164,947 research outputs found

    Planning for the semiconductor manufacturer of the future

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    Texas Instruments (TI) is currently contracted by the Air Force Wright Laboratory and the Defense Advanced Research Projects Agency (DARPA) to develop the next generation flexible semiconductor wafer fabrication system called Microelectronics Manufacturing Science & Technology (MMST). Several revolutionary concepts are being pioneered on MMST, including the following: new single-wafer rapid thermal processes, in-situ sensors, cluster equipment, and advanced Computer Integrated Manufacturing (CIM) software. The objective of the project is to develop a manufacturing system capable of achieving an order of magnitude improvement in almost all aspects of wafer fabrication. TI was awarded the contract in Oct., 1988, and will complete development with a fabrication facility demonstration in April, 1993. An important part of MMST is development of the CIM environment responsible for coordinating all parts of the system. The CIM architecture being developed is based on a distributed object oriented framework made of several cooperating subsystems. The software subsystems include the following: process control for dynamic control of factory processes; modular processing system for controlling the processing equipment; generic equipment model which provides an interface between processing equipment and the rest of the factory; specification system which maintains factory documents and product specifications; simulator for modelling the factory for analysis purposes; scheduler for scheduling work on the factory floor; and the planner for planning and monitoring of orders within the factory. This paper first outlines the division of responsibility between the planner, scheduler, and simulator subsystems. It then describes the approach to incremental planning and the way in which uncertainty is modelled within the plan representation. Finally, current status and initial results are described

    Survey on Additive Manufacturing, Cloud 3D Printing and Services

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    Cloud Manufacturing (CM) is the concept of using manufacturing resources in a service oriented way over the Internet. Recent developments in Additive Manufacturing (AM) are making it possible to utilise resources ad-hoc as replacement for traditional manufacturing resources in case of spontaneous problems in the established manufacturing processes. In order to be of use in these scenarios the AM resources must adhere to a strict principle of transparency and service composition in adherence to the Cloud Computing (CC) paradigm. With this review we provide an overview over CM, AM and relevant domains as well as present the historical development of scientific research in these fields, starting from 2002. Part of this work is also a meta-review on the domain to further detail its development and structure

    Special Session on Industry 4.0

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    Adaptive development and maintenance of user-centric software systems

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    A software system cannot be developed without considering the various facets of its environment. Stakeholders – including the users that play a central role – have their needs, expectations, and perceptions of a system. Organisational and technical aspects of the environment are constantly changing. The ability to adapt a software system and its requirements to its environment throughout its full lifecycle is of paramount importance in a constantly changing environment. The continuous involvement of users is as important as the constant evaluation of the system and the observation of evolving environments. We present a methodology for adaptive software systems development and maintenance. We draw upon a diverse range of accepted methods including participatory design, software architecture, and evolutionary design. Our focus is on user-centred software systems

    The Real World Software Process

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    The industry-wide demand for rapid development in concert with greater process maturity has seen many software development firms adopt tightly structured iterative processes. While a number of commercial vendors offer suitable process infrastructure and tool support, the cost of licensing, configuration and staff training may be prohibitive for the small and medium size enterprises (SMEs) which dominate the Asia-Pacific software industry. This work addresses these problems through the introduction of the Real World Software Process (RWSP), a freely available, Web-based iterative scheme designed specifically for small teams and organisations. RWSP provides a detailed process description, high quality document templates - including code review and inspection guidelines - and the integrated tutorial support necessary for successful usage by inexperienced developers and teams. In particular it is intended that the process be readily usable by software houses which at present do not follow a formal process, and that the free RWSP process infrastructure should be a vehicle for improving industry standards

    Development of an Extended Product Lifecycle Management through Service Oriented Architecture.

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    Organised by: Cranfield UniversityThe aim of this work is to define new business opportunities through the concept of Extended Product Lifecycle Management (ExtPLM), analysing its potential implementation within a Service Oriented Architecture. ExtPLM merges the concepts of Extended Product, Avatar and PLM. It aims at allowing a closer interaction between enterprises and their customers, who are integrated in all phases of the life cycle, creating new technical functionalities and services, improving both the practical (e.g. improving usage, improving safety, allowing predictive maintenance) and the emotional side (e.g. extreme customization) of the product.Mori Seiki – The Machine Tool Company; BAE Systems; S4T – Support Service Solutions: Strategy and Transitio
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