CMOS Integrated Circuits for RF-powered Wireless Temperature Sensor

This dissertation presents original research contributions in the form of twelve scientific publications that represent advances related to RF-to-DC converters, reference circuits (voltage, current and frequency) and temperature sensors. The primary focus of this research was to design efficient and low power CMOS-based circuit components, which are useful in various blocks of an RF-powered wireless sensor node.  The RF-to-DC converter or rectifier converts RF energy into DC energy, which is utilized by the sensor node. In the implementation of a CMOS-based RF-to-DC converter, the threshold voltage of MOS transistors mainly affects the conversion efficiency. Hence, for the first part of this research, different threshold voltage compensation schemes were developed for the rectifiers. These schemes were divided into two parts; first, the use of the MOSFET body terminal biasing technique and second, the use of an auxiliary circuit to obtain threshold voltage compensation. In addition to these schemes, the use of an alternate signaling scheme for voltage multiplier configuration of differential input RF-harvesters has also been investigated.  A known absolute value of voltage or current is the most useful for an integrated circuit. Thus, the circuit which generates the absolute value of voltage or current is cited as the voltage or current reference circuit respectively. Hence, in the second part of the research, simple, low power and moderately accurate, voltage and current reference circuits were developed for the power management unit of the sensor node. Besides voltage and current reference circuits, a frequency reference circuit was also designed. The use of the frequency reference circuit is in the digital processing and timing functions of the sensor node.  In the final part of the research, temperature sensing was selected as an application for the sensor node. Here, voltage and current based sensor cores were developed to sense the temperature. A smart temperature sensor was designed by using the voltage cores to obtain temperature information in terms of the duty-cycle. Similarly, the temperature equivalent current was converted into the frequency to obtain a temperature equivalent output signal.  All these implementations were done by using two integrated circuits which were fabricated during the year 2013-14.

