Custom Integrated Circuits

Contains table of contents for Part III, table of contents for Section 1 and reports on eleven research projects.IBM CorporationMIT School of EngineeringNational Science Foundation Grant MIP 94-23221Defense Advanced Research Projects Agency/U.S. Army Intelligence Center Contract DABT63-94-C-0053Mitsubishi CorporationNational Science Foundation Young Investigator Award Fellowship MIP 92-58376Joint Industry Program on Offshore Structure AnalysisAnalog DevicesDefense Advanced Research Projects AgencyCadence Design SystemsMAFET ConsortiumConsortium for Superconducting ElectronicsNational Defense Science and Engineering Graduate FellowshipDigital Equipment CorporationMIT Lincoln LaboratorySemiconductor Research CorporationMultiuniversity Research IntiativeNational Science Foundatio

Application specific instruction set processor design for embedded application using the coware tool

An Application Specific Instruction Set Processor (ASIP) is widely used as a System on a Chip(SoC) Component. ASIPs possess an instruction set which is tai-lored to benefit a specific application. Such specialization allows ASIPs to serve as an intermediate between two dominant processor design styles- ASICs which has high processing abilities at the cost of limited programmability and Programmable solu-tions such as FPGAs that provide programming exibility at the cost of less energy eficiency. In this dissertation the goal is to design ASIP, keeping in mind a temper-ature sensor system. The platform used for processor design is LISA 2.0 description language and processor designing environment from CoWare. Coware processor de-signer allows processor architecture to be defined at an abstract level and automatic generation of chain of software tools like assembler, linker and simulator for functional verification followed by RTL level description. RTL level description is used to gen-erate synthesized report of the design using RTL compiler and finally the layout is created using Cadence encounter

Automatic design of domain-specific instructions for low-power processors

This paper explores hardware specialization of low­ power processors to improve performance and energy efficiency. Our main contribution is an automated framework that analyzes instruction sequences of applications within a domain at the loop body level and identifies exactly and partially-matching sequences across applications that can become custom instructions. Our framework transforms sequences to a new code abstraction, a Merging Diagram, that improves similarity identification, clusters alike groups of potential custom instructions to effectively reduce the search space, and selects merged custom instructions to efficiently exploit the available customizable area. For a set of 11 media applications, our fast framework generates instructions that significantly improve the energy-delay product and speed­ up, achieving more than double the savings as compared to a technique analyzing sequences within basic blocks. This paper shows that partially-matched custom instructions, which do not significantly increase design time, are crucial to achieving higher energy efficiency at limited hardware areas

Processor-Core Based Design and Test

This tutorial responds to the rapidly increasing use of various cores for implementing systems-on-a-chip. It specifically focusses on processor cores. We will give some examples of cores, including DSP cores and application-specific instruction-set processors (ASIPs). We will mention market trends for these components, and we will touch design procedures, in particular the use compilers. Finally, we will discuss the problem of testing core-based designs. Existing solutions include boundary scan, embedded in-circuit emulation (ICE), the use of processor resources for stimuli/response compaction and self-test programs

A Micro Power Hardware Fabric for Embedded Computing

Field Programmable Gate Arrays (FPGAs) mitigate many of the problemsencountered with the development of ASICs by offering flexibility, faster time-to-market, and amortized NRE costs, among other benefits. While FPGAs are increasingly being used for complex computational applications such as signal and image processing, networking, and cryptology, they are far from ideal for these tasks due to relatively high power consumption and silicon usage overheads compared to direct ASIC implementation. A reconfigurable device that exhibits ASIC-like power characteristics and FPGA-like costs and tool support is desirable to fill this void. In this research, a parameterized, reconfigurable fabric model named as domain specific fabric (DSF) is developed that exhibits ASIC-like power characteristics for Digital Signal Processing (DSP) style applications. Using this model, the impact of varying different design parameters on power and performance has been studied. Different optimization techniques like local search and simulated annealing are used to determine the appropriate interconnect for a specific set of applications. A design space exploration tool has been developed to automate and generate a tailored architectural instance of the fabric.The fabric has been synthesized on 160 nm cell-based ASIC fabrication process from OKI and 130 nm from IBM. A detailed power-performance analysis has been completed using signal and image processing benchmarks from the MediaBench benchmark suite and elsewhere with comparisons to other hardware and software implementations. The optimized fabric implemented using the 130 nm process yields energy within 3X of a direct ASIC implementation, 330X better than a Virtex-II Pro FPGA and 2016X better than an Intel XScale processor