Distributed video coding for wireless video sensor networks: a review of the state-of-the-art architectures

Distributed video coding (DVC) is a relatively new video coding architecture originated from two fundamental theorems namely, Slepian–Wolf and Wyner–Ziv. Recent research developments have made DVC attractive for applications in the emerging domain of wireless video sensor networks (WVSNs). This paper reviews the state-of-the-art DVC architectures with a focus on understanding their opportunities and gaps in addressing the operational requirements and application needs of WVSNs

Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

Dependability of Alternative Computing Paradigms for Machine Learning: hype or hope?

Today we observe amazing performance achieved by Machine Learning (ML); for specific tasks it even surpasses human capabilities. Unfortunately, nothing comes for free: the hidden cost behind ML performance stems from its high complexity in terms of operations to be computed and the involved amount of data. For this reasons, custom Artificial Intelligence hardware accelerators based on alternative computing paradigms are attracting large interest. Such dedicated devices support the energy-hungry data movement, speed of computation, and memory resources that MLs require to realize their full potential. However, when ML is deployed on safety-/mission-critical applications, dependability becomes a concern. This paper presents the state of the art of custom Artificial Intelligence hardware architectures for ML, here Spiking and Convolutional Neural Networks, and shows the best practices to evaluate their dependability

Always-On 674uW @ 4GOP/s Error Resilient Binary Neural Networks with Aggressive SRAM Voltage Scaling on a 22nm IoT End-Node

Binary Neural Networks (BNNs) have been shown to be robust to random bit-level noise, making aggressive voltage scaling attractive as a power-saving technique for both logic and SRAMs. In this work, we introduce the first fully programmable IoT end-node system-on-chip (SoC) capable of executing software-defined, hardware-accelerated BNNs at ultra-low voltage. Our SoC exploits a hybrid memory scheme where error-vulnerable SRAMs are complemented by reliable standard-cell memories to safely store critical data under aggressive voltage scaling. On a prototype in 22nm FDX technology, we demonstrate that both the logic and SRAM voltage can be dropped to 0.5Vwithout any accuracy penalty on a BNN trained for the CIFAR-10 dataset, improving energy efficiency by 2.2X w.r.t. nominal conditions. Furthermore, we show that the supply voltage can be dropped to 0.42V (50% of nominal) while keeping more than99% of the nominal accuracy (with a bit error rate ~1/1000). In this operating point, our prototype performs 4Gop/s (15.4Inference/s on the CIFAR-10 dataset) by computing up to 13binary ops per pJ, achieving 22.8 Inference/s/mW while keeping within a peak power envelope of 674uW - low enough to enable always-on operation in ultra-low power smart cameras, long-lifetime environmental sensors, and insect-sized pico-drones.Comment: Submitted to ISICAS2020 journal special issu

An efficient logic fault diagnosis framework based on effect-cause approach

Fault diagnosis plays an important role in improving the circuit design process and the manufacturing yield. With the increasing number of gates in modern circuits, determining the source of failure in a defective circuit is becoming more and more challenging. In this research, we present an efficient effect-cause diagnosis framework for combinational VLSI circuits. The framework consists of three stages to obtain an accurate and reasonably precise diagnosis. First, an improved critical path tracing algorithm is proposed to identify an initial suspect list by backtracing from faulty primary outputs toward primary inputs. Compared to the traditional critical path tracing approach, our algorithm is faster and exact. Second, a novel probabilistic ranking model is applied to rank the suspects so that the most suspicious one will be ranked at or near the top. Several fast filtering methods are used to prune unrelated suspects. Finally, to refine the diagnosis, fault simulation is performed on the top suspect nets using several common fault models. The difference between the observed faulty behavior and the simulated behavior is used to rank each suspect. Experimental results on ISCAS85 benchmark circuits show that this diagnosis approach is efficient both in terms of memory space and CPU time and the diagnosis results are accurate and reasonably precise