Lithium niobate RF-MEMS oscillators for IoT, 5G and beyond

This dissertation focuses on the design and implementation of lithium niobate (LiNbO3) radiofrequency microelectromechanical (RF-MEMS) oscillators for internet-of-things (IoT), 5G and beyond. The dissertation focuses on solving two main problems found nowadays in most of the published works: the narrow tuning range and the low operating frequency (sub 3 GHz) acoustic oscillators currently deliver. The work introduced here enables wideband voltage-controlled MEMS oscillators (VCMOs) needed for emerging applications in IoT. Moreover, it enables multi-GHz (above 8 GHz) RF-MEMS oscillators through harnessing over mode resonances for 5G and beyond. LiNbO3 resonators characterized by high-quality factor (Q), high electromechanical coupling (kt2), and high figure-of-merit (FoMRES= Q kt2) are crucial for building the envisioned high-performance oscillators. Those oscillators can be enabled with lower power consumption, wider tuning ranges, and a higher frequency of oscillation when compared to other state-of-the-art (SoA) RF-MEMS oscillators. Tackling the tuning range issue, the first VCMO based on the heterogeneous integration of a high Q LiNbO3 RF-MEMS resonator and complementary metal-oxide semiconductor (CMOS) is demonstrated in this dissertation. A LiNbO3 resonator array with a series resonance of 171.1 MHz, a Q of 410, and a kt2 of 12.7% is adopted, while the TSMC 65 nm RF LP CMOS technology is used to implement the active circuitry with an active area of 220×70 µm2. Frequency tuning of the VCMO is achieved by programming a binary-weighted digital capacitor bank and a varactor that are both connected in series to the resonator. The measured best phase noise performances of the VCMO are -72 and -153 dBc/Hz at 1 kHz and 10 MHz offsets from 178.23 and 175.83 MHz carriers, respectively. The VCMO consumes a direct current (DC) of 60 µA from a 1.2 V supply while realizing a tuning range of 2.4 MHz (~ 1.4% tuning range). Such VCMOs can be applied to enable ultralow-power, low phase noise, and wideband RF synthesis for emerging applications in IoT. Moreover, the first VCMO based on LiNbO3 lateral overtone bulk acoustic resonator (LOBAR) is demonstrated in this dissertation. The LOBAR excites over 30 resonant modes in the range of 100 to 800 MHz with a frequency spacing of 20 MHz. The VCMO consists of a LOBAR in a closed-loop with two amplification stages and a varactor-embedded tunable LC tank. By the bias voltage applied to the varactor, the tank can be tuned to change the closed-loop gain and phase responses of the oscillator so that Barkhausen’s conditions are satisfied for the targeted resonant mode. The tank is designed to allow the proposed VCMO to lock to any of the ten overtones ranging from 300 to 500 MHz. These ten tones are characterized by average Qs of 2100, kt2 of 1.5%, FoMRES of 31.5 enabling low phase noise, and low-power oscillators crucial for IoT. Owing to the high Qs of the LiNbO3 LOBAR, the measured VCMO shows a close-in phase noise of -100 dBc/Hz at 1 kHz offset from a 300 MHz carrier and a noise floor of -153 dBc/Hz while consuming 9 mW. With further optimization, this VCMO can lead to direct RF synthesis for ultra-low-power transceivers in multi-mode IoT nodes. Tackling the multi-GHz operation problem, the first Ku-band RF-MEMS oscillator utilizing a third antisymmetric overtone (A3) in a LiNbO3 resonator is presented in the dissertation. Quarter-wave resonators are used to satisfy Barkhausen’s oscillation conditions for the 3rd overtone while suppressing the fundamental and higher-order resonances. The oscillator achieves measured phase noise of -70 and -111 dBc/Hz at 1 kHz and 100 kHz offsets from a 12.9 GHz carrier while consuming 20 mW of dc power. The oscillator achieves a FoMOSC of 200 dB at 100 kHz offset. The achieved oscillation frequency is the highest reported to date for a MEMS oscillator. In addition, this dissertation introduces the first X-band RF-MEMS oscillator built using CMOS technology. The oscillator consists of an acoustic resonator in a closed loop with cascaded RF tuned amplifiers (TAs) built on TSMC RF GP 65 nm CMOS. The TAs bandpass response, set by on-chip inductors, satisfies Barkhausen's oscillation conditions for A3 only. Two circuit variations are implemented. The first is an 8.6 GHz standalone oscillator with a source-follower buffer for direct 50 Ω-based measurements. The second is an oscillator-divider chain using an on-chip 3-stage divide-by-2 frequency divider for a ~1.1 GHz output. The standalone oscillator achieves measured phase noise of -56, -113, and -135 dBc/Hz at 1 kHz, 100 kHz, and 1 MHz offsets from an 8.6 GHz output while consuming 10.2 mW of dc power. The oscillator also attains a FoMOSC of 201.6 dB at 100 kHz offset, surpassing the SoA electromagnetic (EM) and RF-MEMS based oscillators. The oscillator-divider chain produces a phase noise of -69.4 and -147 dBc/Hz at 1 kHz and 1 MHz offsets from a 1075 MHz output while consuming 12 mW of dc power. Its phase noise performance also surpasses the SoA L-band phase-locked loops (PLLs). The demonstrated performance shows the strong potential of microwave acoustic oscillators for 5G frequency synthesis and beyond. This work will enable low-power 5G transceivers featuring high speed, high sensitivity, and high selectivity in small form factors

Interface Circuits for Microsensor Integrated Systems

ca. 200 words; this text will present the book in all promotional forms (e.g. flyers). Please describe the book in straightforward and consumer-friendly terms. [Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures have gained growing attention, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a severe interface design attention, especially concerning the analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems gets even harder the interface design due to the need of energy-aware cost-effective circuit interfaces integrating, where possible, energy harvesting solutions. The objective of this Special Issue is to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue aims to present and highlight the advances and the latest novel and emergent results on this topic, showing best practices, implementations and applications. The Guest Editors invite to submit original research contributions dealing with sensor interfacing related to this specific topic. Additionally, application oriented and review papers are encouraged.

