A Sequential Circuit-Based IP Watermarking Algorithm for Multiple Scan Chains in Design-for-Test

In Very Large Scale Integrated Circuits (VLSI) design, the existing Design-for-Test(DFT) based watermarking techniques usually insert watermark through reordering scan cells, which causes large resource overhead, low security and coverage rate of watermark detection. A novel scheme was proposed to watermark multiple scan chains in DFT for solving the problems. The proposed scheme adopts DFT scan test model of VLSI design, and uses a Linear Feedback Shift Register (LFSR) for pseudo random test vector generation. All of the test vectors are shifted in scan input for the construction of multiple scan chains with minimum correlation. Specific registers in multiple scan chains will be changed by the watermark circuit for watermarking the design. The watermark can be effectively detected without interference with normal function of the circuit, even after the chip is packaged. The experimental results on several ISCAS benchmarks show that the proposed scheme has lower resource overhead, probability of coincidence and higher coverage rate of watermark detection by comparing with the existing methods

A Comprehensive Study of the Hardware Trojan and Side-Channel Attacks in Three-Dimensional (3D) Integrated Circuits (ICs)

Three-dimensional (3D) integration is emerging as promising techniques for high-performance and low-power integrated circuit (IC, a.k.a. chip) design. As 3D chips require more manufacturing phases than conventional planar ICs, more fabrication foundries are involved in the supply chain of 3D ICs. Due to the globalized semiconductor business model, the extended IC supply chain could incur more security challenges on maintaining the integrity, confidentiality, and reliability of integrated circuits and systems. In this work, we analyze the potential security threats induced by the integration techniques for 3D ICs and propose effective attack detection and mitigation methods. More specifically, we first propose a comprehensive characterization for 3D hardware Trojans in the 3D stacking structure. Practical experiment based quantitative analyses have been performed to assess the impact of 3D Trojans on computing systems. Our analysis shows that advanced attackers could exploit the limitation of the most recent 3D IC testing standard IEEE Standard 1838 to bypass the tier-level testing and successfully implement a powerful TSV-Trojan in 3D chips. We propose an enhancement for IEEE Standard 1838 to facilitate the Trojan detection on two neighboring tiers simultaneously. Next, we develop two 3D Trojan detection methods. The proposed frequency-based Trojan-activity identification (FTAI) method can differentiate the frequency changes induced by Trojans from those caused by process variation noise, outperforming the existing time-domain Trojan detection approaches by 38% in Trojan detection rate. Our invariance checking based Trojan detection method leverages the invariance among the 3D communication infrastructure, 3D network-on-chips (NoCs), to tackle the cross-tier 3D hardware Trojans, achieving a Trojan detection rate of over 94%. Furthermore, this work investigates another type of common security threat, side-channel attacks. We first propose to group the supply voltages of different 3D tiers temporally to drive the crypto unit implemented in 3D ICs such that the noise in power distribution network (PDN) can be induced to obfuscate the original power traces and thus mitigates correlation power analysis (CPA) attacks. Furthermore, we study the side-channel attack on the logic locking mechanism in monolithic 3D ICs and propose a logic-cone conjunction (LCC) method and a configuration guideline for the transistor-level logic locking to strengthen its resilience against CPA attacks

ACUTA Journal of Telecommunications in Higher Education

In This Issue To VolP or Not to VolP Preparing Your Campus for a VolP Conversion Strategic Planning in the College and University Ecosystem: The Common Denominators Advertorial: Going Wireless at Fiber Speeds Open-Source VolP for Colleges and Universities Institutional Excellence Award Honorable Mention The Naval Postgraduate School Interview President\u27s Message From the Executive Director Here\u27s My Advic

The ATLAS TRT electronics

The ATLAS inner detector consists of three sub-systems: the pixel detector spanning the radius range 4cm-20cm, the semiconductor tracker at radii from 30 to 52 cm, and the transition radiation tracker (TRT), tracking from 56 to 107 cm. The TRT provides a combination of continuous tracking with many projective measurements based on individual drift tubes (or straws) and of electron identification based on transition radiation from fibres or foils interleaved between the straws themselves. This paper describes the on and off detector electronics for the TRT as well as the TRT portion of the data acquisition (DAQ) system

Belle II Technical Design Report

The Belle detector at the KEKB electron-positron collider has collected almost 1 billion Y(4S) events in its decade of operation. Super-KEKB, an upgrade of KEKB is under construction, to increase the luminosity by two orders of magnitude during a three-year shutdown, with an ultimate goal of 8E35 /cm^2 /s luminosity. To exploit the increased luminosity, an upgrade of the Belle detector has been proposed. A new international collaboration Belle-II, is being formed. The Technical Design Report presents physics motivation, basic methods of the accelerator upgrade, as well as key improvements of the detector.Comment: Edited by: Z. Dole\v{z}al and S. Un

ACUTA Journal of Telecommunications in Higher Education

In This Issue System Security policy: What lt ts and Why Every Campus Needs One Mlzzou lntegrates Firewall and VPN Technology for Added Security College-Based programs Boost Computer Security Privacy on Today\u27s Electronic Campus Current Trends in lnformation Security at UW-Madison Watching the Network Cybercrime: Are you Ready? Columns Book Review Bill D. Morris Awar