Cross-Layer Rapid Prototyping and Synthesis of Application-Specific and Reconfigurable Many-accelerator Platforms

Technological advances of recent years laid the foundation consolidation of informatisationof society, impacting on economic, political, cultural and socialdimensions. At the peak of this realization, today, more and more everydaydevices are connected to the web, giving the term ”Internet of Things”. The futureholds the full connection and interaction of IT and communications systemsto the natural world, delimiting the transition to natural cyber systems and offeringmeta-services in the physical world, such as personalized medical care, autonomoustransportation, smart energy cities etc. . Outlining the necessities of this dynamicallyevolving market, computer engineers are required to implement computingplatforms that incorporate both increased systemic complexity and also cover awide range of meta-characteristics, such as the cost and design time, reliabilityand reuse, which are prescribed by a conflicting set of functional, technical andconstruction constraints. This thesis aims to address these design challenges bydeveloping methodologies and hardware/software co-design tools that enable therapid implementation and efficient synthesis of architectural solutions, which specifyoperating meta-features required by the modern market. Specifically, this thesispresents a) methodologies to accelerate the design flow for both reconfigurableand application-specific architectures, b) coarse-grain heterogeneous architecturaltemplates for processing and communication acceleration and c) efficient multiobjectivesynthesis techniques both at high abstraction level of programming andphysical silicon level.Regarding to the acceleration of the design flow, the proposed methodologyemploys virtual platforms in order to hide architectural details and drastically reducesimulation time. An extension of this framework introduces the systemicco-simulation using reconfigurable acceleration platforms as co-emulation intermediateplatforms. Thus, the development cycle of a hardware/software productis accelerated by moving from a vertical serial flow to a circular interactive loop.Moreover the simulation capabilities are enriched with efficient detection and correctiontechniques of design errors, as well as control methods of performancemetrics of the system according to the desired specifications, during all phasesof the system development. In orthogonal correlation with the aforementionedmethodological framework, a new architectural template is proposed, aiming atbridging the gap between design complexity and technological productivity usingspecialized hardware accelerators in heterogeneous systems-on-chip and networkon-chip platforms. It is presented a novel co-design methodology for the hardwareaccelerators and their respective programming software, including the tasks allocationto the available resources of the system/network. The introduced frameworkprovides implementation techniques for the accelerators, using either conventionalprogramming flows with hardware description language or abstract