A Reuse-based framework for the design of analog and mixed-signal ICs

Despite the spectacular breakthroughs of the semiconductor industry, the ability to design integrated circuits (ICs) under stringent time-to-market (TTM) requirements is lagging behind integration capacity, so far keeping pace with still valid Moore's Law. The resulting gap is threatening with slowing down such a phenomenal growth. The design community believes that it is only by means of powerful CAD tools and design methodologies -and, possibly, a design paradigm shift-that this design gap can be bridged. In this sense, reuse-based design is seen as a promising solution, and concepts such as IP Block, Virtual Component, and Design Reuse have become commonplace thanks to the significant advances in the digital arena. Unfortunately, the very nature of analog and mixed-signal (AMS) design has hindered a similar level of consensus and development. This paper presents a framework for the reuse-based design of AMS circuits. The framework is founded on three key elements: (1) a CAD-supported hierarchical design flow that facilitates the incorporation of AMS reusable blocks, reduces the overall design time, and expedites the management of increasing AMS design complexity; (2) a complete, clear definition of the AMS reusable block, structured into three separate facets or views: the behavioral, structural, and layout facets, the two first for top-down electrical synthesis and bottom-up verification, the latter used during bottom-up physical synthesis; (3) the design for reusability set of tools, methods, and guidelines that, relying on intensive parameterization as well as on design knowledge capture and encapsulation, allows to produce fully reusable AMS blocks. A case study and a functional silicon prototype demonstrate the validity of the paper's proposals.Ministerio de Educación y Ciencia TEC2004-0175

Diseño de circuitos analógicos y de señal mixta con consideraciones de diseño físico y variabilidad

Advances in microelectronic technology has been based on an increasing capacity to integrate transistors, moving this industry to the nanoelectronics realm in recent years. Moore’s Law [1] has predicted (and somehow governed) the growth of the capacity to integrate transistors in a single IC. Nevertheless, while this capacity has grown steadily, the increasing number of design tasks that are involved in the creation of the integrated circuit and their complexity has led to a phenomenon known as the ``design gap´´. This is the difference between what can theoretically be integrated and what can practically be designed. Since the early 2000s, the International Technology Roadmap of Semiconductors (ITRS) reports, published by the Semiconductor Industry Association (SIA), alert about the necessity to limit the growth of the design cost by increasing the productivity of the designer to continue the semiconductor industry’s growth. Design automation arises as a key element to close this ”design gap”. In this sense, electronic design automation (EDA) tools have reached a level of maturity for digital circuits that is far behind the EDA tools that are made for analog circuit design automation. While digital circuits rely, in general, on two stable operation states (which brings inherent robustness against numerous imperfections and interferences, leading to few design constraints like area, speed or power consumption), analog signal processing, on the other hand, demands compliance with lots of constraints (e.g., matching, noise, robustness, ...). The triumph of digital CMOS circuits, thanks to their mentioned robustness, has, ultimately, facilitated the way that circuits can be processed by algorithms, abstraction levels and description languages, as well as how the design information traverse the hierarchical levels of a digital system. The field of analog design automation faces many more difficulties due to the many sources of perturbation, such as the well-know process variability, and the difficulty in treating these systematically, like digital tools can do. In this Thesis, different design flows are proposed, focusing on new design methodologies for analog circuits, thus, trying to close the ”gap” between digital and analog EDA tools. In this chapter, the most important sources for perturbations and their impact on the analog design process are discussed in Section 1.2. The traditional analog design flow is discussed in 1.3. Emerging design methodologies that try to reduce the ”design gap” are presented in Section 1.4 where the key concept of Pareto-Optimal Front (POF) is explained. This concept, brought from the field of economics, models the analog circuit performances into a set of solutions that show the optimal trade-offs among conflicting circuit performances (e.g. DC-gain and unity-gain frequency). Finally, the goals of this thesis are presented in Section 1.5

Aging-Aware Design Methods for Reliable Analog Integrated Circuits using Operating Point-Dependent Degradation

The focus of this thesis is on the development and implementation of aging-aware design methods, which are suitable to satisfy current needs of analog circuit design. Based on the well known \gm/\ID sizing methodology, an innovative tool-assisted aging-aware design approach is proposed, which is able to estimate shifts in circuit characteristics using mostly hand calculation schemes. The developed concept of an operating point-dependent degradation leads to the definition of an aging-aware sensitivity, which is compared to currently available degradation simulation flows and proves to be efficient in the estimation of circuit degradation. Using the aging-aware sensitivity, several analog circuits are investigated and optimized towards higher reliability. Finally, results are presented for numerous target specifications

