18,739 research outputs found
Memory and information processing in neuromorphic systems
A striking difference between brain-inspired neuromorphic processors and
current von Neumann processors architectures is the way in which memory and
processing is organized. As Information and Communication Technologies continue
to address the need for increased computational power through the increase of
cores within a digital processor, neuromorphic engineers and scientists can
complement this need by building processor architectures where memory is
distributed with the processing. In this paper we present a survey of
brain-inspired processor architectures that support models of cortical networks
and deep neural networks. These architectures range from serial clocked
implementations of multi-neuron systems to massively parallel asynchronous ones
and from purely digital systems to mixed analog/digital systems which implement
more biological-like models of neurons and synapses together with a suite of
adaptation and learning mechanisms analogous to the ones found in biological
nervous systems. We describe the advantages of the different approaches being
pursued and present the challenges that need to be addressed for building
artificial neural processing systems that can display the richness of behaviors
seen in biological systems.Comment: Submitted to Proceedings of IEEE, review of recently proposed
neuromorphic computing platforms and system
A Multiproject Chip Approach to the Teaching of Analog MOS LSI and VLSI
Multiproject chip implementation has been used in teaching analog MOS circuit design. After having worked with computer simulation and layout aids in homework problems, students designed novel circuits including several high
performance op amps, an A/D converter, a switched capacitor filter, a 1 K dynamic RAM, and a variety of less conventional MOS circuits such as a VII converter, an AC/DC converter, an AM radio receiver, a digitally-controlled
analog signal processor, and on-chip circuitry for measuring transistor capacitances. These circuits were laid out as part of an NMOS multiproject chip. Several of the designs exhibit a considerable degree of innovation;
fabrication pending, computer simulation shows that some may be pushing the state of the art. Several designs are of interest to digital designers; in fact, the course has provided knowledge and technique needed for detailed
digital circuit design at the gate level
The Rolf of Test Chips in Coordinating Logic and Circuit Design and Layout Aids for VLSI
This paper emphasizes the need for multipurpose test chips and comprehensive procedures for use in supplying accurate input data to both logic and circuit simulators and chip layout aids. It is shown that the location of test structures within test chips is critical in obtaining representative data, because geometrical distortions introduced during the photomasking process can lead to
significant intrachip parameter variations. In order to transfer test chip designs quickly, accurately, and economically, a commonly accepted portable chip layout notation and commonly accepted parametric tester language are needed. In order to measure test chips more accurately and more rapidly, parametric testers with improved architecture need to be developed in conjunction with
innovative test structures with on-chip signal conditioning
A low-speed BIST framework for high-performance circuit testing
Testing of high performance integrated circuits is becoming increasingly a challenging task owing to high clock frequencies. Often testers are not able to test such devices due to their limited high frequency capabilities. In this article we outline a design-for-test methodology such that high performance devices can be tested on relatively low performance testers. In addition, a BIST framework is discussed based on this methodology. Various implementation aspects of this technique are also addresse
A survey of carbon nanotube interconnects for energy efficient integrated circuits
This article is a review of the state-of-art carbon nanotube interconnects for Silicon application with respect to the recent literature. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) challenges with current copper interconnects, 2) process & growth of carbon nanotube interconnects compatible with back-end-of-line integration, and 3) modeling and simulation for circuit-level benchmarking and performance prediction. The focus is on the evolution of carbon nanotube interconnects from the process, theoretical modeling, and experimental characterization to on-chip interconnect applications. We provide an overview of the current advancements on carbon nanotube interconnects and also regarding the prospects for designing energy efficient integrated circuits. Each selected category is presented in an accessible manner aiming to serve as a survey and informative cornerstone on carbon nanotube interconnects relevant to students and scientists belonging to a range of fields from physics, processing to circuit design
Memristor MOS Content Addressable Memory (MCAM): Hybrid Architecture for Future High Performance Search Engines
Large-capacity Content Addressable Memory (CAM) is a key element in a wide
variety of applications. The inevitable complexities of scaling MOS transistors
introduce a major challenge in the realization of such systems. Convergence of
disparate technologies, which are compatible with CMOS processing, may allow
extension of Moore's Law for a few more years. This paper provides a new
approach towards the design and modeling of Memristor (Memory resistor) based
Content Addressable Memory (MCAM) using a combination of memristor MOS devices
to form the core of a memory/compare logic cell that forms the building block
of the CAM architecture. The non-volatile characteristic and the nanoscale
geometry together with compatibility of the memristor with CMOS processing
technology increases the packing density, provides for new approaches towards
power management through disabling CAM blocks without loss of stored data,
reduces power dissipation, and has scope for speed improvement as the
technology matures.Comment: 10 pages, 11 figure
VLSI Architecture and Design
Integrated circuit technology is rapidly approaching a state where feature sizes of one micron or less are tractable. Chip sizes are increasing slowly. These two developments result in considerably increased complexity in chip design. The physical characteristics of integrated circuit technology are also changing. The cost of communication will be dominating making new architectures and algorithms both feasible and desirable. A large
number of processors on a single chip will be possible. The cost of communication will make
designs enforcing locality superior to other types of designs.
Scaling down feature sizes results in increase of the delay that wires introduce. The delay even of metal wires will become significant. Time tends to be a local property which will make the design of globally synchronous systems more difficult. Self-timed systems will eventually become a necessity.
With the chip complexity measured in terms of logic devices increasing by more than an order of magnitude over the next few years the importance of efficient design methodologies and tools become crucial. Hierarchical and structured design are ways of dealing with the complexity of chip design. Structered design focuses on the information
flow and enforces a high degree of regularity. Both hierarchical and structured design encourage the use of cell libraries. The geometry of the cells in such libraries should be parameterized so that for instance cells can adjust there size to neighboring cells and make the proper interconnection. Cells with this quality can be used as a basis for "Silicon Compilers"
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