programmingmodel flows, using techniques from high-level synthesis. In any case, it is providedthe option of systemic measures optimization, such as the processing speed,the throughput, the reliability, the power consumption and the design silicon area.Finally, on addressing the increased complexity in design tools of reconfigurablesystems, there are proposed novel multi-objective optimization evolutionary algo-rithms which exploit the modern multicore processors and the coarse-grain natureof multithreaded programming environments (e.g. OpenMP) in order to reduce theplacement time, while by simultaneously grouping the applications based on theirintrinsic characteristics, the effectively explore the design space effectively.The efficiency of the proposed architectural templates, design tools and methodologyflows is evaluated in relation to the existing edge solutions with applicationsfrom typical computing domains, such as digital signal processing, multimedia andarithmetic complexity, as well as from systemic heterogeneous environments, suchas a computer vision system for autonomous robotic space navigation and manyacceleratorsystems for HPC and workstations/datacenters. The results strengthenthe belief of the author, that this thesis provides competitive expertise to addresscomplex modern - and projected future - design challenges.Οι τεχνολογικές εξελίξεις των τελευταίων ετών έθεσαν τα θεμέλια εδραίωσης της πληροφοριοποίησης της κοινωνίας, επιδρώντας σε οικονομικές,πολιτικές, πολιτιστικές και κοινωνικές διαστάσεις. Στο απόγειο αυτής τη ςπραγμάτωσης, σήμερα, ολοένα και περισσότερες καθημερινές συσκευές συνδέονται στο παγκόσμιο ιστό, αποδίδοντας τον όρο «Ίντερνετ των πραγμάτων».Το μέλλον επιφυλάσσει την πλήρη σύνδεση και αλληλεπίδραση των συστημάτων πληροφορικής και επικοινωνιών με τον φυσικό κόσμο, οριοθετώντας τη μετάβαση στα συστήματα φυσικού κυβερνοχώρου και προσφέροντας μεταυπηρεσίες στον φυσικό κόσμο όπως προσωποποιημένη ιατρική περίθαλψη, αυτόνομες μετακινήσεις, έξυπνες ενεργειακά πόλεις κ.α. . Σκιαγραφώντας τις ανάγκες αυτής της δυναμικά εξελισσόμενης αγοράς, οι μηχανικοί υπολογιστών καλούνται να υλοποιήσουν υπολογιστικές πλατφόρμες που αφενός ενσωματώνουν αυξημένη συστημική πολυπλοκότητα και αφετέρου καλύπτουν ένα ευρύ φάσμα μεταχαρακτηριστικών, όπως λ.χ. το κόστος σχεδιασμού, ο χρόνος σχεδιασμού, η αξιοπιστία και η επαναχρησιμοποίηση, τα οποία προδιαγράφονται από ένα αντικρουόμενο σύνολο λειτουργικών, τεχνολογικών και κατασκευαστικών περιορισμών. Η παρούσα διατριβή στοχεύει στην αντιμετώπιση των παραπάνω σχεδιαστικών προκλήσεων, μέσω της ανάπτυξης μεθοδολογιών και εργαλείων συνσχεδίασης υλικού/λογισμικού που επιτρέπουν την ταχεία υλοποίηση καθώς και την αποδοτική σύνθεση αρχιτεκτονικών λύσεων, οι οποίες προδιαγράφουν τα μετα-χαρακτηριστικά λειτουργίας που απαιτεί η σύγχρονη αγορά. Συγκεκριμένα, στα πλαίσια αυτής της διατριβής, παρουσιάζονται α) μεθοδολογίες επιτάχυνσης της ροής σχεδιασμού τόσο για επαναδιαμορφούμενες όσο και για εξειδικευμένες αρχιτεκτονικές, β) ετερογενή αδρομερή αρχιτεκτονικά πρότυπα επιτάχυνσης επεξεργασίας και επικοινωνίας και γ) αποδοτικές τεχνικές πολυκριτηριακής σύνθεσης τόσο σε υψηλό αφαιρετικό επίπεδο προγραμματισμού,όσο και σε φυσικό επίπεδο πυριτίου.