Analog layout design automation: ILP-based analog routers

The shrinking design window and high parasitic sensitivity in the advanced technology have imposed special challenges on the analog and radio frequency (RF) integrated circuit design. In this thesis, we propose a new methodology to address such a deficiency based on integer linear programming (ILP) but without compromising the capability of handling any special constraints for the analog routing problems. Distinct from the conventional methods, our algorithm utilizes adaptive resolutions for various routing regions. For a more congested region, a routing grid with higher resolution is employed, whereas a lower-resolution grid is adopted to a less crowded routing region. Moreover, we strengthen its speciality in handling interconnect width control so as to route the electrical nets based on analog constraints while considering proper interconnect width to address the acute interconnect parasitics, mismatch minimization, and electromigration effects simultaneously. In addition, to tackle the performance degradation due to layout dependent effects (LDEs) and take advantage of optical proximity correction (OPC) for resolution enhancement of subwavelength lithography, in this thesis we have also proposed an innovative LDE-aware analog layout migration scheme, which is equipped with our special routing methodology. The LDE constraints are first identified with aid of a special sensitivity analysis and then satisfied during the layout migration process. Afterwards the electrical nets are routed by an extended OPC-inclusive ILP-based analog router to improve the final layout image fidelity while the routability and analog constraints are respected in the meantime. The experimental results demonstrate the effectiveness and efficiency of our proposed methods in terms of both circuit performance and image quality compared to the previous works

Design and optimization of cost-effective coldproof portable enclosures for polar environment

Based on the International Electrotechnical Commission standards, the electronic devices in the industrial class (e.g., integrated circuits or batteries) can only operate at the ambient temperature between -40°C and 85°C. For the human-involved regions in Alaska, Northern Canada, and Antarctica, extreme cold condition as low as -55°C might affect sensing electronic devices utilized in the scientific or industrial applications. In this paper, we propose a design and optimization methodology for the self-heating portable enclosures, which can warm up the inner space from -55°C for encasing the low-cost industrial-class electronic devices instead of expensive military-class ones to work reliably within their allowed operating temperature limit. Among the other options, ceramic thermal resistors are selected as the heating elements inside the enclosure. The placement of the thermal resistors is studied with the aid of thermal modelling for the single heating device by using the curve fitting technique to achieve uniform temperature distribution within the enclosure. To maintain the inner temperature above -40°C but with the least power consumption from the thermal resistors, we have developed a control system based on the fuzzy logic controller. For validation, we have utilized COMSOL Multiphysics software and then one prototyped enclosure along with the fuzzy control system. Our experimental measurement exhibits its efficacy compared to the other design options

A novel deep submicron bulk planar sizing strategy for low energy subthreshold standard cell libraries

Engineering andPhysical Science ResearchCouncil (EPSRC) and Arm Ltd for providing funding in the form of grants and studentshipsThis work investigates bulk planar deep submicron semiconductor physics in an attempt to improve standard cell libraries aimed at operation in the subthreshold regime and in Ultra Wide Dynamic Voltage Scaling schemes. The current state of research in the field is examined, with particular emphasis on how subthreshold physical effects degrade robustness, variability and performance. How prevalent these physical effects are in a commercial 65nm library is then investigated by extensive modeling of a BSIM4.5 compact model. Three distinct sizing strategies emerge, cells of each strategy are laid out and post-layout parasitically extracted models simulated to determine the advantages/disadvantages of each. Full custom ring oscillators are designed and manufactured. Measured results reveal a close correlation with the simulated results, with frequency improvements of up to 2.75X/2.43X obs erved for RVT/LVT devices respectively. The experiment provides the first silicon evidence of the improvement capability of the Inverse Narrow Width Effect over a wide supply voltage range, as well as a mechanism of additional temperature stability in the subthreshold regime. A novel sizing strategy is proposed and pursued to determine whether it is able to produce a superior complex circuit design using a commercial digital synthesis flow. Two 128 bit AES cores are synthesized from the novel sizing strategy and compared against a third AES core synthesized from a state-of-the-art subthreshold standard cell library used by ARM. Results show improvements in energy-per-cycle of up to 27.3% and frequency improvements of up to 10.25X. The novel subthreshold sizing strategy proves superior over a temperature range of 0 °C to 85 °C with a nominal (20 °C) improvement in energy-per-cycle of 24% and frequency improvement of 8.65X. A comparison to prior art is then performed. Valid cases are presented where the proposed sizing strategy would be a candidate to produce superior subthreshold circuits

