A 0.18-μm BICMOS 20-57 GHz Ultra-Wideband Low-Noise Amplifier Utilizing Frequency-Controlled Positive-Negative Feedback Technique

Silicon based complementary metallic oxide semiconductor (CMOS) and Bipolar Complementary Metal Oxide Semiconductor (BiCMOS) radio frequency integrated circuits (RFICs), including microwave and millimeter-wave (MMW), are attractive for wireless communication and sensing systems due to their small chip size and facilitation in system-on-chip integration. One of the most important RFICs is the low-noise amplifier (LNA). The design of CMOS/BiCMOS wideband LNAs at MMW frequencies, especially those working across several decades of frequency, is challenging due to various issues. For instance, the device parasitic and inter-coupling between nearby elements in highly condensed chip areas limits the operating bandwidth and performance, and the conductive silicon substrates lead to the inevitable low quality factor of passive elements. In this work, a MMW BiCMOS ultra-wideband LNA across 20 to 57 GHz is presented along with the analysis, design and measurement results. To overcome the upper-band gain degradation and improve the in-band flatness, a novel frequency controlled positive-negative (P-N) feedback topology is adopted to modify the gain response by boosting the gain at the upper-band while suppressing that at the lower-band. To reduce overall power consumption, the first and second stages of the amplifier are stacked between supply voltage and DC ground to utilize the same DC current. At the output of amplifier, a shunt-peaking load stage is utilized to achieve wideband output matching. The designed ultra-wideband MMW LNA is fabricated in JAZZ 0.18-μm BiCMOS technology. It shows a measured power gain of 10.5 ± 0.5 dB, a noise figure between 5.1-7.0 dB, input and output return losses better than -10 and -15 dB, respectively, an input 1 dB compression point higher than -19 dBm, and an input third-order intercept point greater than -8 dBm. It dissipates 16.6 mW from 1.8 V DC supply and has a chip area of 700×400 μm^2

A 0.18-μm BICMOS 20-57 GHz Ultra-Wideband Low-Noise Amplifier Utilizing Frequency-Controlled Positive-Negative Feedback Technique

Silicon based complementary metallic oxide semiconductor (CMOS) and Bipolar Complementary Metal Oxide Semiconductor (BiCMOS) radio frequency integrated circuits (RFICs), including microwave and millimeter-wave (MMW), are attractive for wireless communication and sensing systems due to their small chip size and facilitation in system-on-chip integration. One of the most important RFICs is the low-noise amplifier (LNA). The design of CMOS/BiCMOS wideband LNAs at MMW frequencies, especially those working across several decades of frequency, is challenging due to various issues. For instance, the device parasitic and inter-coupling between nearby elements in highly condensed chip areas limits the operating bandwidth and performance, and the conductive silicon substrates lead to the inevitable low quality factor of passive elements. In this work, a MMW BiCMOS ultra-wideband LNA across 20 to 57 GHz is presented along with the analysis, design and measurement results. To overcome the upper-band gain degradation and improve the in-band flatness, a novel frequency controlled positive-negative (P-N) feedback topology is adopted to modify the gain response by boosting the gain at the upper-band while suppressing that at the lower-band. To reduce overall power consumption, the first and second stages of the amplifier are stacked between supply voltage and DC ground to utilize the same DC current. At the output of amplifier, a shunt-peaking load stage is utilized to achieve wideband output matching. The designed ultra-wideband MMW LNA is fabricated in JAZZ 0.18-μm BiCMOS technology. It shows a measured power gain of 10.5 ± 0.5 dB, a noise figure between 5.1-7.0 dB, input and output return losses better than -10 and -15 dB, respectively, an input 1 dB compression point higher than -19 dBm, and an input third-order intercept point greater than -8 dBm. It dissipates 16.6 mW from 1.8 V DC supply and has a chip area of 700×400 μm^2

Microwave and Millimeter-wave Concurrent Multiband Low-Noise Amplifiers and Receiver Front-end in SiGe BiCMOS Technology

