Multichannel 25 Gb/s low-power driver and transimpedance amplifier integrated circuits for 100 Gb/s optical links

Highly integrated electronic driver and receiver ICs with low-power consumption are essential for the development of cost-effective multichannel fiber-optic transceivers with small form factor. This paper presents the latest results of a two-channel 28 Gb/s driver array for optical duobinary modulation and a four-channel 25 Gb/s TIA array suited for both NRZ and optical duobinary detection. This paper demonstrated that 28 Gb/s duobinary signals can be efficiently generated on chip with a delay-and-add digital filter and that the driver power consumption can be significantly reduced by optimizing the drive impedance well above 50 Omega, without degrading the signal quality. To the best of our knowledge, this is the fastest modulator driver with on-chip duobinary encoding and precoding, consuming only 652 mW per channel at a differential output swing of 6 Vpp. The 4 x 25 Gb/s TIA shows a good sensitivity of - 10.3 dBm average optical input power at 25 Gb/s for PRBS 2(31) -1 and low power consumption of 77 mW per channel. Both ICs were developed in a 130 nm SiGe BiCMOS process

Broadband Receiver Electronic Circuits for Fiber-Optical Communication Systems

The exponential growth of internet traffic drives datacenters to constantly improve their capacity. As the copper based network infrastructure is being replaced by fiber-optical interconnects, new industrial standards for higher datarates are required. Several research and industrial organizations are aiming towards 400 Gb Ethernet and beyond, which brings new challenges to the field of high-speed broadband electronic circuit design. Replacing OOK with higher M-ary modulation formats and using higher datarates increases network capacity but at the cost of power. With datacenters rapidly becoming significant energy consumers on the global scale, the energy efficiency of the optical interconnect transceivers takes a primary role in the development of novel systems. There are several additional challenges unique in the design of a broadband shortreach fiber-optical receiver system. The sensitivity of the receiver depends on the noise performance of the PD and the electronics. The overall system noise must be optimized for the specific application, modulation scheme, PD and VCSEL characteristics. The topology of the transimpedance amplifier affects the noise and frequency response of the PD, so the system must be optimized as a whole. Most state-of-the-art receivers are built on high-end semiconductor SiGe and InP technologies. However, there are still several design decisions to be made in order to get low noise, high energy efficiency and adequate bandwidth. In order to overcome the frequency limitations of the optoelectronic components, bandwidth enhancement and channel equalization techniques are used. In this work several different blocks of a receiver system are designed and characterized. A broadband, 50 GHz bandwidth CB-based TIA and a tunable gain equalizer are designed in a 130 nm SiGe BiCMOS process. An ultra-broadband traveling wave amplifier is presented, based on a 250 nm InP DHBT technology demonstrating a 207 GHz bandwidth. Two TIA front-end topologies with 133 GHz bandwidth, a CB and a CE with shunt-shunt feedback, based on a 130 nm InP DHBT technology are designed and compared

Highly digital power efficient techniques for serial links

Low power, high speed serial transceivers are employed in a wide range of applications ranging from chip-to-chip, backplane, and optical interconnects. Apart from being capable of handling a wide range of data rates, the transceivers should have low power consumption (mW/Gbps) and be fully integrated. This work discusses enabling techniques to implement such transceivers. Specifically, three designs: (1) a 0.5-4 Gbps serial link which uses current recycling to reduce power dissipation and (2) a 0.5-2.5 Gbps reference-less clock and data recovery circuit which uses a novel frequency detector to achieve unlimited acquisition range and (3) a 2-4 Gbps low power receiver architecture capable of resolving multiple signalling formats with a simplified XOR based phase rotating PLL will be presented. All the three circuit topologies are highly digital and aim to address the requirements of wide operating range, low power dissipation while being fully integrated. Measured results obtained from the prototypes illustrate the effectiveness of the proposed design techniques

