Overview of sensors suitable for active flow control methods

Hlavným cieľom tejto bakalárskej práce bolo vytvorenie prehľadu vyvíjaných a už aplikovaných senzorov pre účely aktívneho riadenia prúdov. Senzory musia splňovať niektoré podmienky, preto výber senzorov bol naviazaný na reálnych výsledkoch testovacích programov, popis ktorých tvorí prvú časť tejto bakalárskej práce. Opis technológie a princíp fungovania senzorov je popísaný v druhej časti tejto práce.The main purpose of this bachelor thesis was to create the overview of the sensors developed for the future active flow control applications and overview the sensors already used in the active flow control applications. The sensors have to fulfil several requirements, so selection for the overview was based on the real flight test programs results, which were described in the first part of the thesis. The sensors technology description and operation principles were included in the second part of the thesis

Integration of electronic and optical techniques in the design and fabrication of pressure sensors

Since the introduction of micro-electro-mechanical systems fabrication methods, piezoresistive pressure sensors have become the more popular pressure transducers. They dominate pressure sensor commercialization due to their high performance, stability and repeatability. However, increasing demand for harsh environment sensing devices has made sensors based on Fabry-Perot interferometry the more promising optical pressure sensors due to their high degree of sensitivity, small size, high temperature performance, versatility, and improved immunity to environmental noise and interference. The work presented in this dissertation comprises the design, fabrication, and testing of sensors that fuse these two pressure sensing technologies into one integrated unit. A key innovation is introduction of a silicon diaphragm with a center rigid body (or boss), denoted as an embossed diaphragm, that acts as the sensing element for both the electronic and optical parts of the sensor. Physical principles of piezoresistivity and Fabry-Perot interferometry were applied in designing an integrated sensor and in determining analytic models for the respective electronic and optical outputs. Several test pressure sensors were produced and their performance was evaluated by collecting response and noise data. Diaphragm deflection under applied pressure was detected electronically using the principle of piezoresistivity and optically using Fabry-Perot interferometry. The electronic part of the sensor contained four p-type silicon piezoresistors that were set into the diaphragm. They were connected in a Wheatstone bridge configuration for detecting strain-dependent changes in resistance induced by diaphragm deflection. In the optical part of the sensor, an optical cavity was formed between the embossed surface of the diaphragm and the end face of a single mode optical fiber. An infrared laser operating at 1.55 was used for optical excitation. Deflection of the diaphragm, which causes the length of the optical cavity to change, was detected by Fabry-Perot interference in the reflected light. Data collected on several sensors fabricated for this dissertation were shown to validate the theoretical models. In particular, the principle of operation of a Fabry-Perot interferometer as a mechanism for pressure sensing was demonstrated. The physical characteristics and behavior of the embossed diaphragm facilitated the integration of the electronic and optical approaches because the embossed diaphragm remained flat under diaphragm deflection. Consequently, it made the electronic sensor respond more linearly to applied pressure. Further, it eliminated a fundamental deficiency of previous applications of Fabry-Perot methods, which suffered from non-parallelism between the two cavity surfaces (diaphragm and fiber), owing to diaphragm curvature after pressure was applied. It also permitted the sensor to be less sensitive to lateral misalignment during the fabrication process and considerably reduced back pressure, which otherwise reduced the sensitivity of the sensor. As an integrated sensor, it offered two independent outputs in one sensor and therefore the capability for measurements of: (a) static and dynamic pressures simultaneously, and (b) two different physical quantities such as temperature and pressure

Silicon-glass-based single piezoresistive pressure sensors for harsh environment applications

National Natural Science Foundation of China [51075344, 61274120, 51175444]; Fujian Province Major Projects on University-Industry Cooperation in Science and Technology [2013H6023]; Science and Technology Program of Xiamen [3502Z20123008, 3502Z20126006]Silicon-glass (Si-glass)-based single piezoresistive pressure sensors were designed and fabricated by standard MEMS technology. The single piezoresistive sensing element was designed to be on the lower surface of the silicon diaphragm and be vacuum-sealed in a Si-glass cavity, which form a self-packaging protection structure helpful to the applications of sensors in harsh media. The pressure sensors were fabricated using a Si-glass anodic bonding technique, and the embedded Al feedthrough lines at the Si-glass interface are used to realize the electrical connections between the piezo-sensing element and the electrode-pads, and two larger-size electrode-pads are fabricated for realizing the soldered electrical connection between the sensor and the external circuit. The performance of the pressure sensors was characterized by a pressure test system at different temperature conditions. The temperature compensation was performed by the difference between the output voltage at zero-pressure and the output at operation pressure. The measurement results show that the sensitivity is 24 mV V-1 MPa-1, the coefficient of sensitivity is 0.14% FS degrees C-1, and both the zero-point offset and the temperature coefficient of offset are equal to zero, which are able to meet the commercial application requirements. However, a nonlinearity of 5.2% FS caused by the balloon effect would considerably worsen the accuracy of the pressure sensor. It is suggested to reduce the balloon effect by using a bossed-diaphragm structure in the pressure sensor

Fiber inline pressure and acoustic sensor fabricated with femtosecond laser

Pressure and acoustic measurements are required in many industrial applications such as down-hole oil well monitoring, structural heath monitoring, engine monitoring, study of aerodynamics, etc. Conventional sensors are difficult to apply due to the high temperature, electromagnetic-interference noise and limited space in such environments. Fiber optic sensors have been developed since the last century and have proved themselves good candidates in such harsh environment. This dissertation aims to design, develop and demonstrate miniaturized fiber pressure/acoustic sensors for harsh environment applications through femtosecond laser fabrication. Working towards this objective, the dissertation explored two types of fiber inline microsensors fabricated by femtosecond laser: an extrinsic Fabry-Perot interferometric (EFPI) sensor with silica diaphragm for pressure/acoustic sensing, and an intrinisic Fabry-Perot interferometer (IFPI) for temperature sensing. The scope of the dissertation work consists of device design, device modeling/simulation, laser fabrication system setups, signal processing method development and sensor performance evaluation and demonstration. This research work provides theoretical and experimental evidences that the femtosecond laser fabrication technique is a valid tool to fabricate miniaturized fiber optic pressure and temperature sensors which possess advantages over currently developed sensors --Abstract, page iii