Ultra-Low-Power Sensors and Receivers for IoT Applications

The combination of ultra-low power analog front-ends and CMOS-compatible transducers enable new applications, such as environmental monitors, household appliances, health trackers, etc. that are seamlessly integrated into our daily lives. Furthermore, wireless connectivity allows many of these sensors to operate both independently and collectively. These techniques collectively fulfil the recent surge of internet-of-things (IoT) applications that have the potential to fundamentally change daily life for millions of people.In this dissertation, the circuit and system design of wireless receivers and sensors is presented that explores the challenges of implementing long lifespan, high accuracy, and large coverage range IoT sensor networks. The first is a wake-up receiver (WuRX), which continuously monitors the RF environment to wake up a higher-power radio upon detection of a predetermined RF signature. This work both improves sensitivity and reduces power over prior art through a multi-faceted design featuring an impedance transformation network with large passive voltage gain, an active envelope detector with high input impedance to facilitate large passive voltage gain, a low-power precision comparator, and a low-leakage digital baseband correlator.Although pushing the prior WuRX performance boundary by orders of magnitude, the first work shows moderate sensitivity, inferior temperature robustness, and large area with external lumped components. Thus, the second work shows a miniaturized WuRX that is temperature-compensated, yet still consumes only nano-watt power and millimeter area while operating at 9 GHz. To further reduce the area, a global common-mode feedback is utilized across the envelope detector and baseband amplifier that eliminates the need for off-chip ac-coupling components. Multiple temperature-compensation techniques are proposed to maintain constant bandwidth of the signal path and constant clock frequency. Both WuRXs operate at 0.4 V supply, consume near-zero power and achieve ~-70 dBm sensitivity.Lastly, the first reported CMOS 2-in-1 relative humidity and temperature sensor is presented. A unified analog front-end interfaces on-chip transducers and converts the inputs into a frequency vis a high-linearity frequency-locked loop. An incomplete-settling switched-capacitor-based Wheatstone bridge is proposed to sense the inputs in a power-efficient fashion

Integrated Circuits and Systems for Smart Sensory Applications

Connected intelligent sensing reshapes our society by empowering people with increasing new ways of mutual interactions. As integration technologies keep their scaling roadmap, the horizon of sensory applications is rapidly widening, thanks to myriad light-weight low-power or, in same cases even self-powered, smart devices with high-connectivity capabilities. CMOS integrated circuits technology is the best candidate to supply the required smartness and to pioneer these emerging sensory systems. As a result, new challenges are arising around the design of these integrated circuits and systems for sensory applications in terms of low-power edge computing, power management strategies, low-range wireless communications, integration with sensing devices. In this Special Issue recent advances in application-specific integrated circuits (ASIC) and systems for smart sensory applications in the following five emerging topics: (I) dedicated short-range communications transceivers; (II) digital smart sensors, (III) implantable neural interfaces, (IV) Power Management Strategies in wireless sensor nodes and (V) neuromorphic hardware

High Frequency Thermally Actuated Single Crystalline Silicon Micromechanical Resonators with Piezoresistive Readout

Over the past decades there has been a great deal of research on developing high frequency micromechanical resonators. As the two most common and conventional MEMS resonators, piezoelectric and electrostatic resonators have been at the center of attention despite having some drawbacks. Piezoelectric resonators provide low impedances that make them compatible with other low impedance electronic components, however they have low quality factors and complicated fabrication processes. In case of electrostatic resonators, they have higher quality factors but the need for smaller transductions gaps complicates their fabrication process and causes squeezed film damping in Air. In addition, the operation of both these resonators deteriorates at higher frequencies. In this presented research, thermally actuated resonators with piezoresistive readout have been developed. It has been shown that not only do such resonators require a simple fabrication process, but also their performance improves at higher frequencies by scaling down all the dimensions of the structure. In addition, due to the internal thermo-electro-mechanical interactions, these active resonators can turn some of the consumed electronic power back into the mechanical structure and compensate for the mechanical losses. Therefore, such resonators can provide self-Q-enhancement and self-sustained-oscillation without the need for any electronic circuitry. In this research these facts have been shown both experimentally and theoretically. In addition, in order to further simplify the fabrication process of such structures, a new controlled batch fabrication method for fabricating silicon nanowires has been developed. This unique fabrication process has been utilized to fabricate high frequency, low power thermal-piezoresistive resonators. Finally, a new thermal-piezoresistive resonant structure has been developed that can operate inside liquid. This resonant structure can be utilized as an ultra sensitive biomedical mass sensor

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

High performance readout circuits and devices for Lorentz force resonant CMOS-MEMS magnetic sensors