High-speed low-power modulator driver arrays for medium-reach optical networks

The internet is becoming the ubiquitous tool that is changing the lives of so many citizens across the world. Commerce, government, industry, healthcare and social interactions are all increasingly using internet applications to improve and facilitate communications. This is especially true for videoenabled applications, which currently demand much higher data rates and quality from data networks. High definition TV streaming services are emerging and these again will significantly push the demand for widely deployed, high-bandwidth services. The current access passive optical networks (PONs) use a single wavelength for downstream transmission and a separate one for upstream transmission. Incorporating wavelength-division multiplexing (WDM) in a PON allows for much higher bandwidths in both directions. While WDM technologies have been successfully deployed for many years in metro and core networks, in access networks they are not commonly used yet. This is mainly due to the high costs associated with deploying entire WDM access networks. However, the present optical networks cannot be simply and cost-effectively scaled to provide the capacity for tomorrow’s users. As an effect there is a strong need for new WDM access components which are compact, cost-competitive and mass-manufacturable. Increasing the number of wavelengths for WDM-PON automatically leads to an increase in the number of single pluggable transceivers, which brings substantial design challenges and additional costs. The multitude of TXs and RXs for different wavelength channels increases the total footprint considerably. Photonic integration of transceivers into arrays will significantly reduce the footprint and cost. However, the total power consumption of an array device is an issue. To avoid the use of a thermoelectric cooler, the integration density of components is severely limited by the heat dissipating capabilities offered by their package. As a result the WDM-PON philosophy necessitates the reduction of the transceiver’s power dissipation. From this plea it is apparent that the main technology challenges for realizing future-proof optical (access) networks are reducing active component power consumption, shrinking form factors and lowering assembly costs. In this perspective an over 100 Gb/s throughput component, composed of 10 channels at 11.3 Gb/s per wavelength channel would be a great contribution to the expansion of customer bandwidth. It can provide increased line rates to the end users at speeds of 10 Gb/s per wavelength. As RXs typically consume much less power than externally modulated TXs, they can relatively easily be integrated into an array. Mainly high speed optical transmitters have significant power consumptions and the heat generation caused by power dissipation forms a critical obstacle in the development of a 10-channel transmitter, which again underlines the importance of power reduction. Alongside the introduction of WDM in access networks, also inter-office point-to-point connections in data center environments could benefit from the WDM philosophy. As data center operators often suffer from fiber scarcity or do not own their fiber infrastructure, WDM technologies are essential to deliver reach and capacity extension for these scenarios. Interdata center communication also benefits from cost-, footprint- and energyefficient components operating at high speed to maximize the throughput. As an effect integrated over 100 Gb/s transceivers, such as 4 channels at 28 Gb/s, are highly desirable. The research described in this dissertation was partly funded by the European FP7 ICT project C3PO (Colourless and Coolerless Components for low Power Optical Networks) and the UGent special research fund. The C3PO project aimed to develop a new generation of green Si-photonic compatible components with record low power consumption, that can enable bandwidth growth and constrain the total cost. C3PO envisioned building high-capacity access networks employing reflective photonic components. To achieve this, cost-competitive reflective transmitters based on electroabsorption modulators (EAM) needed to be closely integrated into arrays. A multi-wavelength optical source provides the required wavelength channels for both downstream and upstream signals in the WDM-PON. Chapter 1 gives a short overview of a PON and describes the main implementations of a WDM-PON access network. It introduces integrated low power transmitter arrays for a cost-effective architecture of WDM-PONs and inter-data center communication. Chapter 2 compares different optical transmitters and gives a short overview of their most important characteristics. External modulation through both Mach-Zehnder modulators (MZMs) and EAMs is described. It shows that EAMs are the best choice for low power transmitter array integration, thanks to their lower drive voltage and smaller form factor, compared to MZMs. To achieve a reduced consumption, the electronic modulator driver topology is studied in chapter 3. The challenge in designing modulator drivers is the need to deliver very large currents in combination with high voltage swings. Four distinct output configurations are compared and techniques to reduce the power consumption of the drivers are described. Chapter 5 presents duobinary (DB), a modulation scheme that is gaining interest in today’s optical transmission. As the required bandwidth is about half that of NRZ, it softens the constraints on the transmitter bandwidth. Thanks to its narrow optical spectrum, it has an improved tolerance to dispersion in long haul single mode links and it can improve the spectral efficiency in WDM architectures. For optical DB a precoder is necessary to assure the received signal is equal to the original binary signal. The conducted research that resulted in this dissertation produced 2 low power EAM driver arrays: A 10-channel 113 Gb/s modulator driver array with state-of-the art ultra-low power consumption. A 2-channel 56 Gb/s duobinary driver array with a differential output with low power consumption. Both designs are elaborately analyzed in chapter 4 and 6 respectively. To the best of our knowledge the 10-channel EAM driver array is the first in its kind, while achieving the lowest power consumption for an EAM driver so far reported, 50% below the state of the art in power consumption. The 2-channel EAM driver array is the fastest modulator driver including on-chip duobinary encoding and precoding reported so far. The final chapter provides an overview of the foremost conclusions from the presented research. It is concluded with suggestions for further research

