace the traditional adhesive joining by bonding the peripheral surface of the bump to the substrate antenna. Instead of joining solder bump directly to the antenna, holes are to be drilled through antenna and substrate. S-bond material, a less familiar but more compatible with aluminum and copper, would be poured in liquid form through the holes on the chip pad. However, substrates compatible to high temperature are to be used; otherwise temperature control would be necessary to avoid damage to substrate. This S-bond would form metallic joints between chip and antenna. Having higher strength and better adhesion property, S-bond material provides better bonding capability. The strength of a chip joined by Peripheral Soldering was determined by analytical, numerical and experimental studies. Strength results were then compared to those of ACA. For a pad size of 60 micron on a 0.5 mm square chip, the new chip joints with Sbond provide an average strength of 0.233N analytically. Numerical results using finite element analysis in ANSYS 11.0 were about 1% less than the closed form solutions. Whereas, ACA connected joints show the maximum strength of 0.113N analytically and 0.1N numerically. Both the estimates indicate Peripheral Soldering is more than twice stronger than adhesive joints. Experimental investigation was carried out to find the strength attained with S-bond by joining similar surfaces as those of chip pad and antenna, but in larger scale due to limitation in facilities. Results obtained were moderated to incorporate the effect of size. Findings authenticate earlier predictions of superior strengths with S-bond. A comparison with ACA strength, extracted from previous investigations, further indicates that S-bond joints are more than 10 times stronger. Having higher bonding strength than in ACA joints, Peripheral Soldering would provide better reliability of the chip connections, i.e., RFID tags. The benefits attained would pay off complexities involved in tweaking

Groupwise non-rigid registration for automatic construction of appearance models of the human craniofacial complex for analysis, synthesis and simulation

Finally, a novel application of 3D appearance modelling is proposed: a faster than real-time algorithm for statistically constrained quasi-mechanical simulation. Experiments demonstrate superior realism, achieved in the proposed method by employing statistical appearance models to drive the simulation, in comparison with the comparable state-of-the-art quasi-mechanical approaches

Advanced Applications of Rapid Prototyping Technology in Modern Engineering

Rapid prototyping (RP) technology has been widely known and appreciated due to its flexible and customized manufacturing capabilities. The widely studied RP techniques include stereolithography apparatus (SLA), selective laser sintering (SLS), three-dimensional printing (3DP), fused deposition modeling (FDM), 3D plotting, solid ground curing (SGC), multiphase jet solidification (MJS), laminated object manufacturing (LOM). Different techniques are associated with different materials and/or processing principles and thus are devoted to specific applications. RP technology has no longer been only for prototype building rather has been extended for real industrial manufacturing solutions. Today, the RP technology has contributed to almost all engineering areas that include mechanical, materials, industrial, aerospace, electrical and most recently biomedical engineering. This book aims to present the advanced development of RP technologies in various engineering areas as the solutions to the real world engineering problems

Engineering Principles

Over the last decade, there has been substantial development of welding technologies for joining advanced alloys and composites demanded by the evolving global manufacturing sector. The evolution of these welding technologies has been substantial and finds numerous applications in engineering industries. It is driven by our desire to reverse the impact of climate change and fuel consumption in several vital sectors. This book reviews the most recent developments in welding. It is organized into three sections: “Principles of Welding and Joining Technology,” “Microstructural Evolution and Residual Stress,” and “Applications of Welding and Joining.” Chapters address such topics as stresses in welding, tribology, thin-film metallurgical manufacturing processes, and mechanical manufacturing processes, as well as recent advances in welding and novel applications of these technologies for joining different materials such as titanium, aluminum, and magnesium alloys, ceramics, and plastics