35 research outputs found

    Integration of optical interconnections and optoelectronic components in flexible substrates

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    Licht als informatiedrager voor datacommunicatie kende een ongezien succes in de laatste decennia. Wegens de lage verliezen en hoge datasnelheden hebben ze voor het overbruggen van lange afstanden hun elektrische tegenhangers reeds geruime tijd verdrongen. Deze trend zet zich ook voort voor korte afstand communicatie op printplaten. Naast zijn functie als informatiedrager, wordt licht ook gebruikt om een waaier aan fysische grootheden te meten. Ook hier heeft licht enkele significante voordelen t.o.v elektrische informatiedragers, waardoor optische sensoren wijdverspreid zijn. Een tweede duidelijke trend binnen de elektronica is het gebruik van flexibele printkaarten. Deze zijn veel dunner, lichter en betrouwbaarder dan de klassieke harde printkaarten, waardoor ze uiterst geschikt zijn voor draagbare toepassingen waar compactheid en een laag gewicht hoge vereisten zijn. De flexibiliteit van de printplaten laat ook toe hen te gebruiken op onvlakke oppervlakken en op bewegende onderdelen. Het doel van het gepresenteerde doctoraatswerk is de ontwikkeling van een nieuw technologieplatform dat bovengenoemde trends combineert. Alle bouwblokken van optische communicatie, gaande van actieve opto-elektronische componenten, aanstuurelektronica, golfgeleiderbaantjes en galvanische verbindingen tot optische koppelstructuren tussen de verschillende bouwblokken, worden zodanig gerealiseerd dat elke component flexibel is en geïntegreerd wordt in een dunne folie met een dikte van slechts 150µm. Op die manier bekomen we een flexibele folie met alle passieve en actieve onderdelen voor optische communicatie geïntegreerd met enkel een elektrische interface naar de buitenwereld, wat de aanvaarding en toepassing van deze technologie in de huidige elektronica aanzienlijk kan versnellen. Binnen het doctoraatswerk werden alle voorgestelde technologieën en processen gerealiseerd en geoptimaliseerd. Bovendien werden de optische verliezen, warmteaspecten, hoogfrequent gedrag, mechanisch gedrag en betrouwbaarheid van de technologie gekarakteriseerd en vergeleken met de huidige state-of-the-art

    Technical Design Report for the PANDA Micro Vertex Detector

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    This document illustrates the technical layout and the expected performance of the Micro Vertex Detector (MVD) of the PANDA experiment. The MVD will detect charged particles as close as possible to the interaction zone. Design criteria and the optimisation process as well as the technical solutions chosen are discussed and the results of this process are subjected to extensive Monte Carlo physics studies. The route towards realisation of the detector is outlined

    Technical Design Report for the: PANDA Micro Vertex Detector

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    This document illustrates the technical layout and the expected performance of the Micro Vertex Detector (MVD) of the PANDA experiment. The MVD will detect charged particles as close as possible to the interaction zone. Design criteria and the optimisation process as well as the technical solutions chosen are discussed and the results of this process are subjected to extensive Monte Carlo physics studies. The route towards realisation of the detector is outlined.Comment: 189 pages, 225 figures, 41 table