Wideband integrated circuits for optical communication systems

The exponential growth of internet traffic drives datacenters to constantly improvetheir capacity. Several research and industrial organizations are aiming towardsTbps Ethernet and beyond, which brings new challenges to the field of high-speedbroadband electronic circuit design. With datacenters rapidly becoming significantenergy consumers on the global scale, the energy efficiency of the optical interconnecttransceivers takes a primary role in the development of novel systems. Furthermore,wideband optical links are finding application inside very high throughput satellite(V/HTS) payloads used in the ever-expanding cloud of telecommunication satellites,enabled by the maturity of the existing fiber based optical links and the hightechnology readiness level of radiation hardened integrated circuit processes. Thereare several additional challenges unique in the design of a wideband optical system.The overall system noise must be optimized for the specific application, modulationscheme, PD and laser characteristics. Most state-of-the-art wideband circuits are builton high-end semiconductor SiGe and InP technologies. However, each technologydemands specific design decisions to be made in order to get low noise, high energyefficiency and adequate bandwidth. In order to overcome the frequency limitationsof the optoelectronic components, bandwidth enhancement and channel equalizationtechniques are used. In this work various blocks of optical communication systems aredesigned attempting to tackle some of the aforementioned challenges. Two TIA front-end topologies with 133 GHz bandwidth, a CB and a CE with shunt-shunt feedback,are designed and measured, utilizing a state-of-the-art 130 nm InP DHBT technology.A modular equalizer block built in 130 nm SiGe HBT technology is presented. Threeultra-wideband traveling wave amplifiers, a 4-cell, a single cell and a matrix single-stage, are designed in a 250 nm InP DHBT process to test the limits of distributedamplification. A differential VCSEL driver circuit is designed and integrated in a4x 28 Gbps transceiver system for intra-satellite optical communications based in arad-hard 130nm SiGe process

Research and design of high-speed advanced analogue front-ends for fibre-optic transmission systems

In the last decade, we have witnessed the emergence of large, warehouse-scale data centres which have enabled new internet-based software applications such as cloud computing, search engines, social media, e-government etc. Such data centres consist of large collections of servers interconnected using short-reach (reach up to a few hundred meters) optical interconnect. Today, transceivers for these applications achieve up to 100Gb/s by multiplexing 10x 10Gb/s or 4x 25Gb/s channels. In the near future however, data centre operators have expressed a need for optical links which can support 400Gb/s up to 1Tb/s. The crucial challenge is to achieve this in the same footprint (same transceiver module) and with similar power consumption as today’s technology. Straightforward scaling of the currently used space or wavelength division multiplexing may be difficult to achieve: indeed a 1Tb/s transceiver would require integration of 40 VCSELs (vertical cavity surface emitting laser diode, widely used for short‐reach optical interconnect), 40 photodiodes and the electronics operating at 25Gb/s in the same module as today’s 100Gb/s transceiver. Pushing the bit rate on such links beyond today’s commercially available 100Gb/s/fibre will require new generations of VCSELs and their driver and receiver electronics. This work looks into a number of state‐of-the-art technologies and investigates their performance restraints and recommends different set of designs, specifically targeting multilevel modulation formats. Several methods to extend the bandwidth using deep submicron (65nm and 28nm) CMOS technology are explored in this work, while also maintaining a focus upon reducing power consumption and chip area. The techniques used were pre-emphasis in rising and falling edges of the signal and bandwidth extensions by inductive peaking and different local feedback techniques. These techniques have been applied to a transmitter and receiver developed for advanced modulation formats such as PAM-4 (4 level pulse amplitude modulation). Such modulation format can increase the throughput per individual channel, which helps to overcome the challenges mentioned above to realize 400Gb/s to 1Tb/s transceivers