Development of a bridge fault extractor tool

Bridge fault extractors are tools that analyze chip layouts and produce a realistic list of bridging faults within that chip. FedEx, previously developed at Texas A&M University, extracts all two-node intralayer bridges of any given chip layout and optionally extracts all two-node interlayer bridges. The goal of this thesis was to further develop this tool. The primary goal was to speed it up so that it can handle large industrial designs in a reasonable amount of time. A second goal was to develop a graphical user interface (GUI) for this tool which aids in more effectively visualizing the bridge faults across the chip. The final aim of this thesis was to perform FedEx output analysis to understand the nature of the defects, such as variation of critical area (the area where the presence of a defect can cause a fault) as a function of layer as well as defect size

Roadmap on measurement technologies for next generation structural health monitoring systems

Structural health monitoring (SHM) is the automation of the condition assessment process of an engineered system. When applied to geometrically large components or structures, such as those found in civil and aerospace infrastructure and systems, a critical challenge is in designing the sensing solution that could yield actionable information. This is a difficult task to conduct cost-effectively, because of the large surfaces under consideration and the localized nature of typical defects and damages. There have been significant research efforts in empowering conventional measurement technologies for applications to SHM in order to improve performance of the condition assessment process. Yet, the field implementation of these SHM solutions is still in its infancy, attributable to various economic and technical challenges. The objective of this Roadmap publication is to discuss modern measurement technologies that were developed for SHM purposes, along with their associated challenges and opportunities, and to provide a path to research and development efforts that could yield impactful field applications. The Roadmap is organized into four sections: distributed embedded sensing systems, distributed surface sensing systems, multifunctional materials, and remote sensing. Recognizing that many measurement technologies may overlap between sections, we define distributed sensing solutions as those that involve or imply the utilization of numbers of sensors geometrically organized within (embedded) or over (surface) the monitored component or system. Multi-functional materials are sensing solutions that combine multiple capabilities, for example those also serving structural functions. Remote sensing are solutions that are contactless, for example cell phones, drones, and satellites. It also includes the notion of remotely controlled robots

Measurements, Models, Systems and Design

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Constraint-Aware, Scalable, and Efficient Algorithms for Multi-Chip Power Module Layout Optimization

Moving towards an electrified world requires ultra high-density power converters. Electric vehicles, electrified aerospace, data centers, etc. are just a few fields among wide application areas of power electronic systems, where high-density power converters are essential. As a critical part of these power converters, power semiconductor modules and their layout optimization has been identified as a crucial step in achieving the maximum performance and density for wide bandgap technologies (i.e., GaN and SiC). New packaging technologies are also introduced to produce reliable and efficient multichip power module (MCPM) designs to push the current limits. The complexity of the emerging MCPM layouts is surpassing the capability of a manual, iterative design process to produce an optimum design with agile development requirements. An electronic design automation tool called PowerSynth has been introduced with ongoing research toward enhanced capabilities to speed up the optimized MCPM layout design process. This dissertation presents the PowerSynth progression timeline with the methodology updates and corresponding critical results compared to v1.1. The first released version (v1.1) of PowerSynth demonstrated the benefits of layout abstraction, and reduced-order modeling techniques to perform rapid optimization of the MCPM module compared to the traditional, manual, and iterative design approach. However, that version is limited by several key factors: layout representation technique, layout generation algorithms, iterative design-rule-checking (DRC), optimization algorithm candidates, etc. To address these limitations, and enhance PowerSynth’s capabilities, constraint-aware, scalable, and efficient algorithms have been developed and implemented. PowerSynth layout engine has evolved from v1.3 to v2.0 throughout the last five years to incorporate the algorithm updates and generate all 2D/2.5D/3D Manhattan layout solutions. These fundamental changes in the layout generation methodology have also called for updates in the performance modeling techniques and enabled exploring different optimization algorithms. The latest PowerSynth 2 architecture has been implemented to enable electro-thermo-mechanical and reliability optimization on 2D/2.5D/3D MCPM layouts, and set up a path toward cabinet-level optimization. PowerSynth v2.0 computer-aided design (CAD) flow has been hardware-validated through manufacturing and testing of an optimized novel 3D MCPM layout. The flow has shown significant speedup compared to the manual design flow with a comparable optimization result