MEMS Accelerometers

Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

Sensing Movement: Microsensors for Body Motion Measurement

Recognition of body posture and motion is an important physiological function that can keep the body in balance. Man-made motion sensors have also been widely applied for a broad array of biomedical applications including diagnosis of balance disorders and evaluation of energy expenditure. This paper reviews the state-of-the-art sensing components utilized for body motion measurement. The anatomy and working principles of a natural body motion sensor, the human vestibular system, are first described. Various man-made inertial sensors are then elaborated based on their distinctive sensing mechanisms. In particular, both the conventional solid-state motion sensors and the emerging non solid-state motion sensors are depicted. With their lower cost and increased intelligence, man-made motion sensors are expected to play an increasingly important role in biomedical systems for basic research as well as clinical diagnostics

Development of a three-axis MEMS accelerometer

While originally developed to deploy air bags for the automotive industry, Microelectromechanical Systems (MEMS) based accelerometers have found their way into everything from video game controllers to cells phones. As prices drop and capabilities improve, it is expected that the use of accelerometers will further expand in the coming years. Accelerometers currently have the second highest MEMS sales volume, trailing only pressure sensors [1]. In this work several single and three-axis accelerometers are designed, fabricated, and tested under a variety of conditions. The designed accelerometers are all based off of the piezoresistive effect, where the value of a resistor changes with applied mechanical stress [2]. When accelerated, the inertia of a suspended proof mass causes stress on piezoresistors placed on support arms. The corresponding changes in these resistor values are then converted to an output voltage using a Wheatstone bridge. To sense acceleration independently in all three axes, structures with three distinct modes of vibration and three sets of Wheatstone bridges are used. Devices were fabricated at the Semiconductor and Microsystems Fabrication Laboratory (SMFL), located at RIT. A modified version of the RIT bulk MEMS process was used, consisting of 65 steps, 7 photolithography masks, bulk silicon diaphragm etch, and top hole release etch [3]. Unfortunately the finished chips show poor aluminum step coverage into contact vias and over polysilicon lines. This results in open circuits throughout the chip, prohibiting proper operation. Process corrections have been identified, and with proper fabrication the designs are still expected to yield working devices. Since the finished accelerometers were not functional, several commercial accelerometers have been tested to characterize sensitivity, linearity, cross-axis sensitivity, frequency response, and device lifetime

Advances in Fiber-Optic Extrinsic Fabry-Perot Interferometric Physical and Mechanical Sensors: A Review

Fabry-Perot Interferometers Have Found a Multitude of Scientific and Industrial Applications Ranging from Gravitational Wave Detection, High-Resolution Spectroscopy, and Optical Filters to Quantum Optomechanics. Integrated with Optical Fiber Waveguide Technology, the Fiber-Optic Fabry-Perot Interferometers Have Emerged as a Unique Candidate for High-Sensitivity Sensing and Have Undergone Tremendous Growth and Advancement in the Past Two Decades with their Successful Applications in an Expansive Range of Fields. the Extrinsic Cavity-Based Devices, I.e., the Fiber-Optic Extrinsic Fabry-Perot Interferometers (EFPIs), Enable Great Flexibility in the Design of the Sensitive Fabry-Perot Cavity Combined with State-Of-The-Art Micromachining and Conventional Mechanical Fabrication, Leading to the Development of a Diverse Array of EFPI Sensors Targeting at Different Physical Quantities. Here, We Summarize the Recent Progress of Fiber-Optic EFPI Sensors, Providing an overview of Different Physical and Mechanical Sensors based on the Fabry-Perot Interferometer Principle, with a Special Focus on Displacement-Related Quantities, Such as Strain, Force, Tilt, Vibration and Acceleration, Pressure, and Acoustic. the Working Principle and Signal Demodulation Methods Are Shown in Brief. Perspectives on Further Advancement of EFPI Sensing Technologies Are Also Discussed

Laterally Movable Gate Field Effect Transistor (LMGFET) for microsensor and microactuator applications