Αναφορικά προς την επιτάχυνση της ροής σχεδιασμού, προτείνεται μια μεθοδολογία που χρησιμοποιεί εικονικές πλατφόρμες, οι οποίες αφαιρώντας τις αρχιτεκτονικές λεπτομέρειες καταφέρνουν να μειώσουν σημαντικά το χρόνο εξομοίωσης. Παράλληλα, εισηγείται η συστημική συν-εξομοίωση με τη χρήση επαναδιαμορφούμενων πλατφορμών, ως μέσων επιτάχυνσης. Με αυτόν τον τρόπο, ο κύκλος ανάπτυξης ενός προϊόντος υλικού, μετατεθειμένος από την κάθετη σειριακή ροή σε έναν κυκλικό αλληλεπιδραστικό βρόγχο, καθίσταται ταχύτερος, ενώ οι δυνατότητες προσομοίωσης εμπλουτίζονται με αποδοτικότερες μεθόδους εντοπισμού και διόρθωσης σχεδιαστικών σφαλμάτων, καθώς και μεθόδους ελέγχου των μετρικών απόδοσης του συστήματος σε σχέση με τις επιθυμητές προδιαγραφές, σε όλες τις φάσεις ανάπτυξης του συστήματος. Σε ορθογώνια συνάφεια με το προαναφερθέν μεθοδολογικό πλαίσιο, προτείνονται νέα αρχιτεκτονικά πρότυπα που στοχεύουν στη γεφύρωση του χάσματος μεταξύ της σχεδιαστικής πολυπλοκότητας και της τεχνολογικής παραγωγικότητας, με τη χρήση συστημάτων εξειδικευμένων επιταχυντών υλικού σε ετερογενή συστήματα-σε-ψηφίδα καθώς και δίκτυα-σε-ψηφίδα. Παρουσιάζεται κατάλληλη μεθοδολογία συν-σχεδίασης των επιταχυντών υλικού και του λογισμικού προκειμένου να αποφασισθεί η κατανομή των εργασιών στους διαθέσιμους πόρους του συστήματος/δικτύου. Το μεθοδολογικό πλαίσιο προβλέπει την υλοποίηση των επιταχυντών είτε με συμβατικές μεθόδους προγραμματισμού σε γλώσσα περιγραφής υλικού είτε με αφαιρετικό προγραμματιστικό μοντέλο με τη χρήση τεχνικών υψηλού επιπέδου σύνθεσης. Σε κάθε περίπτωση, δίδεται η δυνατότητα στο σχεδιαστή για βελτιστοποίηση συστημικών μετρικών, όπως η ταχύτητα επεξεργασίας, η ρυθμαπόδοση, η αξιοπιστία, η κατανάλωση ενέργειας και η επιφάνεια πυριτίου του σχεδιασμού. Τέλος, προκειμένου να αντιμετωπισθεί η αυξημένη πολυπλοκότητα στα σχεδιαστικά εργαλεία επαναδιαμορφούμενων συστημάτων, προτείνονται νέοι εξελικτικοί αλγόριθμοι πολυκριτηριακής βελτιστοποίησης, οι οποίοι εκμεταλλευόμενοι τους σύγχρονους πολυπύρηνους επεξεργαστές και την αδρομερή φύση των πολυνηματικών περιβαλλόντων προγραμματισμού (π.χ. OpenMP), μειώνουν το χρόνο επίλυσης του προβλήματος της τοποθέτησης των λογικών πόρων σε φυσικούς,ενώ ταυτόχρονα, ομαδοποιώντας τις εφαρμογές βάση των εγγενών χαρακτηριστικών τους, διερευνούν αποτελεσματικότερα το χώρο σχεδίασης.Η αποδοτικότητά των προτεινόμενων αρχιτεκτονικών προτύπων και μεθοδολογιών επαληθεύτηκε σε σχέση με τις υφιστάμενες λύσεις αιχμής τόσο σε αυτοτελής εφαρμογές, όπως η ψηφιακή επεξεργασία σήματος, τα πολυμέσα και τα προβλήματα αριθμητικής πολυπλοκότητας, καθώς και σε συστημικά ετερογενή περιβάλλοντα, όπως ένα σύστημα όρασης υπολογιστών για αυτόνομα διαστημικά ρομποτικά οχήματα και ένα σύστημα πολλαπλών επιταχυντών υλικού για σταθμούς εργασίας και κέντρα δεδομένων, στοχεύοντας εφαρμογές υψηλής υπολογιστικής απόδοσης (HPC). Τα αποτελέσματα ενισχύουν την πεποίθηση του γράφοντα, ότι η παρούσα διατριβή παρέχει ανταγωνιστική τεχνογνωσία για την αντιμετώπιση των πολύπλοκων σύγχρονων και προβλεπόμενα μελλοντικών σχεδιαστικών προκλήσεων