Silicon Carbide in Microsystem Technology — Thin Film Versus Bulk Material

This chapter looks at the role of silicon carbide (SiC) in microsystem technology. It starts with an introduction into the wide bandgap (WBG) materials and the properties that make them potential candidates to enable the development of harsh environment microsystems. The future commercial success of WBG microsystems depends mainly on the availability of high-quality materials, well-established microfabrication processes, and economic viability. In such aspects SiC platform, in relation to other WBG materials, provides a clear and competitive advantage. The reasons for this will be detailed. Furthermore, the current status of the SiC thin film and bulk material technologies will also be discussed. Both SiC material forms have played important roles in different microsystem types

Microtechnologies for Discharge-based Sensors.

Microdischarge-based sensors are known to offer advantages such as the ability to operate at temperature extremes and to provide large output signals that do not require local amplification. This work is primarily directed at the design and microfabrication of pressure sensors that use differential microdischarge currents. Two approaches are evaluated. The first uses a common anode and reference cathode located on a glass substrate, whereas a sensing cathode is located on an opposing silicon diaphragm that is deflected by applied pressure. Leads are transferred by electroplated through-glass vias. The second uses a common cathode and reference anode located on a silicon substrate, whereas a sensing anode is located on a thin film diaphragm that deflects under applied pressure. Leads are transferred by through-wafer isolated bulk-silicon lead transfer (TWIST). Fabricated sensors with 200-µm diameter have footprints as small as 300×300 µm2, and volume of ≈0.01 mm3, which is 150× smaller than prior work. The fractional differential current (I1-I2)/(I1+I2) increases monotonically from -0.7 to 0.2 as external pressure increases from 1 atm to 8 atm. The TWIST process can also be used to fabricate ultra-miniature capacitive pressure sensors with backside contacts that minimize the form factor and allow stacking of the sensor on interface electronics. A sensor with a 100-µm diameter diaphragm measures 150×150 µm2 in size. Fabricated sensors with thicknesses of 3 µm (C100t3) and 5 µm (C100t5) have dynamic ranges of 20 MPa and 50 MPa, respectively. Pressure responses in the non-contact mode and the contact mode are 3.1 fF/MPa, 5.3 fF/MPa for C100t3, and 1.6 fF/MPa, 1.6 fF/Ma for C100t5, respectively. This thesis also describes a preliminary exploration of options to initiate microdischarges using scavenged energy – in this case from mechanical impact. A miniature high voltage generator is formed by connecting multiple electrode pairs in series on a single PZT element. This strategy amplifies voltage roughly in proportion to the electrode pair count; a three electrode-pair device is used to successfully initiate microdischarges with peak voltages exceeding 1.35 kV.PhDMechanical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/111467/1/xinluo_1.pd

Integrated sensors for process monitoring and health monitoring in microsystems

This thesis presents the development of integrated sensors for health monitoring in Microsystems, which is an emerging method for early diagnostics of status or “health” of electronic systems and devices under operation based on embedded tests. Thin film meander temperature sensors have been designed with a minimum footprint of 240 m × 250 m. A microsensor array has been used successfully for accurate temperature monitoring of laser assisted polymer bonding for MEMS packaging. Using a frame-shaped beam, the temperature at centre of bottom substrate was obtained to be ~50 ºC lower than that obtained using a top-hat beam. This is highly beneficial for packaging of temperature sensitive MEMS devices. Polymer based surface acoustic wave humidity sensors were designed and successfully fabricated on 128° cut lithium niobate substrates. Based on reflection signals, a sensitivity of 0.26 dB/RH% was achieved between 8.6 %RH and 90.6 %RH. Fabricated piezoresistive pressure sensors have also been hybrid integrated and electrically contacted using a wire bonding method. Integrated sensors based on both LiNbO3 and ZnO/Si substrates are proposed. Integrated sensors were successfully fabricated on a LiNbO3 substrate with a footprint of 13 mm × 12 mm, having multi monitoring functions for simultaneous temperature, measurement of humidity and pressure in the health monitoring applications

Relative contributions of packaging elements to the thermal hysteresis of a MEMS pressure sensor

Piezoresistive silicon pressure sensor samples were thermally cycled after being consecutively packaged to three different levels. These started with the absolute minimum to allow measurement of the output and with each subsequent level incorporating additional packaging elements within the build. Fitting the data to a mathematical function was necessary both to correct for any testing uncertainties within the pressure and temperature controllers, and to enable the identification and quantification of any hysteresis. Without being subjected to any previous thermal preconditioning, the sensors were characterized over three different temperature ranges and for multiple cycles, in order to determine the relative contributions of each packaging level toward thermal hysteresis. After reaching a stabilised hysteretic behaviour, 88.5% of the thermal hysteresis was determined to be related to the bond pads and wire bonds, which is likely to be due to the large thermal mismatch between the silicon and bond pad metallisation. The fluid-fill and isolation membrane contributed just 7.2% of the total hysteresis and the remaining 4.3% was related to the adhesive used for attachment of the sensing element to the housing. This novel sequential packaging evaluation methodology is independent of sensor design and is useful in identifying those packaging elements contributing the most to hysteresis