A fully integrated SiGe BiCMOS concurrent multiband receiver front-end and its building blocks including multiband low-noise amplifiers (LNAs), single-to-differential amplifiers and mixer are presented for various Ku-/K-/Ka-band applications. The proposed concurrent multiband receiver building blocks and receiver front-end achieve the best stopband rejection performances as compared to the existing multiband LNAs and receivers. First, a novel feedback tri-band load composed of two inductor feedback notch filters is proposed to overcome the low Q-factor of integrated passive inductors, and hence it provides superior stopband rejection ratio (SRR). A new 13.5/24/35-GHz concurrent tri-band LNA implementing the feedback tri-band load is presented. The developed tri-band LNA is the first concurrent tri-band LNA operating up to millimeter-wave region. By expanding the operating principle of the feedback tri-band load, a 21.5/36.5-GHz concurrent dual-band LNA with an inductor feedback dual-band load and another 23/36-GHz concurrent dual-band LNA with a new transformer feedback dual-band load are also presented. The latter provides more degrees of freedom for the creation of the stopband and passbands as compared to the former. A 22/36-GHz concurrent dual-band single-to-differential LNA employing a novel single-to-differential transformer feedback dual-band load is presented. The developed LNA is the first true concurrent dual-band single-to-differential amplifier. A novel 24.5/36.5 GHz concurrent dual-band merged single-to-differential LNA and mixer implementing the proposed single-to-differential transformer feedback dual-band load is also presented. With a 21-GHz LO signal, the down-converted dual IF bands are located at 3.5/15.5 GHz for two passband signals at 24.5/36.5 GHz, respectively. The proposed merged LNA and mixer is the first fully integrated concurrent dual-band mixer operating up to millimeter-wave frequencies without using any switching mechanism. Finally, a 24.5/36.5-GHz concurrent dual-band receiver front-end is proposed. It consists of the developed concurrent dual-band LNA using the single-to-single transformer feedback dual-band load and the developed concurrent dual-band merged LNA and mixer employing the single-to-differential transformer feedback dual-band load. The developed concurrent dual-band receiver front-end achieves the highest gain and the best NF performances with the largest SRRs, while operating at highest frequencies up to millimeter-wave region, among the concurrent dual-band receivers reported to date

Microwave and Millimeter-wave Concurrent Multiband Low-Noise Amplifiers and Receiver Front-end in SiGe BiCMOS Technology

A fully integrated SiGe BiCMOS concurrent multiband receiver front-end and its building blocks including multiband low-noise amplifiers (LNAs), single-to-differential amplifiers and mixer are presented for various Ku-/K-/Ka-band applications. The proposed concurrent multiband receiver building blocks and receiver front-end achieve the best stopband rejection performances as compared to the existing multiband LNAs and receivers. First, a novel feedback tri-band load composed of two inductor feedback notch filters is proposed to overcome the low Q-factor of integrated passive inductors, and hence it provides superior stopband rejection ratio (SRR). A new 13.5/24/35-GHz concurrent tri-band LNA implementing the feedback tri-band load is presented. The developed tri-band LNA is the first concurrent tri-band LNA operating up to millimeter-wave region. By expanding the operating principle of the feedback tri-band load, a 21.5/36.5-GHz concurrent dual-band LNA with an inductor feedback dual-band load and another 23/36-GHz concurrent dual-band LNA with a new transformer feedback dual-band load are also presented. The latter provides more degrees of freedom for the creation of the stopband and passbands as compared to the former. A 22/36-GHz concurrent dual-band single-to-differential LNA employing a novel single-to-differential transformer feedback dual-band load is presented. The developed LNA is the first true concurrent dual-band single-to-differential amplifier. A novel 24.5/36.5 GHz concurrent dual-band merged single-to-differential LNA and mixer implementing the proposed single-to-differential transformer feedback dual-band load is also presented. With a 21-GHz LO signal, the down-converted dual IF bands are located at 3.5/15.5 GHz for two passband signals at 24.5/36.5 GHz, respectively. The proposed merged LNA and mixer is the first fully integrated concurrent dual-band mixer operating up to millimeter-wave frequencies without using any switching mechanism. Finally, a 24.5/36.5-GHz concurrent dual-band receiver front-end is proposed. It consists of the developed concurrent dual-band LNA using the single-to-single transformer feedback dual-band load and the developed concurrent dual-band merged LNA and mixer employing the single-to-differential transformer feedback dual-band load. The developed concurrent dual-band receiver front-end achieves the highest gain and the best NF performances with the largest SRRs, while operating at highest frequencies up to millimeter-wave region, among the concurrent dual-band receivers reported to date

CMOS RF low noise amplifier with high ESD immunity.

