Molecular Memory with Atomically-Smooth Graphene Contacts

We report the use of bilayer graphene as an atomically-smooth contact for nanoscale devices. A two-terminal Bucky ball (C60) based molecular memory is fabricated with bilayer graphene as a contact on the polycrystalline nickel electrode. Graphene provides an atomically-smooth covering over an otherwise rough metal surface. The use of graphene additionally prohibits the electromigration of nickel atoms into the C60 layer. The devices exhibit a low-resistance state in the first sweep cycle and irreversibly switch to a high resistance state at 0.8-1.2 V bias. The reverse sweep has a hysteresis behavior as well. In the subsequent cycles, the devices retain the high-resistance state, thus making it write-once read-many memory (WORM). The ratio of current in low-resistance to high-resistance state is lying in 20-40 range for various devices with excellent retention characteristics. Control sample without the bilayer graphene shows random hysteresis and switching.Comment: 13 pages and 4 figure

A survey of carbon nanotube interconnects for energy efficient integrated circuits

This article is a review of the state-of-art carbon nanotube interconnects for Silicon application with respect to the recent literature. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) challenges with current copper interconnects, 2) process & growth of carbon nanotube interconnects compatible with back-end-of-line integration, and 3) modeling and simulation for circuit-level benchmarking and performance prediction. The focus is on the evolution of carbon nanotube interconnects from the process, theoretical modeling, and experimental characterization to on-chip interconnect applications. We provide an overview of the current advancements on carbon nanotube interconnects and also regarding the prospects for designing energy efficient integrated circuits. Each selected category is presented in an accessible manner aiming to serve as a survey and informative cornerstone on carbon nanotube interconnects relevant to students and scientists belonging to a range of fields from physics, processing to circuit design

Silicon-sheet and thin-film cell and module technology potential: Issue study

The development of high-efficiency low-cost crystalline silicon ribbon and thih-film solar cells for the energy national photovoltaics program was examined. The findings of an issue study conducted are presented. The collected data identified the status of the technology, future research needs, and problems experienced. The potentials of present research activities to meet the Federal/industry long-term technical goal of achieving 15 cents per kilowatt-hour levelized PV energy cost are assessed. Recommendations for future research needs related to crystalline silicon ribbon and thin-film technologies for flat-plate collectors are also included

MOCVD of Cr3(C,N)2 and CrSixCy Films Growth and Characterization

CrCxNy and CrSixCy thin films were deposited under low pressure by metallorganic chemical vapor deposition (MOCVD) in the temperature ranges 380-450°C and 450-500°C, respectively, using Cr(NEt2)4 and CrCH2SiMe34 as single-source precursors.The growth was achieved in a cold-wall vertical reactor using, respectively, H2 and He as the carrier gases. Both types of films exhibit a mirrorlike surface morphology and are amorphous asdeposited. The CrCxNy layers start to crystallize at 600°C after annealing for 1 h under vacuum,whereas it is necessary to reach 650°C under H2 atmosphere. In both cases, the original ternary phase Cr3(C0.8N0.2)2 crystallizes. The resistivity of as-deposited amorphous CrCxNy films is typically 600. cm, and it decreases to 150 #. cm after annealing upon the formation of polycrystalline Cr3#C,N#2 films. The CrSixCy layers have a very stable amorphous structure until 850°C for 4 h. In spite of their metallic appearance, they exhibit a high resistivity compared to the Cr3#C,N#2 films. The main characteristics of these Cr-based layers is presented and discussed

The Conference on High Temperature Electronics

The status of and directions for high temperature electronics research and development were evaluated. Major objectives were to (1) identify common user needs; (2) put into perspective the directions for future work; and (3) address the problem of bringing to practical fruition the results of these efforts. More than half of the presentations dealt with materials and devices, rather than circuits and systems. Conference session titles and an example of a paper presented in each session are (1) User requirements: High temperature electronics applications in space explorations; (2) Devices: Passive components for high temperature operation; (3) Circuits and systems: Process characteristics and design methods for a 300 degree QUAD or AMP; and (4) Packaging: Presently available energy supply for high temperature environment

Improved micro-contact resistance model that considers material deformation, electron transport and thin film characteristics

This paper reports on an improved analytic model forpredicting micro-contact resistance needed for designing microelectro-mechanical systems (MEMS) switches. The originalmodel had two primary considerations: 1) contact materialdeformation (i.e. elastic, plastic, or elastic-plastic) and 2) effectivecontact area radius. The model also assumed that individual aspotswere close together and that their interactions weredependent on each other which led to using the single effective aspotcontact area model. This single effective area model wasused to determine specific electron transport regions (i.e. ballistic,quasi-ballistic, or diffusive) by comparing the effective radius andthe mean free path of an electron. Using this model required thatmicro-switch contact materials be deposited, during devicefabrication, with processes ensuring low surface roughness values(i.e. sputtered films). Sputtered thin film electric contacts,however, do not behave like bulk materials and the effects of thinfilm contacts and spreading resistance must be considered. Theimproved micro-contact resistance model accounts for the twoprimary considerations above, as well as, using thin film,sputtered, electric contact