In the last decades, sensing capabilities of martphones have greatly improved since the early mobile phones of the 90’s. Moreover, wearables and the automotive industry require increasing electronics and sensing sophistication. In such echnological advance, Micro Electro Mechanical Systems (MEMS) have played an important role as accelerometers and gyroscopes were the first sensors based on MEMS technology massively introduced in the market. In contrast, it still does not exist a commercial MEMS-based compass, even though Lorentz force MEMS magnetometers were first proposed in the late 90’s. Currently, Lorentz force MEMS magnetometers have been under the spotlight as they can offer an integrated solution to nowadays sensing power. As a consequence, great advances have been achieved, but various bottlenecks limit the introduction of Lorentz force MEMS compasses in the market. First, current MEMS magnetometers require high current consumption and high biasing voltages to achieve good sensitivities. Moreover, even though devices with excellent performance and sophistication are found in the literature, there is still a lack of research on the readout electronic circuits, specially in the digital signal processing, and closed loop control. Second, most research outcomes rely on custom MEMS fabrication rocesses to manufacture the devices. This is the same approach followed in current commercial MEMS, but it requires different fabrication processes for the electronics and the MEMS. As a consequence, manufacturing cost is high and sensor performance is affected by the MEMS-electronics interface parasitics. This dissertation presents potential solutions to these issues in order to pave the road to the commercialization of Lorentz force MEMS compasses. First, a complete closed loop, digitally controlled readout system is proposed. The readout circuitry, implemented with off-the-shelf commercial components, and the digital control, on an FPGA, are proposed as a proof of concept of the feasibility, and potential benefits, of such architecture. The proposed system has a measured noise of 550 nT / vHz while the MEMS is biased with 300 µA rms and V = 1 V . Second, various CMOS-MEMS magnetometers have been designed using the BEOL part of the TSMC and SMIC 180 nm standard CMOS processes, and wet and vapor etched. The devices measurement and characterisation is used to analyse the benefits and drawbacks of each design as well as releasing process. Doing so, a high volume manufacturing viability can be performed. Yield values as high as 86% have been obtained for one device manufactured in a SMIC 180 nm full wafer run, having a sensitivity of 2.82 fA/µT · mA and quality factor Q = 7.29 at ambient pressure. While a device manufactured in TSMC 180 nm has Q = 634.5 and a sensitivity of 20.26 fA/µT ·mA at 1 mbar and V = 1 V. Finally, an integrated circuit has been designed that contains all the critical blocks to perform the MEMS signal readout. The MEMS and the electronics have been manufactured using the same die area and standard TSMC 180 nm process in order to reduce parasitics and improve noise and current consumption. Simulations show that a resolution of 8.23 µT /mA for V = 1 V and BW = 10 Hz can be achieved with the designed device.En les últimes dècades, tenint en compte els primers telèfons mòbils dels anys 90, les capacitats de sensat dels telèfons intel·ligents han millorat notablement. A més, la indústria automobilística i de wearables necessiten cada cop més sofisticació en el sensat. Els Micro Electro Mechanical Systems (MEMS) han tingut un paper molt important en aquest avenç tecnològic, ja que acceleròmetres i giroscopis varen ser els primers sensors basats en la tecnologia MEMS en ser introduïts massivament al mercat. En canvi, encara no existeix en la indústria una brúixola electrònica basada en la tecnologia MEMS, tot i que els magnetòmetres MEMS varen ser proposats per primera vegada a finals dels anys 90. Actualment, els magnetòmetres MEMS basats en la força de Lorentz són el centre d'atenció donat que poden oferir una solució integrada a les capacitats de sensat actuals. Com a conseqüència, s'han aconseguit grans avenços encara que existeixen diversos colls d'ampolla que encara limiten la introducció al mercat de brúixoles electròniques MEMS basades en la força de Lorentz. Per una banda, els agnetòmetres MEMS actuals necessiten un consum de corrent i un voltatge de polarització elevats per aconseguir una bona sensibilitat. A més, tot i que a la literatura hi podem trobar dispositius amb rendiments i sofisticació excel·lents, encara existeix una manca de recerca en el circuit de condicionament, especialment de processat digital i control del llaç. Per altra banda, moltes publicacions depenen de processos de fabricació de MEMS fets a mida per fabricar els dispositius. Aquesta és la mateixa aproximació que s'utilitza actualment en la indústria dels MEMS, però té l'inconvenient que requereix processos de fabricació diferents pels MEMS i l’electrònica. Per tant, el cost de fabricació és alt i el rendiment del sensor queda afectat pels paràsits en la interfície entre els MEMS i l'electrònica. Aquesta tesi presenta solucions potencials a aquests problemes amb l'objectiu d'aplanar el camí a la comercialització de brúixoles electròniques MEMS basades en la força de Lorentz. En primer lloc, es proposa un circuit de condicionament complet en llaç tancat controlat digitalment. Aquest s'ha implementat amb components comercials, mentre que el control digital del llaç s'ha implementat en una FPGA, tot com una prova de concepte de la viabilitat i beneficis potencials que representa l'arquitectura proposada. El sistema presenta un soroll de 550 nT / vHz quan el MEMS està polaritzat amb 300 µArms i V = 1 V . En segon lloc, s'han dissenyat varis magnetòmetres CMOS-MEMS utilitzant la part BEOL dels processos CMOS estàndard de TSMC i SMIC 180 nm, que després s'han alliberat amb líquid i gas. La mesura i caracterització dels dispositius s’ha utilitzat per analitzar els beneficis i inconvenients de cada disseny i procés d’alliberament. D'aquesta manera, s'ha pogut realitzar un anàlisi de la viabilitat de la seva fabricació en massa. S'han obtingut valors de yield de fins al 86% per un dispositiu fabricat amb SMIC 180 nm en una oblia completa, amb una sensibilitat de 2.82 fA/µT · mA i un factor de qualitat Q = 7.29 a pressió ambient. Per altra banda, el dispositiu fabricat amb TSMC 180 nm presenta una Q = 634.5 i una sensibilitat de 20.26 fA/µT · mA a 1 mbar amb V = 1 V. Finalment, s'ha dissenyat un circuit integrat que conté tots els blocs per a realitzar el condicionament de senyal del MEMS. El MEMS i l'electrònica s'han fabricat en el mateix dau amb el procés estàndard de TSMC 180 nm per tal de reduir paràsits i millorar el soroll i el consum de corrent. Les simulacions mostren una resolució de 8.23 µT /mA amb V = 1 V i BW = 10 Hz pel dispositiu dissenyat