Proceedings of the 5th International Workshop on Reconfigurable Communication-centric Systems on Chip 2010 - ReCoSoC\u2710 - May 17-19, 2010 Karlsruhe, Germany. (KIT Scientific Reports ; 7551)

ReCoSoC is intended to be a periodic annual meeting to expose and discuss gathered expertise as well as state of the art research around SoC related topics through plenary invited papers and posters. The workshop aims to provide a prospective view of tomorrow\u27s challenges in the multibillion transistor era, taking into account the emerging techniques and architectures exploring the synergy between flexible on-chip communication and system reconfigurability

Optimising and evaluating designs for reconfigurable hardware

Growing demand for computational performance, and the rising cost for chip design and manufacturing make reconfigurable hardware increasingly attractive for digital system implementation. Reconfigurable hardware, such as field-programmable gate arrays (FPGAs), can deliver performance through parallelism while also providing flexibility to enable application builders to reconfigure them. However, reconfigurable systems, particularly those involving run-time reconfiguration, are often developed in an ad-hoc manner. Such an approach usually results in low designer productivity and can lead to inefficient designs. This thesis covers three main achievements that address this situation. The first achievement is a model that captures design parameters of reconfigurable hardware and performance parameters of a given application domain. This model supports optimisations for several design metrics such as performance, area, and power consumption. The second achievement is a technique that enhances the relocatability of bitstreams for reconfigurable devices, taking into account heterogeneous resources. This method increases the flexibility of modules represented by these bitstreams while reducing configuration storage size and design compilation time. The third achievement is a technique to characterise the power consumption of FPGAs in different activity modes. This technique includes the evaluation of standby power and dedicated low-power modes, which are crucial in meeting the requirements for battery-based mobile devices

Thermal, Power Delivery and Reliability Management for 3D ICS

Three-dimensional (3D) integration technology is promising to continuously improve the performance of electronic devices by vertically stacking multiple active layers and connecting them with Through-Silicon-Vias (TSVs). Meanwhile, the thermal and power integrity problems are exacerbated since the power flux in 3D integrated circuits (3D ICs) increases linearly with the number of stacked layers. Moreover, the TSV structure in 3D ICs introduces new reliability problems since TSVs are vulnerable to various failure mechanisms (e.g. electromigration) and the failure of power-ground TSVs will cause voltage drop thereby significantly degrading the performance of 3D ICs. To make things worse, the high temperature, thermal gradient and power load in 3D ICs accelerate the failure of TSVs. Therefore, in order to push the 3D integration technology to full commercialization, the thermal, power integrity and reliability problem should be properly addressed in both design-time and run-time. In 3D ICs, the heat flux will easily exceed the capability of the traditional air cooling. Therefore, several aggressive cooling methods are applied to remove heat from the 3D IC, which include micro-fluidic cooling, the phase change material based cooling etc. These cooling schemes are usually implemented close to the heat source to gain high heat removal capability, thus causing more challenges to the design of 3D ICs. Unfortunately, physical design tools for 3D ICs with those aggressive cooling methods are lack. In this thesis, we will focus on 3D ICs with micro-fluidic (MF) cooling. The physical design for this kind of 3D ICs involves complex trade-offs between the circuit performance, power delivery noise, and temperature. For example, both TSVs and micro-cavities for MF cooling are fabricated in the substrate region. Therefore, they will compete in space: the allocation of signal TSVs should avoid micro-cavities to realize a feasible design, thus enforcing more constraints to the physical placement of 3D ICs. Moreover, power delivery networks (PDNs) in 3D ICs are enabled by power-ground (P/G) TSVs. The number and distribution of P/G TSVs are also constrained by micro-cavities which will influence the power integrity of the 3D IC. In addition, the capability of MF cooling degrades downstream the flow of coolant thereby causing large in-layer temperature gradient. The spatial temperature variance will affect the reliability of 3D ICs. in order to avoid it, the gate/modules in 3D ICs should be placed properly. In order to address the trade-offs 3D ICs with MF cooling, different design-time methods for application specific ICs (ASICs) and field programmable gate arrays (FPGAs) are proposed, respectively. For 3D ASICs, we propose a co-design method that integrates the design of MF cooling heat sink and P/G TSVs to the physical placement for 3D ICs. Experiments on publicly available benchmarks show that using our method, we can achieve better results compared to the traditional sequential design flow. The case for 3D FPGAs is more complicated than ASICs since the routing and logic resources are fixed and the chip power and temperature is hard to estimate until the circuit is routed. Therefore, in this thesis, we first build a design space exploration (DSE) framework to study how MF cooling affects the design of 3D FPGAs. Following this, we utilize an existing 3D FPGA placement and routing tool to develop a cooling-aware placement framework for 3D FPGAs to reduce the temperature gradient. Since the activity of 3D ICs cannot be completely estimated at the design stage, the run-time management, besides design-time methods, is required to address the thermal, power and reliability problems in 3D ICs. However, the vertically stacked structure makes the run-time management for 3D ICs more complicated than 2D ICs. The major reason of this is that the power supply noise and temperature can be coupled across layers in 3D ICs. This means the activity of one layer may affect the performance and reliability of other layers through voltage/temperature coupling. As a result, we cannot perform run-time management for each layer (perhaps implemented with dierent chips) of 3D ICs separately as in 2D systems. Therefore, the space of control nodes will become larger and more complicated. To make things worse, the existing run-time management techniques have various drawbacks (e.g. large off-line characterization overhead, poor scalability etc. ), which needs more eort to improve. In this thesis, we propose a phase-driven Q-learning based run-time management technique which can tune the activity of the processor to maximize the 3D CPU performance subject to the reliability constraint