Circuit Design

Circuit Design = Science + Art! Designers need a skilled "gut feeling" about circuits and related analytical techniques, plus creativity, to solve all problems and to adhere to the specifications, the written and the unwritten ones. You must anticipate a large number of influences, like temperature effects, supply voltages changes, offset voltages, layout parasitics, and numerous kinds of technology variations to end up with a circuit that works. This is challenging for analog, custom-digital, mixed-signal or RF circuits, and often researching new design methods in relevant journals, conference proceedings and design tools unfortunately gives the impression that just a "wild bunch" of "advanced techniques" exist. On the other hand, state-of-the-art tools nowadays indeed offer a good cockpit to steer the design flow, which include clever statistical methods and optimization techniques.Actually, this almost presents a second breakthrough, like the introduction of circuit simulators 40 years ago! Users can now conveniently analyse all the problems (discover, quantify, verify), and even exploit them, for example for optimization purposes. Most designers are caught up on everyday problems, so we fit that "wild bunch" into a systematic approach for variation-aware design, a designer's field guide and more. That is where this book can help! Circuit Design: Anticipate, Analyze, Exploit Variations starts with best-practise manual methods and links them tightly to up-to-date automation algorithms. We provide many tractable examples and explain key techniques you have to know. We then enable you to select and setup suitable methods for each design task - knowing their prerequisites, advantages and, as too often overlooked, their limitations as well. The good thing with computers is that you yourself can often verify amazing things with little effort, and you can use software not only to your direct advantage in solving a specific problem, but also for becoming a better skilled, more experienced engineer. Unfortunately, EDA design environments are not good at all to learn about advanced numerics. So with this book we also provide two apps for learning about statistic and optimization directly with circuit-related examples, and in real-time so without the long simulation times. This helps to develop a healthy statistical gut feeling for circuit design. The book is written for engineers, students in engineering and CAD / methodology experts. Readers should have some background in standard design techniques like entering a design in a schematic capture and simulating it, and also know about major technology aspects

Adaptive Integrated Circuit Design for Variation Resilience and Security

The past few decades witness the burgeoning development of integrated circuit in terms of process technology scaling. Along with the tremendous benefits coming from the scaling, challenges are also presented in various stages. During the design time, the complexity of developing a circuit with millions to billions of smaller size transistors is extended after the variations are taken into account. The difficulty of analyzing these nondeterministic properties makes the allocation scheme of redundant resource hardly work in a cost-efficient way. Besides fabrication variations, analog circuits are suffered from severe performance degradations owing to their physical attributes which are vulnerable to aging effects. As such, the post-silicon calibration approach gains increasing attentions to compensate the performance mismatch. For the user-end applications, additional system failures result from the pirated and counterfeited devices provided by the untrusted semiconductor supply chain. Again analog circuits show their weakness to this threat due to the shortage of piracy avoidance techniques. In this dissertation, we propose three adaptive integrated circuit designs to overcome these challenges respectively. The first one investigates the variability-aware gate implementation with the consideration of the overhead control of adaptivity assignment. This design improves the variation resilience typically for digital circuits while optimizing the power consumption and timing yield. The second design is implemented as a self-validation system for the calibration of diverse analog circuits. The system is completely integrated on chip to enhance the convenience without external assistance. In the last design, a classic analog component is further studied to establish the configurable locking mechanism for analog circuits. The use of Satisfiability Modulo Theories addresses the difficulty of searching the unique unlocking pattern of non-Boolean variables

Fiabilisation de Convertisseurs Analogique-Num´erique a Modulation Sigma-Delta

Due to the continuously scaling down of CMOS technology, system-on-chips (SoCs) reliability becomes important in sub-90 nm CMOS node. Integrated circuits and systems applied to aerospace, avionic, vehicle transport and biomedicine are highly sensitive to reliability problems such as ageing mechanisms and parametric process variations. Novel SoCs with new materials and architectures of high complexity further aggravate reliability as a critical aspect of process integration. For instance, random and systematic defects as well as parametric process variations have a large influence on quality and yield of the manufactured ICs, right after production. During ICs usage time, time-dependent ageing mechanisms such as negative bias temperature instability (NBTI) and hot carrier injection (HCI) can significantly degrade ICs performance.La fiabilit´e des ICs est d´efinie ainsi : la capacit´e d’un circuit ou un syst`eme int´egr´e `amaintenir ses param`etres durant une p´eriode donn´ee sous des conditions d´efinies. Les rapportsITRS 2011 consid`ere la fiabilit´e comme un aspect critique du processus d’int´egration.Par cons´equent, il faut faire appel des m´ethodologies innovatrices prenant en comptela fiabilit´e afin d’assurer la fonctionnalit´e du SoCs et la fiabilit´e dans les technologiesCMOS `a l’´echelle nanom´etrique. Cela nous permettra de d´evelopper des m´ethodologiesind´ependantes du design et de la technologie CMOS, en revanche, sp´ecialis´ees en fiabilit´e