저전력, 저면적 유선 송수신기 설계를 위한 회로 기술

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2016. 8. 정덕균.In this thesis, novel circuit techniques for low-power and area-efficient wireline transceiver, including a phase-locked loop (PLL) based on a two-stage ring oscillator, a scalable voltage-mode transmitter, and a forwarded-clock (FC) receiver based on a delay-locked-loop (DLL) based per-pin deskew, are proposed. At first, a two-stage ring PLL that provides a four-phase, high-speed clock for a quarter-rate TX in order to minimize power consumption is presented. Several analyses and verification techniques, ranging from the clocking architectures for a high-speed TX to oscillation failures in a two-stage ring oscillator, are addressed in this thesis. A tri-state-inverter–based frequency-divider and an AC-coupled clock-buffer are used for high-speed operations with minimal power and area overheads. The proposed PLL fabricated in the 65-nm CMOS technology occupies an active area of 0.009 mm2 with an integrated-RMS-jitter of 414 fs from 10 kHz to 100 MHz while consuming 7.6 mW from a 1.2-V supply at 10 GHz. The resulting figure-of-merit is -238.8 dB, which surpasses that of the state-of-the-art ring-PLLs by 4 dB. Secondly, a voltage-mode (VM) transmitter which offers a wide operation range of 6 to 32 Gb/s, controllable pre-emphasis equalization and output voltage swing without altering output impedance, and a power supply scalability is presented. A quarter-rate clocking architecture is employed in order to maximize the scalability and energy efficiency across the variety of operating conditions. A P-over-N VM driver is used for CMOS compatibility and wide voltage-swing range required for various I/O standards. Two supply regulators calibrate the output impedance of the VM driver across the wide swing and pre-emphasis range. A single phase-locked loop is used to provide a wide frequency range of 1.5-to-8 GHz. The prototype chip is fabricated in 65-nm CMOS technology and occupies active area of 0.48x0.36 mm2. The proposed transmitter achieves 250-to-600-mV single-ended swing and exhibits the energy efficiency of 2.10-to-2.93 pJ/bit across the data rate of 6-to-32 Gb/s. And last, this thesis describes a power and area-efficient FC receiver and includes an analysis of the jitter tolerance of the FC receiver. In the proposed design, jitter tolerance is maximized according to the analysis by employing a DLL-based de-skewing. A sample-swapping bang-bang phase-detector (SS-BBPD) eliminates the stuck locking caused by the finite delay range of the voltage-controlled delay line (VCDL), and also reduces the required delay range of the VCDL by half. The proposed FC receiver is fabricated in 65-nm CMOS technology and occupies an active area of 0.025 mm2. At a data rate of 12.5 Gb/s, the proposed FC receiver exhibits an energy efficiency of 0.36 pJ/bit, and tolerates 1.4-UIpp sinusoidal jitter of 300 MHz.Chapter 1. Introduction 1 1.1. Motivation 1 1.2. Thesis organization 5 Chapter 2. Phase-Locked Loop Based on Two-Stage Ring Oscillator 7 2.1. Overivew 7 2.2. Background and Analysis of a Two-stage Ring Oscillator 11 2.3. Circuit Implementation of The Proposed PLL 25 2.4. Measurement Results 33 Chapter 3. A Scalable Voltage-Mode Transmitter 37 3.1. Overview 37 3.2. Design Considerations on a Scalable Serial Link Transmitter 40 3.3. Circuit Implementation 46 3.4. Measurement Results 56 Chapter 4. Delay-Locked Loop Based Forwarded-Clock Receiver 62 4.1. Overview 62 4.2. Timing and Data Recovery in a Serial Link 65 4.3. DLL-Based Forwarded-Clock Receiver Characteristics 70 4.4. Circuit Implementation 79 4.5. Measurement Results 89 Chapter 5. Conclusion 94 Appendix 96 Appendix A. Design flow to optimize a high-speed ring oscillator 96 Appendix B. Reflection Issues in N-over-N Voltage-Mode Driver 99 Appendix C. Analysis on output swing and power consumption of the P-over-N voltage-mode driver 107 Appendix D. Loop Dynamics of DLL 112 Bibliography 121 Abstract 128Docto