MFPA: Mixed-Signal Field Programmable Array for Energy-Aware Compressive Signal Processing

Compressive Sensing (CS) is a signal processing technique which reduces the number of samples taken per frame to decrease energy, storage, and data transmission overheads, as well as reducing time taken for data acquisition in time-critical applications. The tradeoff in such an approach is increased complexity of signal reconstruction. While several algorithms have been developed for CS signal reconstruction, hardware implementation of these algorithms is still an area of active research. Prior work has sought to utilize parallelism available in reconstruction algorithms to minimize hardware overheads; however, such approaches are limited by the underlying limitations in CMOS technology. Herein, the MFPA (Mixed-signal Field Programmable Array) approach is presented as a hybrid spin-CMOS reconfigurable fabric specifically designed for implementation of CS data sampling and signal reconstruction. The resulting fabric consists of 1) slice-organized analog blocks providing amplifiers, transistors, capacitors, and Magnetic Tunnel Junctions (MTJs) which are configurable to achieving square/square root operations required for calculating vector norms, 2) digital functional blocks which feature 6-input clockless lookup tables for computation of matrix inverse, and 3) an MRAM-based nonvolatile crossbar array for carrying out low-energy matrix-vector multiplication operations. The various functional blocks are connected via a global interconnect and spin-based analog-to-digital converters. Simulation results demonstrate significant energy and area benefits compared to equivalent CMOS digital implementations for each of the functional blocks used: this includes an 80% reduction in energy and 97% reduction in transistor count for the nonvolatile crossbar array, 80% standby power reduction and 25% reduced area footprint for the clockless lookup tables, and roughly 97% reduction in transistor count for a multiplier built using components from the analog blocks. Moreover, the proposed fabric yields 77% energy reduction compared to CMOS when used to implement CS reconstruction, in addition to latency improvements

Digital design techniques for dependable High-Performance Computing

L'abstract è presente nell'allegato / the abstract is in the attachmen

Dynamic Partial Reconfiguration for Dependable Systems

Moore’s law has served as goal and motivation for consumer electronics manufacturers in the last decades. The results in terms of processing power increase in the consumer electronics devices have been mainly achieved due to cost reduction and technology shrinking. However, reducing physical geometries mainly affects the electronic devices’ dependability, making them more sensitive to soft-errors like Single Event Transient (SET) of Single Event Upset (SEU) and hard (permanent) faults, e.g. due to aging effects. Accordingly, safety critical systems often rely on the adoption of old technology nodes, even if they introduce longer design time w.r.t. consumer electronics. In fact, functional safety requirements are increasingly pushing industry in developing innovative methodologies to design high-dependable systems with the required diagnostic coverage. On the other hand commercial off-the-shelf (COTS) devices adoption began to be considered for safety-related systems due to real-time requirements, the need for the implementation of computationally hungry algorithms and lower design costs. In this field FPGA market share is constantly increased, thanks to their flexibility and low non-recurrent engineering costs, making them suitable for a set of safety critical applications with low production volumes. The works presented in this thesis tries to face new dependability issues in modern reconfigurable systems, exploiting their special features to take proper counteractions with low impacton performances, namely Dynamic Partial Reconfiguration