    Design of programmable matter

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    Thesis (S.M.)--Massachusetts Institute of Technology, School of Architecture and Planning, Program in Media Arts and Sciences, 2008.This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.Includes bibliographical references (leaves 115-119).Programmable matter is a proposed digital material having computation, sensing, actuation, and display as continuous properties active over its whole extent. Programmable matter would have many exciting applications, like paintable displays, shape-changing robots and tools, rapid prototyping, and sculpture-based haptic interfaces. Programmable matter would be composed of millimeter-scale autonomous microsystem particles, without internal moving parts, bound by electromagnetic forces or an adhesive binder. Particles can dissipate 10 mW heat, and store 6 J energy in an internal zinc-air battery. Photovoltaic cells provide 300 [mu]W outdoors and 3.0 [mu]W indoors. Painted systems can store battery reactants in the paint binder; 6 J / mm3 can be stored, and diffusion is fast enough to transport reactants to the particles. Capacitive power transfer is an efficient method to transfer power to sparse, randomly placed particles. Power from capacitive transfer is proportional to VDD 2: 100[mu]W at 3.3V and 12 mW at 35V. Inter-particle communication is possible via optical, near-field, and far-field electromagnetic systems. Optical systems allow communication with low area (sub-mm) particles, and 24 pJ/bit. Near-field electromagnetic gives precisely controlled neighborhoods, localization capability, and 37 pJ/bit. Far-field radio communication between widely spaced particles may be possible at 60 GHz; antennas that fit inside 1 mm3 exist; complete transceivers do not. A 32-bit CPU uses less than 0.26 mm2 die area, 256K x 8 SRAM uses 1.1 mm2, and 256K x 8 FLASH uses 0.32 mm2. Direct-drive electric and magnetic field systems allow actuation without moving parts inside the particles. Magnetic surface-drive motors designed for operation without bearings are not power-efficient, and parasitic interactions between permanent magnets may limit their usefulness at millimeter particle dimensions. Electrostatic surface-drive motors are power-efficient, but practical only at particle dimensions below a few millimeters. We constructed a prototype paintable display; a distributed PostScript rendering system with 1000 randomly-placed 3.4 cm nodes, each with a CPU, IR communications, and LED. The system is used to render the letter "A." We present a design, not yet constructed, for a literal paintable display, with 1.0 mm rendering particles, each with a microprocessor and memory, and 110 [mu]m display particles, with tri-color LED's and simpler circuitry. Storage of zinc-air battery reactants in the paint binder would provide an 8 hour battery life, and capacitive power distribution would allow continuous operation. We constructed a prototype sliding-cube modular robot, with 3.4 cm nodes. The system uses magnetic surface-drive actuation. We demonstrate horizontal lattice-unit translation. We describe a design, not yet constructed, for a sliding-cube modular robot with 2 mm nodes. The cubes use standard-process CMOS IC's, inserted into a cubic space frame and wire-bonded together. Arrays of passivated electrodes, 1 [mu]m from the surface of the cubes, are used for electrostatic surface-drive actuation, zero-power latching, power transfer, localization, and communication. The design allows actuation from any contacting position. Energy is stored in a standard SMT capacitor inside each node, which is recharged by power transfer through chains of contacting nodes.by Ara N. Knaian.S.M

    Isotropically conductive adhesive filled with silver metalised polymer spheres

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    Isotropic conductive adhesives (ICAs) have a growing range of applications in electronics packaging and have recently emerged as an important material in photo-voltaic module interconnections, particularly for thin-film and other non-silicon technologies where soldering processes are often unsuitable due to the nature of the metallisation or the limited maximum temperature the assembly can be exposed to. ICAs typically comprise of a high volume fraction of solid metallic flakes, usually silver, in an adhesive matrix because of its highly conductive oxide however, this thesis will focus on adhesives containing a large volume fraction of silver coated/metalised mono-sized polymer spheres (Ag-MPS). Incorporating silver coated mono-sized polymer spheres is anticipated to deliver specific advantages such as a significant reduction in the required silver content, improvement of the overall mechanical properties and flexibility to tune the properties of the filler according to the application compared with conventional flake filled adhesives. In this research advancements in the understanding of Ag-MPS filled ICAs, both through theory and experiments, have been made. Analytical models to predict an individual Ag-MPS resistance and Ag-MPS filled ICA resistance have been developed. The experiments based on the flat punch nanoindentation technique have been conducted to determine individual Ag-MPS resistances. The theoretical and experimental studies establish Ag-MPS diameter, coating resistivity, coating thickness, contact radius, and contact geometry as the main contributors towards the resistance of an Ag-MPS filled ICAs. These studies showed that Ag-MPS resistance decreases with increasing coating thickness and contact radius but increases with increasing coating resistivity. The experiments have also been conducted to investigate the effect of Ag-MPS volume fraction, diameter, coating thickness, curing conditions and shrinkage (affecting contact radius) on ICA conductivity and comparisons are made with flake filled and commercial ICAs. The results showed that ICA conductivity increases with increasing volume fraction and coating thickness but decreases with diameter. More importantly the results showed that conductivities similar to those of flake filled ICAs, including those commercially available, can be obtained using 70% less silver. The results show that, Ag content can be reduced further to just 7% with use of larger 30μm Ag-MPS but with a lower resulting conductivity. Thus for applications where very high conductivity is not required larger Ag-MPS may offer even greater potential cost benefits, which is something flake filled ICAs cannot offer. This is a significant achievement which can allow tuning of ICA formulations according to the demands of the application, which is not possible with the use of silver flakes as there is only a limited range of silver flake volume fractions that will yield useful levels of conductivity

    NASA Tech Briefs, June 1994

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    Topics covered include: Microelectronics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Report

    NASA Tech Briefs, January/February 1986

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    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences

    NASA Tech Briefs, Fall 1985

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    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences

    NASA Tech Briefs, November 1994

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    Topics: Advanced Manufacturing; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

    Cumulative index to NASA Tech Briefs, 1986-1990, volumes 10-14

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    Tech Briefs are short announcements of new technology derived from the R&D activities of the National Aeronautics and Space Administration. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This cumulative index of Tech Briefs contains abstracts and four indexes (subject, personal author, originating center, and Tech Brief number) and covers the period 1986 to 1990. The abstract section is organized by the following subject categories: electronic components and circuits, electronic systems, physical sciences, materials, computer programs, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences
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