Reconfigurable Receiver Front-Ends for Advanced Telecommunication Technologies

The exponential growth of converging technologies, including augmented reality, autonomous vehicles, machine-to-machine and machine-to-human interactions, biomedical and environmental sensory systems, and artificial intelligence, is driving the need for robust infrastructural systems capable of handling vast data volumes between end users and service providers. This demand has prompted a significant evolution in wireless communication, with 5G and subsequent generations requiring exponentially improved spectral and energy efficiency compared to their predecessors. Achieving this entails intricate strategies such as advanced digital modulations, broader channel bandwidths, complex spectrum sharing, and carrier aggregation scenarios. A particularly challenging aspect arises in the form of non-contiguous aggregation of up to six carrier components across the frequency range 1 (FR1). This necessitates receiver front-ends to effectively reject out-of-band (OOB) interferences while maintaining high-performance in-band (IB) operation. Reconfigurability becomes pivotal in such dynamic environments, where frequency resource allocation, signal strength, and interference levels continuously change. Software-defined radios (SDRs) and cognitive radios (CRs) emerge as solutions, with direct RF-sampling receivers offering a suitable architecture in which the frequency translation is entirely performed in digital domain to avoid analog mixing issues. Moreover, direct RF- sampling receivers facilitate spectrum observation, which is crucial to identify free zones, and detect interferences. Acoustic and distributed filters offer impressive dynamic range and sharp roll off characteristics, but their bulkiness and lack of electronic adjustment capabilities limit their practicality. Active filters, on the other hand, present opportunities for integration in advanced CMOS technology, addressing size constraints and providing versatile programmability. However, concerns about power consumption, noise generation, and linearity in active filters require careful consideration.This thesis primarily focuses on the design and implementation of a low-voltage, low-power RFFE tailored for direct sampling receivers in 5G FR1 applications. The RFFE consists of a balun low-noise amplifier (LNA), a Q-enhanced filter, and a programmable gain amplifier (PGA). The balun-LNA employs noise cancellation, current reuse, and gm boosting for wideband gain and input impedance matching. Leveraging FD-SOI technology allows for programmable gain and linearity via body biasing. The LNA's operational state ranges between high-performance and high-tolerance modes, which are apt for sensitivityand blocking tests, respectively. The Q-enhanced filter adopts noise-cancelling, current-reuse, and programmable Gm-cells to realize a fourth-order response using two resonators. The fourth-order filter response is achieved by subtracting the individual response of these resonators. Compared to cascaded and magnetically coupled fourth-order filters, this technique maintains the large dynamic range of second-order resonators. Fabricated in 22-nm FD-SOI technology, the RFFE achieves 1%-40% fractional bandwidth (FBW) adjustability from 1.7 GHz to 6.4 GHz, 4.6 dB noise figure (NF) and an OOB third-order intermodulation intercept point (IIP3) of 22 dBm. Furthermore, concerning the implementation uncertainties and potential variations of temperature and supply voltage, design margins have been considered and a hybrid calibration scheme is introduced. A combination of on-chip and off-chip calibration based on noise response is employed to effectively adjust the quality factors, Gm-cells, and resonance frequencies, ensuring desired bandpass response. To optimize and accelerate the calibration process, a reinforcement learning (RL) agent is used.Anticipating future trends, the concept of the Q-enhanced filter extends to a multiple-mode filter for 6G upper mid-band applications. Covering the frequency range from 8 to 20 GHz, this RFFE can be configured as a fourth-order dual-band filter, two bandpass filters (BPFs) with an OOB notch, or a BPF with an IB notch. In cognitive radios, the filter’s transmission zeros can be positioned with respect to the carrier frequencies of interfering signals to yield over 50 dB blocker rejection