CAD Techniques for Robust FPGA Design Under Variability

The imperfections in the semiconductor fabrication process and uncertainty in operating environment of VLSI circuits have emerged as critical challenges for the semiconductor industry. These are generally termed as process and environment variations, which lead to uncertainty in performance and unreliable operation of the circuits. These problems have been further aggravated in scaled nanometer technologies due to increased process variations and reduced operating voltage. Several techniques have been proposed recently for designing digital VLSI circuits under variability. However, most of them have targeted ASICs and custom designs. The flexibility of reconfiguration and unknown end application in FPGAs make design under variability different for FPGAs compared to ASICs and custom designs, and the techniques proposed for ASICs and custom designs cannot be directly applied to FPGAs. An important design consideration is to minimize the modifications in architecture and circuit to reduce the cost of changing the existing FPGA architecture and circuit. The focus of this work can be divided into three principal categories, which are, improving timing yield under process variations, improving power yield under process variations and improving the voltage profile in the FPGA power grid. The work on timing yield improvement proposes routing architecture enhancements along with CAD techniques to improve the timing yield of FPGA designs. The work on power yield improvement for FPGAs selects a low power dual-Vdd FPGA design as the baseline FPGA architecture for developing power yield enhancement techniques. It proposes CAD techniques to improve the power yield of FPGAs. A mathematical programming technique is proposed to determine the parameters of the buffers in the interconnect such as the sizes of the transistors and threshold voltage of the transistors, all within constraints, such that the leakage variability is minimized under delay constraints. Two CAD techniques are investigated and proposed to improve the supply voltage profile of the power grids in FPGAs. The first technique is a place and route technique and the second technique is a logic clustering technique to reduce IR-drops and spatial variation of supply voltage in the power grid

Hybrid FPGA: Architecture and Interface

Hybrid FPGAs (Field Programmable Gate Arrays) are composed of general-purpose logic resources with different granularities, together with domain-specific coarse-grained units. This thesis proposes a novel hybrid FPGA architecture with embedded coarse-grained Floating Point Units (FPUs) to improve the floating point capability of FPGAs. Based on the proposed hybrid FPGA architecture, we examine three aspects to optimise the speed and area for domain-specific applications. First, we examine the interface between large coarse-grained embedded blocks (EBs) and fine-grained elements in hybrid FPGAs. The interface includes parameters for varying: (1) aspect ratio of EBs, (2) position of the EBs in the FPGA, (3) I/O pins arrangement of EBs, (4) interconnect flexibility of EBs, and (5) location of additional embedded elements such as memory. Second, we examine the interconnect structure for hybrid FPGAs. We investigate how large and highdensity EBs affect the routing demand for hybrid FPGAs over a set of domain-specific applications. We then propose three routing optimisation methods to meet the additional routing demand introduced by large EBs: (1) identifying the best separation distance between EBs, (2) adding routing switches on EBs to increase routing flexibility, and (3) introducing wider channel width near the edge of EBs. We study and compare the trade-offs in delay, area and routability of these three optimisation methods. Finally, we employ common subgraph extraction to determine the number of floating point adders/subtractors, multipliers and wordblocks in the FPUs. The wordblocks include registers and can implement fixed point operations. We study the area, speed and utilisation trade-offs of the selected FPU subgraphs in a set of floating point benchmark circuits. We develop an optimised coarse-grained FPU, taking into account both architectural and system-level issues. Furthermore, we investigate the trade-offs between granularities and performance by composing small FPUs into a large FPU. The results of this thesis would help design a domain-specific hybrid FPGA to meet user requirements, by optimising for speed, area or a combination of speed and area