Tang Siu Kei.Thesis (M.Phil.)--Chinese University of Hong Kong, 2004.Includes bibliographical references (leaves 107-111).Abstracts in English and Chinese.Acknowledgements --- p.iiAbstract --- p.iiiList of Figures --- p.xiList of Tables --- p.xviChapter Chapter 1 --- Introduction --- p.1Chapter 1.1 --- Overview of Electrostatic Discharge --- p.1Chapter 1.1.1 --- Classification of Electrostatic Discharge Models --- p.1Chapter 1.2 --- Electrostatic Discharge in CMOS RF Circuits --- p.4Chapter 1.3 --- Research Goal and Contribution --- p.6Chapter 1.4 --- Thesis Outline --- p.6Chapter Chapter 2 --- Performance Parameters of Amplifier --- p.8Chapter 2.1 --- Amplifier Gain --- p.8Chapter 2.2 --- Noise Factor --- p.9Chapter 2.3 --- Linearity --- p.11Chapter 2.3.1 --- 1-dB Compression Point --- p.13Chapter 2.3.2 --- Third-Order Intercept Point --- p.14Chapter 2.4 --- Return Loss --- p.16Chapter 2.5 --- Power Consumption --- p.18Chapter 2.6 --- HBM ESD Withstand Voltage --- p.19Chapter Chapter 3 --- ESD Protection Methodology for Low Noise Amplifier --- p.21Chapter 3.1 --- Dual-Diode Circuitry --- p.22Chapter 3.1.1 --- Working Principle --- p.22Chapter 3.1.2 --- Drawbacks --- p.24Chapter 3.2 --- Shunt-Inductor Method --- p.25Chapter 3.2.1 --- Working Principle --- p.25Chapter 3.2.2 --- Drawbacks --- p.27Chapter 3.3 --- Common-Gate Input Stage Method --- p.28Chapter 3.3.1 --- Built-in ESD Protecting Mechanism --- p.29Chapter 3.3.2 --- Competitiveness --- p.31Chapter Chapter 4 --- Design Theory of Low Noise Amplifier --- p.32Chapter 4.1 --- Small-Signal Modeling --- p.33Chapter 4.2 --- Method of Input Termination --- p.33Chapter 4.2.1 --- Resistive Termination --- p.34Chapter 4.2.2 --- Shunt-Series Feedback --- p.34Chapter 4.2.3 --- l/gm Termination --- p.35Chapter 4.2.4 --- Inductive Source Degeneration --- p.36Chapter 4.3 --- Method of Gain Enhancement --- p.38Chapter 4.3.1 --- Tuned Amplifier --- p.38Chapter 4.3.2 --- Multistage Amplifier --- p.40Chapter 4.4 --- Improvement of Reverse Isolation --- p.41Chapter 4.4.1 --- Common-Gate Amplifier --- p.41Chapter 4.4.2 --- Cascoded Amplifier --- p.42Chapter Chapter 5 --- Noise Analysis of Low Noise Amplifier --- p.44Chapter 5.1 --- Noise Sources of MOS Transistor --- p.44Chapter 5.2 --- Noise Calculation using Noisy Two-Port Network --- p.46Chapter 5.3 --- Noise Calculation using Small-Signal Model --- p.49Chapter 5.3.1 --- Low Noise Amplifier with Inductive Source Degeneration --- p.49Chapter 5.3.2 --- Common-Gate Low Noise Amplifier --- p.52Chapter Chapter 6 --- Design of an ESD-protected CMOS Low Noise Amplifier --- p.54Chapter 6.1 --- Design of DC Biasing Circuitry --- p.55Chapter 6.2 --- Design of Two-Stage Architecture --- p.57Chapter 8.3.1 --- Design of Common-Gate Input Stage --- p.57Chapter 8.3.2 --- Design of Second-Stage Amplifier --- p.59Chapter 6.3 --- Stability Consideration --- p.61Chapter 6.4 --- Design of Matching Networks --- p.62Chapter 6.4.1 --- Design of Inter-Stage Matching Network --- p.64Chapter 6.4.2 --- Design of Input and Output Matching Networks --- p.67Chapter Chapter 7 --- Layout Considerations --- p.70Chapter 7.1 --- MOS Transistor --- p.70Chapter 7.2 --- Capacitor --- p.72Chapter 7.3 --- Spiral Inductor --- p.74Chapter 7.4 --- Layout of the Proposed Low Noise Amplifier --- p.76Chapter 7.5 --- Layout of the Common-Source Low Noise Amplifier --- p.79Chapter 7.6 --- Comparison between Schematic and Post-Layout Simulation Results --- p.81Chapter Chapter 8 --- Measurement Results --- p.82Chapter 8.1 --- Experimental Setup --- p.82Chapter 8.1.1 --- Testing Circuit Board --- p.83Chapter 8.1.2 --- Experimental Setup for s-parameter --- p.84Chapter 8.1.3 --- Experimental Setup for Noise Figure --- p.84Chapter 8.1.4 --- Experimental Setup for 1-dB Compression Point --- p.85Chapter 8.1.5 --- Experimental Setup for Third-Order Intercept Point --- p.86Chapter 8.1.6 --- Setup for HBM ESD Test --- p.87Chapter 8.2 --- Measurement Results of the Proposed Low Noise Amplifier --- p.89Chapter 8.2.1 --- S-parameter Measurement --- p.90Chapter 8.2.2 --- Noise Figure Measurement --- p.91Chapter 8.2.3 --- Measurement of 1-dB Compression Point --- p.92Chapter 8.2.4 --- Measurement of Third-Order Intercept Point --- p.93Chapter 8.2.5 --- HBM ESD Test --- p.94Chapter 8.2.6 --- Summary of Measurement Results --- p.95Chapter 8.3 --- Measurement Results of the Common-Source Low Noise Amplifier --- p.96Chapter 8.3.1 --- s-parameter Measurement --- p.97Chapter 8.3.2 --- Noise Figure Measurement --- p.98Chapter 8.3.3 --- Measurement of 1-dB Compression Point --- p.99Chapter 8.3.4 --- Measurement of Third-Order Intercept Point --- p.100Chapter 8.3.5 --- HBM ESD Test --- p.101Chapter 8.3.6 --- Summary of Measurement Results --- p.102Chapter 8.4 --- Performance Comparison between Different Low Noise Amplifier Designs --- p.103Chapter Chapter 9 --- Conclusion and Future Work --- p.105Chapter 9.1 --- Conclusion --- p.105Chapter 9.2 --- Future Work --- p.106References --- p.107Author's Publications --- p.11