Oscillator Architectures and Enhanced Frequency Synthesizer

A voltage controlled oscillator (VCO), that generates a periodic signal whose frequency is tuned by a voltage, is a key building block in any integrated circuit systems. A sine wave oscillator can be used for a built-in self testing where high linearity is required. A bandpass filter (BPF) based oscillator is a preferred solution, and high quality factor (Q-factor) is needed to improve the linearity. However, a stringent linearity specification may require very high Q-factor, not practical to implement. To address this problem, a frequency harmonic shaping technique is proposed. It utilizes a finite impulse response filter improving the linearity by rejecting certain harmonics. A prototype SC BPF oscillator with an oscillating frequency of 10 MHz is designed and measurement results show that linearity is improved by 20 dB over a conventional oscillator. In radio frequency area, preferred oscillator structures are an LC oscillator and a ring oscillator. An LC oscillator exhibits good phase noise but an expensive cost of an inductor is disadvantageous. A ring oscillator can be built in standard CMOS process, but suffers due to a poor phase noise and is sensitive to supply noise. A RC BPF oscillator is proposed to compromise the above difficulties. A RC BPF oscillator at 2.5 GHz is designed and measured performance is better than ring oscillators when compared using a figure of merit. In particular, the frequency tuning range of the proposed oscillator is superior to the ring oscillator. VCO is normally incorporated with a frequency synthesizer (FS) for an accurate frequency control. In an integer-N FS, reference spur is one of the design concerns in communication systems since it degrades a signal to noise ratio. Reference spurs can be rejected more by either the lower loop bandwidth or the higher loop filter. But the former increases a settling time and the latter decreases phase margin. An adaptive lowpass filtering technique is proposed. The loop filter order is adaptively increased after the loop is locked. A 5.8 GHz integer-N FS is designed and measurement results show that reference spur rejection is improved by 20 dB over a conventional FS without degrading the settling time. A new pulse interleaving technique is proposed and several design modifications are suggested as a future work