Laterally Movable Gate Field Effect Transistor (LMGFET) invented at LSU as a microactuator is the subject of study in this research. The gate moving in lateral direction in a LMGFET changes channel width but keeps the channel length and the gap between the metal gate and the gate oxide constant. LMGFET offers linear change in drain current with gate motion and a large displacement range. This research is the first demonstration of LMGFET. In this dissertation, a post-IC LIGA-like process for LMGFET microstructure fabrication has been developed that is compatible with monolithic integration with CMOS circuitry. A two-mask post-IC process has been developed in this research for LMGFET fabrication. This novel process utilizes S1813 photoresist as a sacrificial layer in conjunction with a thicker resist like AZ P4620 or SU-8 as an electroplating mold. New curing temperatures for the sacrificial layer photoresist have been determined for this purpose. LMGFET microstructures have been successfully integrated with CMOS circuitry on the same chip to form integrated microsystem. LMGFET microstructure driven by a comb-drive with serpentine retaining spring shows sensitivities Sel of 2 and 1.43 nA/V respectively at 5 and 25 Hz. These numbers reflect that LMGFET is capable of measuring nm range displacement. Electrical characteristics of a depletion type LMGFET structure are measured and show an average sensitivity Sl of - 4 µA/µm at drain to source voltage VDS of 10 V with the gate shorted to source. Several applications of microsystems utilizing LMGFET microstructures as a position sensor or an accelerometer, a spectrum analyzer or an electro-mechanical filter and a mechanical/optical switch are described

Optimal and Robust Design Method for Two-Chip Out-of-Plane Microaccelerometers

In this paper, an optimal and robust design method to implement a two-chip out-of-plane microaccelerometer system is presented. The two-chip microsystem consists of a MEMS chip for sensing the external acceleration and a CMOS chip for signal processing. An optimized design method to determine the device thickness, the sacrificial gap, and the vertical gap length of the M EMS sensing element is applied to minimize the fundamental noise level and also to achieve the robustness to the fabrication variations. In order to cancel out the offset and gain variations due to parasitic capacitances and process variations, a digitally trimmable architecture consisting of an 11 bit capacitor array is adopted in the analog front-end of the CMOS capacitive readout circuit. The out-of-plane microaccelerometer has the scale factor of 372 mV/g∼389 mV/g, the output nonlinearity of 0.43% FSO∼0.60% FSO, the input range of ±2 g and a bias instability of 122 μg∼229 μg. The signal-to-noise ratio and the noise equivalent resolution are measured to be 74.00 dB∼75.23 dB and 180 μg/rtHz∼190 μg/rtHz, respectively. The in-plane cross-axis sensitivities are measured to be 1.1%∼1.9% and 0.3%∼0.7% of the out-of-plane sensitivity, respectively. The results show that the optimal and robust design method for the MEMS sensing element and the highly trimmable capacity of the CMOS capacitive readout circuit are suitable to enhance the die-to-die uniformity of the packaged microsystem, without compromising the performance characteristics

Low-power front-ends for capacitive three-axis accelerometers

This thesis consists of six publications and an overview of the research topic. The overview concentrates on background information of the capacitive accelerometers and front-ends. The publications focus on two low-power front-ends that were implemented for capacitive three-axis accelerometers and their operation as a part of an interface. The switched-capacitor front-ends that were implemented are based on the charge-balancing structures, namely a self-balancing bridge and a ΔΣ front-end, which convert the capacitive acceleration information to analog and digital signals, respectively. Both structures operate mechanically in open-loop configuration and are capable of reducing the effects of the electrostatic forces and displacement-to-capacitance conversion. According to the performance comparison presented in this thesis, both interfaces, which were implemented around the front-ends, exhibit competitive performance when compared to the commercial products of the day

Photonic Sensors Based on Integrated Ring Resonators

This thesis investigates the application of integrated ring resonators to different sensing applications. The sensors proposed here rely on the principle of optical whispering gallery mode (WGM) resonance shifts of the resonators. Three distinct sensing applications are investigated to demonstrate the concept: a photonic seismometer, an evanescent field sensor, and a zero-drift Doppler velocimeter. These concepts can be helpful in developing lightweight, compact, and highly sensitive sensors. Successful implementation of these sensors could potentially address sensing requirements for both space and Earth-bound applications. The feasibility of this class of sensors is assessed for seismic, proximity, and vibrational measurements