22-32 GHz Low-Noise Amplifier Design in 22-nm CMOS-SOI Technology

This thesis explores the use of a 22-nm CMOS-SOI technology in the design of a two-stage amplifier which targets wide bandwidth, low noise and modest linearity in the 28 GHz band. A design methodology with a transformer-coupled, noise-matching interstage is presented for minimizing the noise factor of the two-stage amplifier. Furthermore, benefits of interstage noise matching are discussed. Next, a transistor layout for minimizing noise and maintaining sufficient electromigration reliability is described. It is followed by an analysis of transformer configurations and a transformer layout example is depicted. To verify the design methodology, two amplifier prototypes with noise-matching interstage were fabricated. Measurement shows that the first design achieves a peak gain of 20.7 dB and better-than-10-dB input and output return losses within a frequency range of 22.5 to 32.2 GHz. The lowest noise figure of 1.81 dB is achieved within the frequency range. Input IP3 of -13.4 dBm is achieved with the cost of 17.3 mW DC power consumption. When the bias at the back-gate is lowered from 2 V to 0.62 V, the power consumption is decreased to 5.6 mW and the peak gain drops down to 17.9 dB. Minimum noise figure increases from 1.81 to 2.13 dB and input IP3 drops to -14.4 dBm. The folded output stage in the second design improves the input IP3 to -6.7 dBm at the cost of 35 mW total power consumption. The peak gain of the second design is 20.1 dB, and the lowest noise figure of 1.73 dB within a frequency range of 23.8 to 32.4 GHz. Both designs occupy about 0.05 mm2 active area

ANALYSIS AND DESIGN OF SILICON-BASED MILLIMETER-WAVE AMPLIFIERS

Ph.DDOCTOR OF PHILOSOPH

Innovative Concepts for the Electronic Interface of Massively Parallel MRI Phased Imaging Arrays

In Magnetic Resonance Imaging (MRI), the concept of parallel imaging shows significant enhancements in boosting the signal-to-noise ratio, reducing the imaging time, and enlarging the imaging field of view. However, this concept necessitates increased size, cost, and complexity of the MR system. This thesis introduces an innovative solution for the electronics of the MRI system that allows parallel imaging with massive number of channels while avoiding, at the same time, the associated drawback